Patents Examined by Jeffrey T Carley
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Patent number: 12193612Abstract: An apparatus and a method relate to forming a filled roll, a sushi roll with a nori seaweed wrap, for example. An issue arises in quickly and easily forming the filled roll at a place of convenience at home, for example. The present disclosure addresses the issue by providing the apparatus with two horizontal rods, front and back rods, the back rod positioned higher than the front rod. The rods are wrapped and connected by a continuous mat that grips without adhering to the rods and the filling. The back rod is positioned higher than the front rod. The continuous mat forms a longitudinal pocket between the two rods to receive filling. Rotating one of the two rods in one direction causes the filling to roll and forms a roll. The filled roll arises from the longitudinal pocket for removal while rotating the rods in another direction.Type: GrantFiled: March 3, 2021Date of Patent: January 14, 2025Inventors: Deborah A. Campbell, Ian L. Campbell
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Patent number: 12191838Abstract: Methods of fabricating resonator and filter devices. A first conductor pattern formed on a front surface of a piezoelectric plate includes a first plurality of contact pads and an interdigital transducer (IDT). The IDT and the piezoelectric plate are configured such that a radio frequency signal applied to the IDT excites a shear primary acoustic mode within the piezoelectric plate. An acoustic Bragg reflector is between a substrate and a back surface of the piezoelectric plate, the acoustic Bragg reflector configured to reflect the shear primary acoustic mode. A second conductor pattern including a second plurality of contact pads is formed on a back surface of the interposer. The first plurality of contact pads is directly connected to respective contact pads of the second plurality of contact pads. A perimeter of the acoustic resonator chip is sealed to a perimeter of the interposer.Type: GrantFiled: November 7, 2021Date of Patent: January 7, 2025Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Ventsislav Yantchev, Bryant Garcia, Viktor Plesski, Soumya Yandrapalli, Robert B. Hammond, Patrick Turner, Jesson John
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Patent number: 12186791Abstract: Shear-assisted extrusion processes for forming extrusions of a desired composition from a feedstock material are provided. The processes can include applying a rotational shearing force and an axial extrusion to the same location on the feedstock material. Devices for this can include a die tool defined by a die face extending from a rim of the die face inwardly at an angle greater than zero in relation to a sidewall of the die tool in at least one cross section; and/or a die tool defining an opening configured to receive feedstock material for extrusion and further defining a die face defining a recess within the die face and contiguous with the opening. Shear-assisted extrusion processes are also provided that can mix different portions of the feedstock material within a recess about the opening prior to feedstock material entering the opening; and extruding the mixed portions.Type: GrantFiled: September 27, 2020Date of Patent: January 7, 2025Assignee: Battelle Memorial InstituteInventors: Scott A. Whalen, Darrell R. Herling, Xiao Li, MD. Reza-E-Rabby, Brandon Scott Taysom, Glenn J. Grant
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Patent number: 12191837Abstract: Resonator and filter devices and methods of fabrication. A resonator chip includes a substrate, a piezoelectric plate, and an acoustic Bragg reflector between the substrate and a back surface of the piezoelectric plate. A conductor pattern on a front surface of the piezoelectric plate includes a first plurality of contact pads and an interdigital transducer (IDT). The IDT and the piezoelectric plate are configured such that a radio frequency signal applied to the IDT excites a shear primary acoustic mode within the piezoelectric plate. The acoustic Bragg reflector is configured to reflect the shear primary acoustic mode. An interposer has a second plurality of contact pads on a back surface. A seal connects a perimeter of the piezoelectric plate to a perimeter of the interposer. Each contact pad of the first plurality of contact pads is directly connected to a respective contact pad of the second plurality of contact pads.Type: GrantFiled: November 7, 2021Date of Patent: January 7, 2025Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Ventsislav Yantchev, Bryant Garcia, Viktor Plesski, Soumya Yandrapalli, Robert B. Hammond, Patrick Turner, Jesson John
