Abstract: Enclosure covers for mobile computing devices are often formed from planar sections of sheet metal that form opposing outer-most layers thereof. The enclosure covers generally enclose and protect internal components. Enclosure covers for mobile computing devices are typically made from planar extrusions of aluminum with subsequent computer numerical control (CNC) machining and other processing steps to achieve complex shapes. Machining can be particularly wasteful of material and numerous processing steps are time-consuming and costly. The presently disclosed variable thickness enclosure covers sourced from extruded sheets of variable thickness reduce or eliminate machining and other processing steps typically required to achieve a desired complex shape. This is accomplished by extruding a shape closer to the desired shape of the variable thickness enclosure cover than presently known.

Abstract: An acoustic resonator is fabricated by etching a recess in a silicon thermal oxide (TOX) upper layer of a silicon substrate and filling the recess with sacrificial polysilicon. A surface of the silicon TOX layer and the sacrificial polysilicon-filled recess are planarized. A back surface of a single-crystal piezoelectric plate is bonded to the planarized surface of the silicon TOX layer. Openings are formed through the piezoelectric plate and an interdigital transducer (IDT) is formed on a front surface of the piezoelectric plate such that interleaved fingers of the IDT are disposed over the sacrificial polysilicon-filled recess. The sacrificial polysilicon is removed from the recess to form a cavity such that a portion of the piezoelectric plate forms a diaphragm spanning the cavity and the interleaved fingers of the IDT are disposed on the diaphragm.

Abstract: [Problem to be Solved] An adhesive agent is accurately applied on an adhesive agent applying surface. [Solution] Provided are guiding members (100) that guide the conveyance of a sheet steel strip (F) along an intermittent conveyance direction of the sheet steel strip (F) and limit the upward movement of the sheet steel strip (F), and an adhesive agent applying apparatus (50) that applies an adhesive agent to an adhesive agent applying surface at a section corresponding to an iron core lamina (A, W).

Abstract: This application provides a monolithic integrated BAW resonator production method, including: preparing an imprint template; forming a mask material layer on a substrate; pressing the mask material layer by using the imprint template in a direction of the substrate, to form a mask groove; performing plasma etching on the substrate by using the mask material layer, as a mask, that is used to form the mask groove, to form, on the substrate, grooves that one-to-one correspond to positions of several mask grooves; and forming, in the several grooves, bottom electrode layers, piezoelectric layers, and top electrode layers that are sequentially stacked, to form resonators of different frequencies.

Abstract: An elongate, three dimensional, conductive, micro lattice truss structure has parallel layers of resilient strands so that the truss structure maintains structural integrity during end-to-end compression which shortens its uncompressed length. The resiliency of the micro lattice truss structure enables the truss structure to return to substantially its uncompressed length when the compression is removed. The truss structure is adapted to provide a resilient electrical connection between two opposing conductive areas on parallel spaced-apart printed circuit boards when the distal ends of the truss structure engage and are compressed between the two areas.

Abstract: The present disclosure provides a packaging method and packaging structure of an FBAR. A second cavity in a resonator cover provided includes a groove in a second substrate and a space surrounded by an elastic bonding material layer. The elastic bonding material layer bonds the resonator cover to a resonant cavity main structure, and elasticity of the elastic bonding material layer is removed after the bonding. Through holes and a conductive interconnection layer on inner surfaces of the through holes are formed on the resonator cover. Since the second cavity includes the groove in the second substrate and the space surrounded by the elastic bonding material layer, which can avoid problems that performance of the elastic bonding material layer is unstable with temperature and humidity changes when the second cavity is entirely surrounded by the elastic bonding material layer, that is, the stability of the resonator is improved.

Abstract: A method of forming a filter device has a bonding layer formed on a substrate having at least a location for a first cavity and a location for a second cavity on a single die. A piezoelectric plate is bonded to the bonding layer and spans the first and the second cavity. Excess portions of piezoelectric plate are removed that extend a certain length past the perimeter of the first cavity and of the second cavity. Excess portions may be piezoelectric material that extends in the length and width direction past the perimeter of a cavity by more than between 2 and 25 percent of the cavity perimeter. An interdigital transducer (IDT) is on a front surface of the piezoelectric plate and having interleaved fingers over the first cavity.

Abstract: A filter device has a first piezoelectric plate spanning a first and second cavity of a substrate. A first and second interdigital transducer (IDT) are on a front surface of the first piezoelectric plate over the first and second cavity. A dielectric layer is bonded to the first piezoelectric plate and covers the first IDT and second IDT. A second piezoelectric plate is bonded to a front surface of the dielectric layer over the first cavity and the second cavity. A second dielectric layer is formed on a front surface of the second piezoelectric plate over the first cavity but not over the second cavity. The thickness of the dielectric layer, the first piezoelectric plate and the second piezoelectric plate can be selected to tune a shunt resonator over the first cavity and a series resonator over the second cavity to function at 15 GHz.

Abstract: The present invention relates to an electrical device including a printed circuit board (PCB) module accommodated in a case, and more particularly, to an electrical device having a heat dissipation structure using a filler that reduces heat generation outside a case while increasing a heat dissipation efficiency of a PCB module by using the filler filled in the case, and a manufacturing method of the same.

