Abstract: Broadly, embodiments of the inventive concepts disclosed herein are directed to a PCB data board that allows for either a single configuration or to be deployed in conjunction with another configuration such as being able to control a radio and sending PLI (Positional Location Information) data. The PCB data board and associated code can accommodate multiple different configurations. The PCB data board may facilitate multiple radio connectivity, enhanced configuration utilities, and additional functions.

Abstract: A conductive bump electrode structure includes a substrate, an elastic circuit layer, at least two conductive bumps, and an insulating layer. The elastic circuit layer is mounted on the substrate, and includes at least one elastic circuit. The at least two conductive bumps are mounted on the elastic circuit layer, and are electrically connected to each other through the at least one elastic circuit. The insulating layer is mounted on the elastic circuit layer, and includes at least two holes. Since there is a gap between the conductive bumps, the conductive bump electrode structure is easy to be bent and fit body curves of various parts of a user. The elastic circuit can stretch or compress along with the user's movement due to its elasticity, thereby increasing suitability of the conductive bump electrode structure to the human body.

Abstract: A method of manufacturing a circuit board having waveguides including forming a waveguiding structure by injection molding. The waveguiding structure includes a plurality of waveguides arranged at intervals and at least one connecting portion connecting two adjacent waveguides. Each waveguide includes a waveguiding substrate and at least one protrusion on the waveguiding substrate. The connecting portion is removed to obtain at least two waveguides. A metal layer is formed to wrap the whole outer surface of each waveguide. A plurality of receiving grooves is formed to penetrate a wiring board. Each waveguide wrapped by the metal layer is embedded in one of the receiving grooves. The waveguides and the wiring board are fixed. A portion of the metal layer on a surface of each protrusion facing away from the waveguiding substrate is removed. A circuit board is also provided.

Abstract: A multilayer printed circuit having a control circuit including n vias that are connected in series between a first and a second electrical terminal so that an applied electric current passes at least partially through each one of the n vias. The control circuit includes track portions in each one of the layers, each one of the n vias connecting a track portion of one layer to a track portion of another layer. The control circuit includes a measurement device for measuring a potential difference across its terminals, storage for storing a threshold value and a comparator for comparing the potential difference with the threshold value so as to validate the printed circuit when the potential difference is lower than the threshold value.

Abstract: A low dielectric substrate for high-speed millimeter-wave communication includes a quartz glass cloth with a dielectric loss tangent of 0.0001 to 0.0015 and a dielectric constant of 3.0 to 3.8 at 10 GHz, and an organic resin with a dielectric loss tangent within 80% to 150% of the dielectric loss tangent of the quartz glass cloth at 10 GHz and a dielectric constant within 50% to 110% of the dielectric constant of the quartz glass cloth at 10 GHz. This provides a low dielectric substrate for high-speed millimeter-wave communication where the low dielectric substrate makes it possible to send signals that are stable and have excellent quality with no difference in propagation time between wirings even if the substrate has an uneven resin distribution and the quartz glass cloth above and below the wirings, and the difference in dielectric loss tangent between members has been reduced to lower transmission loss.

Abstract: An electrical contact assembly that uses an elastomer strip for each row of individual contacts. Each contact comprises a rigid bottom pin and a flexible top pin with a pair of arms which extend over and slide along sloped concave surfaces of the bottom contact. The elastomer strip is located between rows of the bottom and top pins. A bottom socket housing is provided with grooves which receive each elastomer strip. A row of top pins is then placed over each elastomer strip, and through ducts in the bottom socket housing. Bottom pins are then snapped into place in between the pair of arms.

Abstract: In an electronic device, a circuit board connects different systems or structures such that heat of a system with a relatively large amount of heat can be transferred to a position or a heat dissipation structure with a relatively small amount of heat, thereby mitigating local high temperatures in the electronic device and distributing heat more evenly throughout the electronic device.

Abstract: The casing of an electronic control device includes a casing-side contact surface in contact with the end of a printed-circuit board. A cover includes a cover-side contact surface holding the end of the printed-circuit board together with the casing-side contact surface by being in contact with the end of the printed-circuit board. In the printed-circuit board, a held portion held between the casing-side contact surface and the cover-side contact surface is provided with a through-hole via.

Abstract: A tensile electronic module and electronic device using the same are provided. The tensile electronic module includes two electrical components and a stretchable trace connected between the two electrical components. The stretchable trace includes two arcs and at least three circular segments. The circular segments are connected to each other and have at least two various central angles. Each of the arcs is configured at one end of the circular segments for respectively connecting with one of the electrical components. The tensile electronic module proposed in the invention achieves to reduce tensile stress of the stretchable trace in multiple directions and can be further applied to an electronic device which is stretchable or having a curved surface. Damages caused by stress accumulation when the stretchable trace is stretched in different directions are therefore avoided. Therefore, it is believed reliability and service life of the electronic device are greatly improved.

Abstract: A wiring board includes a substrate including a first surface and a second surface located on an opposite side to the first surface, where the substrate has stretchability, an interconnection wire located adjacent to the first surface of the substrate, and a stress relaxation layer located between the first surface of the substrate and the interconnection wire, where the stress relaxation layer has a modulus of elasticity lower than that of the substrate.