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Patent number: 12184132Abstract: Various embodiments include a method for manufacturing a magnetic sheet comprising: positioning a nonmagnetic sheet with recessed regions; filling the recessed regions with a soft-magnetic material using additive manufacturing; and fixing the soft-magnetic material to the sheet in a material-bonded manner.Type: GrantFiled: March 19, 2020Date of Patent: December 31, 2024Assignee: SIEMENS AKTIENGESELLSCHAFTInventors: Carsten Schuh, Rolf Vollmer
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Patent number: 12184133Abstract: A device for adhering magnetic pole shoes on a rotor includes a soleplate, wherein a support seat is arranged on the soleplate; a magnet positioning seat is arranged above the support seat; the magnet positioning seat has a support frame, which includes an upper plate and a lower plate, with the lower plate having a first evading groove for evading a rotor core, and the upper plate having a second evading groove for evading an upper end of a rotor shaft; and fixation units and a plurality of positioning plates being provided between the upper and lower plates, each fixation unit including a push rod in sliding fit with the support frame and the push rod can move axially, a magnet positioning block being fixed at an inner end of the push rod, each positioning plate being located between two adjacent fixation units.Type: GrantFiled: May 8, 2020Date of Patent: December 31, 2024Assignee: HENGDIAN GROUP INNUOVO ELECTRIC CO., LTD.Inventors: Kedi Shan, Junjian Lu, Caiping Xu, Chenhui Jin
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Patent number: 12184134Abstract: In an embodiment a method includes cutting a material coil by a predetermined length, forming a vertex and inclined portions on the material coil, loading the vertex and the inclined portion so as to be interposed between an upper mold and a lower mold, forming the vertex into a front/rear bent portion so that the inclined portions are positioned on different lines based on the vertex by combining the upper and lower molds, loading ends of the inclined portions so as to be interposed between clamping pins and rotating a clamping part so that the inclined portions are rounded in front and rear directions.Type: GrantFiled: September 23, 2022Date of Patent: December 31, 2024Assignees: Hyundai Motor Company, Kia Motors CorporationInventor: Seungkyu Jang
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Patent number: 12183504Abstract: A method and a device for connecting sheet metal parts to form lamination stacks, wherein a sheet metal strip whose top and/or bottom surface has a hardenable polymer adhesive layer is transported continuously through an application device in which a fluid that contains an activator is applied to the adhesive layer, the applied fluid is dried, the sheet metal strip that is coated with the dried activator is continuously fed to a strip accumulator, the sheet metal strip from the strip accumulator is fed to a cyclically operating cutting device in which sheet metal parts are cut from the sheet metal strip and stacked on one another, and the cut and stacked sheet metal parts are connected to one another to form lamination stacks by means of the adhesive layers that are coated with the activator. The invention also relates to the lamination stacks produced according to the method.Type: GrantFiled: September 10, 2019Date of Patent: December 31, 2024Assignee: voestalpine Automotive Components Dettingen GmbH & Co. KGInventors: Heinrich Bursy, Jochen Lanksweirt, Axel Rainer Nann
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Patent number: 12184048Abstract: A method of manufacturing a plurality of conductor elements includes providing the plurality of conductor elements, each conductor element includes a conductor end section having an electrically insulating surface coating; securing the conductor end sections of the conductor elements with respect to each other; and simultaneously removing at least a portion of the electrically insulating surface coatings of the conductor end sections using a machining surface of a stripping tool being moved along the conductor end sections.Type: GrantFiled: September 1, 2021Date of Patent: December 31, 2024Assignee: Ford Global Technologies, LLCInventors: Thomas Baranowski, Julius Maximilian Engelke, Maira Magnani, Maik Broda, Raphael Koch, Marcel Mathissen