Abstract: A shield foil removing device includes an opening and closing chuck configured to accommodate two wire cores surrounded by a shield foil in a space having a rectangular cross section orthogonal to an electric wire longitudinal direction, which is formed by closing, in such a direction that a longitudinal direction of the rectangular space and an arrangement direction of the two wire cores in a cross section coincide with each other, compresses the shield foil in a direction orthogonal to an arrangement direction of the two wire cores by reducing the rectangular space by a closing operation, and brings the shield foil into close contact with outer peripheral surfaces of the two wire cores to secure a gap continuous in a longitudinal direction of the shielded electric wire between both of outer peripheral curved surfaces adjacent to each other of the two wire cores and the shield foil.

Abstract: A method for manufacturing in which alternating layers of a powdered magnetically susceptible material and a powdered insulating material are deposited onto a table as it is rotated about a first rotational axis.

Abstract: An acoustic resonator is fabricated by bonding a first piezoelectric plate to a substrate and spans locations for a first and second cavity in the substrate. A top surface of the first plate is planarized to a first thickness. A bonding layer is formed on the first piezoelectric plate and spans the first and second cavity locations. A second piezoelectric plate is bonded to the bonding layer and spans the first and second cavity locations. A top surface of the second plate is planarized to a second thickness. A portion of the second piezoelectric plate spanning the second cavity location is etched away to form a first membrane over the first cavity location and a second membrane over the second cavity location. Interdigital transducers are formed on the first and second membranes over the first and second cavity location to form a first and second resonator on the same die.

Abstract: The current disclosure describes carrier tape systems, which include a cover tape having adhesion areas and non-adhesion areas which are substantially free of adhesive. Methods for supplying semiconductor devices to an apparatus, which in operation, places the semiconductor devices at desired locations are also described. Methods of forming a semiconductor device carrier system are also described.

Abstract: A coil-forming apparatus for forming a bare coil wire into a U-shape, the apparatus including: one bare coil-wire holding unit that winds and holds a bare coil wire; a take-up drum that includes one or a plurality of housing units that house the bare coil wire supplied from the one bare coil wire holding unit at a circumference; a cutting member that cuts the bare coil wire housed in housing units and wound around the take-up drum, at a portion of the circumference of the take-up drum; a drawing member for drawing the bare coil wire outward in a radial direction of the take-up drum after being cut by the cutting member, from a position separated from the cutting member; and a forming unit that forms the bare coil wire drawn by the drawing member into a U-shape.

Abstract: A method of manufacturing an electronic component capable of preventing entrance of a plating solution and a flux component at an interface to which an inner electrode of a ceramic element body is extended, and capable of forming an outer electrode of an arbitrary shape. A ceramic element body is made of a ceramic material containing a metal oxide, and part of an inner electrode is extended to extended surfaces of the ceramic element body. A base electrode is formed on each of the extended surfaces using a conductive paste to be connected to the inner electrode. Part of another surface of the ceramic element body adjacent to the extended surfaces is locally heated, and part of the metal oxide is reduced to form a reformed portion. A plating electrode is continuously formed over the base electrode and the reformed portion through a plating method to form outer electrodes.

Abstract: A capacitor component includes a body including a dielectric layer and an internal electrode layer, and an external electrode disposed on the body and connected to the internal electrode layer. The dielectric layer includes dielectric grains, at least a portion of the dielectric grains has a core-shell structure, and a shell of the core-shell structure contains a rare earth element having an average concentration of more than 0.5 at %.

Abstract: A method for producing a piezoelectric stack actuator and a piezoelectric stack actuator are disclosed. To increase service life of a piezoelectric stack actuator made up of individual actuators, includes providing at least two actuators the method and designed and configured to generate a deflection along an axis (A) when electrically activated; and coupling the at least two actuators to form the stack actuator such that deflections of the actuators generated when the actuators are electrically activated are overlaid along a stacking axis (S) and there is a force-coupling of the actuators over at least one coupling area (K) that is smaller than a projection area (P) of the actuator onto a plane (E) perpendicular to the stacking axis.

Abstract: A surface acoustic wave device is disclosed. The surface acoustic wave device can include a single crystal support layer, an intermediate single crystal layer positioned over the single crystal support layer, a lithium based piezoelectric layer positioned over the intermediate single crystal layer, and an interdigital transducer electrode positioned over the lithium based piezoelectric layer, the surface acoustic wave device configured to generate a surface acoustic wave. The single crystal layer can be a quartz layer, such as a z-propagation quartz layer. A thermal conductivity of the single crystal support layer is greater than a thermal conductivity of the intermediate single crystal layer, and the thermal conductivity of the single crystal support layer is greater than a thermal conductivity of the lithium based piezoelectric layer.

Abstract: An oscillator frequency modulation method includes: providing a piezoelectric material having a surface and an interior; and performing a pattern process on the piezoelectric material by a laser. A patterned processing zone is formed on the surface and/or in the interior of the piezoelectric material. The pattern process may be a material removal and/or a material modification. Therefore, without changing the appearance of the piezoelectric material, the pattern process on the piezoelectric material through the laser can accurately adjust the frequency of the oscillator and block unnecessary mode at the same time. An oscillator piezoelectric structure with frequency modulation is also provided.

Abstract: An example method for connectorizing a superconducting cable is described herein. The method can include depositing an oxide layer on a surface of a superconducting cable using a first electrolytic cell, electroplating a metal layer on the surface of the oxide layer of the superconducting cable using a second electrolytic cell, and soldering a connector to the metal layer coated on the surface of the superconducting cable. The oxide layer allows the metal layer to adhere to the surface of the superconducting cable.