Abstract: An electronic device with self-recovering properties including a substrate including a polymer composite, a conductive pattern disposed on the substrate, and an electrode disposed on the conductive pattern is provided, and the polymer composite includes a composite of different first and second polymers, the first polymer includes a first functional group capable of forming a hydrogen bond between polymer chains, and the second polymer includes a second functional group capable of forming a hydrogen bond between polymer chains.

Abstract: A method for manufacturing a printed circuit board according to one embodiment of the present invention includes a step of forming a resist pattern, and a step of forming a conductive pattern by using the resist pattern. The resist pattern has an acute angle portion in which an outer edge of a resist is bent to form an acute angle in a plan view. In a corner portion of the acute angle portion, an outer-side outer edge of the resist is rounded, and a radius of curvature of the outer-side outer edge is more than or equal to a distance from the outer-side outer edge to another outer edge adjacent thereto in a direction away from a center of curvature of the outer-side outer edge.

Abstract: A circuit board may include a first signal via electrically coupled to multiple layers of the circuit board, a second signal via electrically coupled to multiple layers of the circuit board, and a pair of ground vias configured to provide electrical shielding between the first signal via and the second signal via, the pair of ground vias comprising a first ground via electrically coupled to a ground or power plane of the circuit board and a second ground via electrically coupled to the ground or power plane of the circuit board. The first signal via, the first ground via, and the second ground via may be arranged such that they form an angle of approximately 50 degrees having a vertex at the first signal via, a first ray extending from the first signal via through the first ground via and a second ray extending from the first signal via through the second ground via.

Abstract: A metal-clad laminate includes: an insulating layer; and a metal layer stacked on the insulating layer. The insulating layer includes: a first layer; and a second layer interposed between the first layer and the metal layer. The first layer contains a cured product of a first resin composition containing composite particles. The second layer contains a cured product of a second resin composition. The first resin composition contains composite particles, each having a core containing a fluororesin and a shell containing a silicon oxide that coats the core at least partially. The second resin composition may or may not contain composite particles. When the second resin composition contains the composite particles, a ratio of the composite particles in the second resin composition to solid content of the second resin composition is lower than a ratio of the composite particles in the first resin composition to solid content of the first resin composition.

Abstract: A wiring board includes an insulating layer, a wiring layer and a plurality of conductive columns. The insulating layer has a first surface and a second surface opposite to the first surface. The wiring layer is disposed in the insulating layer and has a third surface and a fourth surface opposite to the third surface. The insulating layer covers the third surface, and the second surface of the insulating layer is flush with the fourth surface of the wiring layer. The conductive columns are disposed in the insulating layer and connected to the wiring layer. The conductive columns extend from the third surface of the wiring layer to the first surface of the insulating layer, and protrude from the first surface.

Abstract: Provided is a long laminate for a printed wiring board, which has reduced thickness of a resin layer and increased signal transmission speed, and which, while being excellent in dimensional stability and folding endurance, has no wrinkles in a fluororesin layer. The long laminate contains a metal layer of a long metal foil, a fluororesin layer containing a fluororesin and contacting the metal layer, and a heat-resistant resin layer containing a heat-resistant resin and contacting the fluororesin layer. Each fluororesin layer is 1 to 10 ?m thick. The ratio of the total thickness of the fluororesin layer to the total thickness of the heat-resistant resin layer is 0.3 to 3.0. The sum of the total thickness of the fluororesin layer and the total thickness of the heat-resistant resin layer is at most 50 ?m. Also provided are a method for producing the long laminate, and the printed wiring board.

Abstract: The present disclosure relates to an electric circuit system. The system includes a housing, a printed circuit board mounted within the housing, an electric component conductively mounted to the printed circuit board, and a cooling system for transferring heat away from of the electric component. The printed circuit board is compartmentalizing the inside of the housing into a first compartment and a second compartment, and the electric component is situated in the first compartment. The cooling system includes at least one first heat transferring element located adjacent to the electric component. The at least one first heat transferring element is secured to the housing surrounding the second compartment capable of forming a heat flowing path defined to transfer heat from the electric component to the housing via the at least one first heat transferring element.

Abstract: In an exemplary embodiment, a passive component, which is a surface mounting component, includes: a substrate body having insulating property; an internal conductor built into the substrate body; and at least one external electrode provided on a planar mounting face of the substrate body and electrically connected to the internal conductor; wherein the external electrode has a face parallel with the planar mounting face of the substrate body, and a concaved part which is inwardly concaved relative to the parallel face toward the substrate body and is located, as viewed in a direction perpendicular to the parallel face, inside the parallel surface so as to be surrounded by the parallel surface.

Abstract: A stretchable conductive substrate includes a substrate and a circuit layer. The substrate has a plurality of predetermined areas. The circuit layer is formed on the substrate and defines a conductive contact group and at least one elastic wire structure connected to the conductive contact group in each of the predetermined areas. The at least one elastic wire structure has at least one patterned wire segment and a stretch rate thereof along a length direction of the substrate is from 0% to 60%.

Abstract: A system includes a printed circuit board (PCB). The PCB includes a radio frequency (RF) circuit that includes a plurality of circuit modules and signal trace lines. Each circuit module is electrically connected to at least one other circuit module by a signal trace line. The system includes a via fence comprising fence walls having at least two materials laminated using a printed wire board (PWB) process. The fence walls include a plurality of vias. The fence walls form a plurality of free-form RF isolation chambers, each chamber includes chamber walls that surround each circuit module outside of the PCB. The embodiments also include a method of manufacturing and/or isolating the system or components of the system.