Abstract: A laminated glass unit having at least two sheets of glass separated and bonded by a polymeric interlayer material, and further having multi-layer thin film coatings on each of the unbonded surfaces of the at least two glass sheets, is disclosed. Two or more of such laminated glass units can be utilized in various configurations to form an insulated glass unit. The thin films deposited on the unbonded glass surfaces have anti-reflective, iridescence-suppressing and solar control properties when suitable configurations, materials and layer thicknesses are chosen. The laminated glass unit and insulated glass units of the invention exhibit an excellent combination of low visible light reflectance and thermal insulating properties.

Abstract: A coating composition comprising an aqueous mixture containing acid-stable particles and one or more fluoroacids. The amount of the acid-stable particles in the coating composition is from 0.005% to 8% by weight on a dry weight basis. The acid-stable particles can be selected from aluminum-modified silica particles, nonaluminum-modified silica particles, and organic particles selected from anionically stabilized polymer dispersion particles. The invention is also directed to a coating on a metal substrate. The coating contains acid-stable particles attached to the metal substrate through a metal-oxide matrix. The metal-oxide matrix comprises a metal selected from titanium, zirconium, silicon, hafnium, boron, aluminum, germanium, or tin.

Abstract: A pore-free weld connection and a method for manufacturing such a weld connection between first, second and third components (1, 3, 5, 13, 15, 17), which are connected together by means of a closed weld seam (7, 18), and of which one component (5, 17) has, at a start- and end-point (9, 11, 21, 23) of the weld seam (7, 18), a cavity (6, 19) serving for a root-side degassing of a weld puddle.

Abstract: A semiconductor manufacturing apparatus includes a processing chamber for performing a manufacturing processing on a wafer. A gas supply line for introducing a purge gas is connected to an upper portion of the processing chamber, a valve being installed on the gas supply line. A rough pumping line with a valve a is connected to a lower portion of the processing chamber. Installed on the rough pumping line are a dry pump for exhausting a gas in the processing chamber and a particle monitoring unit for monitoring particles between the valve a and the dry pump. In the semiconductor manufacturing apparatus, after the valve is opened, the purge gas is supplied to apply physical vibration due to shock wave in the processing chamber 100 so that deposits are detached therefrom to be monitored as particles.

Abstract: A casing for a writing instrument comprises an outer shaft, an inner shaft, and a nib. The outer shaft is formed using dual injection molding. An outer surface of the outer shaft includes a raised hard part and a raised soft part. The inner shaft is formed of a thin-wall tube having an upper end and a lower end, the inner shaft being configured for insertion inside the outer shaft. The inner shaft further includes a fastener protruding on its upper end that engages an upper end of the outer shaft. The nib is configured to engage the lower end of the inner shaft to help secure the inner shaft within the outer shaft. The raised hard or soft parts on the outer surface of the outer shaft may include an oblique loop-shaped part, a strip-shaped part, and/or an arc-shaped part.

Abstract: A method for production of a metal oxide and/or metal hydroxide coated metal material comprises immersing a metal material or electrolyzing a conductive material in an aqueous treatment solution at pH 2-7 containing metal ion and fluorine ion in a 4-fold or more molar ratio with respect to the metal ion, and/or containing a complex ion comprising at least a metal and fluorine in a 4-fold or more molar ratio with respect to the metal, to form on the surface of the metal material a metal oxide and/or metal hydroxide coating containing the metal ion and/or the metal, as well as a metal oxide and/or metal hydroxide coated metal material having a metal oxide and/or metal hydroxide coating produced by the method.

Abstract: Disclosed is a diffusion plate and a method of manufacturing thereof and a backlight module including the diffusion plate. The diffusion plate comprises a substrate and a diffusion layer applied on the substrate. The diffusion layer comprises a polymer resin and polymer hollow microspheres, and the polymer hollow microspheres are uniformly dispersed in the polymer resin.

Abstract: The present invention relates to compositions and edible orally delivered products, such as confectioneries and chewing gum, which include taste potentiators to enhance the perception of active substances contained therein. More specifically, some embodiments provide potentiator compositions, which include at least one active substance and at least one taste potentiator. The active substance and/or taste potentiator may be encapsulated in some embodiments to modify the release rate of the composition upon consumption.

Abstract: The invention relates to an alloy, in particular for an anti-friction coating, comprising elements which form a matrix (2) and at least a soft phase (3) and/or a hard phase (5), which soft phase elements and/or hard phase elements form a solid solution or a bond with the matrix element. The soft phase (3) and/or hard phase (5) is dispersed in the matrix (2) and the solid solution or bond is formed only in the region of the phase boundary (4) of the matrix (2) with the soft phase (3) and/or with the hard phase (5).

Abstract: The present invention relates to a process for the preparation of a readily reconstitutable herbal beverage concentrate in powder form. The process in particular, describes the method of preparation of herbal beverage concentrate from rosemary using a set of unit operations and approved food grade additives. The invention describes a rosemary herbal beverage powder comprising encapsulated rosemary flavor 0.47-3.70%, rosemary extract 4.60-10.50%, sucrose 84.30-94.90%, organic acid 0.07-1.60%, and sodium benzoate 0.01-0.

