Abstract: A method for manufacturing perforate, fibre-reinforced, composite material, comprising the steps of laying up reinforcing fibres and resin in a mould having needles, the mould including a stripper plate having perforations into which the needles pass when the mould is assembled; curing the resin; and withdrawing the composite from the mould along with the stripper plate.
Abstract: A process for preparing laminates of polyvinyl fluoride and at least one other fluoropolymer that are free from adhesive at the interface by dispersion coating a first film to form a second film and curing the second film at a temperature below the melting point of the first film.
Type:
Grant
Filed:
July 11, 1989
Date of Patent:
January 29, 1991
Assignee:
E. I. Du Pont de Nemours and Company
Inventors:
Chester G. Bragaw, Jr., Thomas P. Concannon, Robert F. Davis
Abstract: A method of producing glass fiber mat reinforced plastic panels having at least one smooth appearance surface in a set of two matched mold members having interior mold surfaces defining a mold cavity contained therein of which at least one interior surface is the mirror image of the appearance surface of the panel. The method includes the steps of placing at least one layer of glass fiber mat in a mold cavity, pouring a polymeric material into the cavity saturating the glass fiber mat, closing the two mold members together with at least one layer of a flexible sheeting material disposed over and adjacent to the interior mold surface opposing the interior mold surface producing the appearance surface of the panel, clamping the two mold members together, curing the polymeric material for a sufficient time into a hard plastic panel, and opening the matched mold members and demold a finished panel having at least one smooth appearance surface.
Abstract: The adhesion of plastic encapsulants to electrical leadframes containing substantial amounts of copper is improved by exposing the leadframes to an active oxygen ambient (e.g., 10-30% H.sub.2 O.sub.2) at temperatures below the leadframe annealing temperature (e.g., room temperature to 100.degree. C.) for a few minutes. There is no need to remove the native oxide. A preliminary degreasing step is desirable but not essential. The treatment strengthens any native oxide present on the leadframes without producing an oxide which is so thick as to interfere with subsequent bonding of electronic components or connecting wires to the leadframe. Delamination between the leadframe and the plastic encapsulant by temperture cycling from -65.degree. to 150.degree. C. is substantially reduced.
Abstract: Resin pieces having a fat color corresponding to fat meats are molded and placed in a female mold. Resin having a lean meat color is pured in the female mold, and solidified resin is taken out from the mold.