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Patent number: 12170165Abstract: Electrical/magnetic components and methods of making such components are provided. One method includes providing a multilayer printed circuit board (PCB) including conductive features arranged on conductive layers of the PCB to form one or more windings around one or more predetermined axes. The method further includes forming a hole in the PCB at each of the one or more predetermined axes to accommodate one or more core legs. For each hole, an inner edge of one of the windings overlaps an edge of the hole in a lateral direction after the hole is formed. The method further includes assembling a magnetically permeable core including the one or more core legs, each core leg extending into one of the holes at the one or more predetermined axes.Type: GrantFiled: January 3, 2023Date of Patent: December 17, 2024Assignee: Vicor CorporationInventor: Patrizio Vinciarelli
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Patent number: 12170466Abstract: Systems and methods to form concentrated motor windings may include bending wires into a U-shape, inserting the wires onto a stator pole, bending ends of the wires around the stator pole, and welding respective pairs of the ends of the bent wires. In some example embodiments, the U-shape may include a twist along a central portion thereof. In other example embodiments, a twist may be introduced along the respective pairs of bent ends of the wires that are then welded. In addition, the wires may be stacked and laterally inserted onto the stator pole. Further, the wire bending, twisting, insertion, welding, and other forming processes may be performed by automated or robotic machinery or equipment.Type: GrantFiled: June 7, 2022Date of Patent: December 17, 2024Assignee: Amazon Technologies, Inc.Inventors: Tausif Husain, Rick Roller, Sung Ho An
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Patent number: 12167694Abstract: A method for transferring a piezoelectric layer onto a support substrate comprises: —providing a donor substrate including a heterostructure comprising a piezoelectric substrate bonded to a handling substrate, and a polymerized adhesive layer at the interface between the piezoelectric substrate and the handling substrate, —forming a weakened zone in the piezoelectric substrate, so as to delimit the piezoelectric layer to be transferred, —providing the support substrate, —forming a dielectric layer on a main face of the support substrate and/or of the piezoelectric substrate, —bonding the donor substrate to the support substrate, the dielectric layer being at the bonding interface, and—fracturing and separating the donor substrate along the weakened zone at a temperature below or equal to 300° C.Type: GrantFiled: March 21, 2019Date of Patent: December 10, 2024Assignee: SOITECInventors: Djamel Belhachemi, Thierry Barge
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Patent number: 12165890Abstract: Provided is a dispenser for a solution including a reservoir configured to hold a suspension of micro light-emitting diodes (LEDs) suspended in a solvent; a stirrer configured to stir the suspension in the reservoir; a discharge path including a first valve configured to control outflow of the suspension from the reservoir; a filling path including a second valve configured to control inflow of the suspension into the reservoir; a hydraulic path including a third valve configured to control a pressure inside the reservoir; and a washing path connected to the first valve and configured to input a washing fluid for washing the discharge path into the discharge path, wherein the first valve includes a multi-way valve configured to selectively connect the discharge path to one of the reservoir and the washing path.Type: GrantFiled: September 8, 2021Date of Patent: December 10, 2024Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Joonyong Park, Dongho Kim, Hyunjoon Kim, Seogwoo Hong, Kyungwook Hwang, Junsik Hwang
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Patent number: 12166467Abstract: The disclosed technology generally relates to packaging a quartz crystal, and more particularly to bonding a quartz crystal using sintering silver paste. In one aspect, a method of packaging a quartz crystal comprises attaching a quartz crystal to a package substrate using one or more silver paste layers comprising silver particles. The method additionally comprises sintering the silver paste in a substantially oxygen-free atmosphere and at a sintering temperature sufficient to cause sintering of the silver particles. The sintering is such that the quartz crystal exhibits a positive drift in resonance frequency of the quartz crystal over time. The method further comprises hermetically sealing the quartz crystal in the package substrate.Type: GrantFiled: July 16, 2021Date of Patent: December 10, 2024Assignee: Statek CorporationInventors: Yue Fang, Thomas Pham