Abstract: Disclosed is a welding wire for joining cast iron and stainless steel, having a composition of 0.03 wt % or less of C, 2.0˜3.0 wt % of Si, 12.0˜14.0 wt % of Mn, 7.0˜9.0 wt % of Cr, 45.0˜47.0 wt % of Ni, 0.5˜0.8 wt % of Nb, and 2.0˜3.0 wt % of Mo, with a balance of Fe. Using the welding wire, a weld zone which has no hot cracks and is sound and good can be obtained.

Abstract: A method for production of a component in a tool having a cavity-forming first and a second tool half comprises the following steps: a) insertion at least of two skins with angled-over end regions into the second tool half such that the angled-over end regions of the skins are situated adjacently with the same orientation and angling; b) rear-foaming or rear-spraying of the skins with a foam material or injection moulding material, c) after insertion of the skins, the end regions of the skins being pressed together in a foam-tight or spray-fight manner at least in regions by pressing at least on one side of the end regions which are situated one above the other against a wall which determines the form and position of the pressed-together end regions.

Abstract: An optical film according to the present invention comprises a transparent base, and an anti-reflection layer that is disposed on one main face of the transparent base. The anti-reflection layer includes a hard coating layer, and a low refractive index layer that is disposed on the hard coating layer in this order from the side of the transparent base. The hard coating layer is formed using a resin containing an ionizing radiation setting resin. The hard coating layer contains a conductive metal oxide in an amount of at least 5 wt % and at most 30 wt % with respect to the total weight of the hard coating layer. The hard coating layer is formed using a coating solution containing water in an amount of at least 0.05 wt % and at most 5.0 wt %.

Abstract: An object of the invention is to provide an iodine-containing hot melt pressure sensitive adhesive that can be melted and coated at a temperature not higher than 100° C., and that can retain stability of the iodine in the adhesive through all stages of making, storage and use thereof, without utilizing any harmful organic solvent, while utilizing the antimicrobial efficacy of iodine.

Abstract: Disclosed is a conductive material for a connecting part, including: a base material made up of a Cu strip; a Cu—Sn alloy covering layer having an average thickness of 0.2 to 3.0 ?m; and an Sn covering layer, the Cu—Sn alloy covering layer being provided between the base material and the Sn covering layer, wherein in a cross section perpendicular to the surface of the conductive material, the diameter [D1] of the minimum inscribed circle of the Sn covering layer is 0.2 ?m or less, the diameter [D2] of the maximum inscribed circle of the Sn covering layer is 1.2 to 20 ?m, the difference in elevation [y] between the outermost point of the material and the outermost point of the Cu—Sn alloy covering layer is 0.2 ?m or less, and a bright or semi-bright tin electroplating layer having an average thickness of 0.01 ?m or more in an approximately uniform thickness is formed on the outermost layer as part of the Sn covering layer.

Abstract: A composite plate comprising CNT bundles with high thermal conductivity is formed by the method comprising preparing a CNT growth substrate, depositing a CNT growth catalyst on the CNT growth substrate, preparing a wafer with etched through via arrays, placing the wafer with the etched through via arrays over the CNT growth substrate with the CNT growth catalyst, growing CNT bundles in the etched through via arrays on the wafer over the CNT growth substrate with the CNT growth catalyst in a CVD chamber to form a wafer matrix CNT composite structure; and removing the CNT growth substrate from the wafer matrix CNT composite structure. The formed composite plate comprising CNT bundles with high thermal conductivity has improved CTE silicon match, has a more effective thermal conductivity than a silicon matrix or Cu or Cu alloy substrate, and contains nanotubes that remain vertical.

Abstract: A gas turbine engine component and coating system including a superalloy substrate having a coating system disposed thereon. A bond coating may be applied to the substrate. An adherent layer of ceramic material forming a thermal barrier coating is present on the bond coat layer. A topcoat layer overlies the thermal barrier coating. The topcoat layer includes greater than about 20 wt % yttria.

Abstract: An improved structure for the construction of perpendicular recording media is disclosed. The structure includes a perpendicular recording layer with at least two oxide sublayers or a lower sublayer of a non-oxide. One structure includes an upper sublayer comprised of a Silicon-oxide, while a lower sublayer is comprised of a Tantalum-oxide. The structures provide for increased coercivity and corrosion resistance.

Abstract: A thermal spray coating is made of cermet and provided on the surface of a base. The value that is gained by further dividing the value, which is gained by dividing the coefficient of thermal expansion of the thermal spray coating by the thickness of the thermal spray coating (unit: ?m), by the coefficient of thermal expansion of the base is set to a value no less than 0.15×10?2. Accordingly, peeling and cracking of the thermal spray coating can be prevented from being caused by the difference in the coefficient of thermal expansion between the thermal spray coating and the base.

Abstract: A titanium oxide-based photocatalyst which can exhibit excellent photocatalytic properties in response to visible light while maintaining its inherent activity in response to ultraviolet light and which is suitable for mass production contains bismuth as a first additional metal component and at least one metal element selected from silicon, zirconium, aluminum, and hafnium as a second additional metal component in titanium oxide. The Bi/Ti atomic ratio is preferably at least 0.0001 and at most 1.0, the atomic ratio of the second additional metal to Ti is preferably at least 0.0001 and at most 0.8, and a portion of bismuth is preferably present in the form of lower valence (Bi2+ or Bi0). The presence of lower valence bismuth can be ascertained by XPS analysis.