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Patent number: 12166195Abstract: A method reduces internal resistance of a battery (204, 300). In the method, a charging current is directed to a battery (204, 300), where the charging current includes spin-polarized and charged electrons. A dedicated spin generator (203) is capable of providing the charging current including spin-polarized and charged electrons. Next, the battery (204, 300) has been manufactured so that the battery includes either ferroelectric or pyroelectric material at least either in an anode (305), in a cathode (302), or in an other element of the battery (204, 300). The material can be selected to be polyvinylidene fluoride (“PVDF”) or modified materials thereof. After at least one cycle of charging of the battery (204, 300), the battery (204, 300) with reduced internal resistance is obtained.Type: GrantFiled: July 10, 2020Date of Patent: December 10, 2024Assignee: QID OYInventors: Pekka Tapani Saastamoinen, Reijo Lappalainen, Petteri Koljonen
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Patent number: 12167539Abstract: There is provided a tape feeder for supplying, using a taped electric component including a carrier tape and multiple electric components held onto the carrier tape, the electric component in a supply position, the tape feeder including a detection sensor configured to detect presence or absence of the electric component in the supply position.Type: GrantFiled: August 6, 2019Date of Patent: December 10, 2024Assignee: FUJI CORPORATIONInventor: Hideki Hashimoto
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Patent number: 12161052Abstract: Solid-state devices including a layer of a superconductor material epitaxially grown on a crystalline high thermal conductivity substrate, the superconductor material being one of TiNx, ZrNx, HfNx, VNx, NbNx, TaNx, MoNx, WNx, or alloys thereof, and one or more layers of a semiconducting or insulating or metallic material epitaxially grown on the layer of superconductor material, the semiconducting or insulating material being one of a Group III N material or alloys thereof or a Group 4b N material or SiC or ScN or alloys thereof.Type: GrantFiled: March 6, 2019Date of Patent: December 3, 2024Assignees: Cornell University, Govmt. of U.S.—NavyInventors: Rusen Yan, Guru Bahadur Singh Khalsa, John Wright, H. Grace Xing, Debdeep Jena, D. Scott Katzer, Neeraj Nepal, Brian P. Downey, David J. Meyer
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Patent number: 12156344Abstract: A method of forming integrated power electronics packages by 3D-printing the PCB on and around power devices includes bonding a power device to a first surface of a cold plate and printing, using a 3D-printer, a circuit board on and around the power devices such that the circuit board includes one or more insulating portions and one or more conductive portions.Type: GrantFiled: July 9, 2021Date of Patent: November 26, 2024Assignee: TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC.Inventor: Feng Zhou
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Patent number: 12143085Abstract: A method for fabricating a film bulk acoustic resonator (FBAR) structure includes: sequentially forming a top electrode material layer, a piezoelectric layer, and a bottom electrode material layer on a substrate; patterning the bottom electrode material layer to form a bottom electrode; forming a sacrificial layer above the bottom electrode; bonding a bottom cap wafer onto the sacrificial layer; removing the substrate; patterning the top electrode material layer to form a top electrode; and removing a portion of the sacrificial layer to form a lower cavity.Type: GrantFiled: October 19, 2021Date of Patent: November 12, 2024Assignee: Shenzhen Newsonic Technologies Co., Ltd.Inventor: Jian Wang
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Patent number: 12144119Abstract: A parts replenishment system configured to replenish a parts supply device attached to a parts mounting device with parts includes an instruction device configured to issue an instruction to unload the parts from a storage. The parts replenishment system further includes a presentation device configured to present preprocessing identification information for identifying preprocessing, which is processing on a packaging material for the parts for which an unloading instruction has been issued by the instruction device before replenishment of the parts supply device with the parts.Type: GrantFiled: November 20, 2018Date of Patent: November 12, 2024Assignee: YAMAHA HATSUDOKI KABUSHIKI KAISHAInventor: Yukinari Awano