Abstract: A structure, a method, and an electronic device for multi-coil handheld magnetic particle imaging (MPI) are provided. The structure for multi-coil handheld MPI includes a processing device, a control device, an imager, a gradient and scanning module, an excitation and correction module, and a detection module, where the gradient and scanning module includes a first circular coil pair and a second circular coil pair; the excitation and correction module includes a circular excitation and correction coil; and the detection module includes a circular detection coil. The structure for multi-coil handheld MPI focuses the imaging region in a specific part, improving the MPI accuracy, and features small volume, simple structure, and low power consumption.

Abstract: A display test apparatus includes a measuring apparatus and a calculating device connected to the measuring apparatus. The measuring apparatus provides a sample pixel value to a first display device including a first display panel, measures a first color coordinate value of an image displayed by the first display panel in response to the sample pixel value. The calculating device generates a first parameter of the first display panel in response to the first color coordinate value, generates a target color coordinate value in response to the sample pixel value, and generates a first mapping table in response to the first color coordinate value, the first parameter and the target color coordinate value.

Abstract: The present disclosure provides a semiconductor wafer. The semiconductor wafer includes: a scribe line between a first row of dies and a second row of dies; and a benchmark circuit disposed adjacent to the scribe line and electrically coupled to a first conductive contact and a second conductive contact. The benchmark circuit includes a first device-under-test (DUT); a second DUT; a first switching circuit configured to selectively couple the first DUT and the second DUT to the first conductive contact; and a second switching circuit configured to selectively couple the first DUT and the second DUT to the second conductive contact.

Abstract: A system for one-sided measuring a presence of magnetic particles in a probe volume comprises a one-sided coil assembly and a current controller, wherein the one-sided coil assembly is arranged around a central coil assembly axis for generating a rotating magnetic field distribution and comprises at least 3, preferably at least 4, circumferentially distributed coil assembly sectors, wherein the current controller is configured to generate a time varying current in each of said coil assembly sectors, said time varying current comprising a periodic modulation with a rotation frequency and phase shifted between adjacent coil assembly sectors to generate a magnetic field rotating in a plane perpendicular to the coil assembly axis, said magnetic field rotating with a rotation frequency associated with a frequency of said periodic modulation, and wherein the system is configured for measuring said presence of magnetic particles in said probe volume with said one-sided coil assembly.

Abstract: A dice testing method is provided. The dice testing method is used to determine which test data of test items can be explained by test data of other test items based on statistical analysis. After the test items with the test data that can be explained by the test data of the other test items are found out, corresponding dices will not be tested for those test items.

Abstract: A structure and method for the wafer level testing of interposer-based photonic integrated circuits is described that includes the formation of an upturned mirror structure and the method of utilizing the interposer-based mirror structure for electrical and optical testing of optoelectrical circuits that include emitting components such as lasers, detecting components such as photodetectors, and both emitting and detecting components. Electrical activation of the optoelectrical emitting or sending devices and the subsequent detection and measurement of the optical signals in detecting or receiving devices provides information on the operability or functionality of the PIC on the die at the wafer level, prior to die separation or singulation, using the electrical and optical components of the PIC circuit.

Abstract: An analysis device includes a vibration sensor that detects vibration of a machine, a calculation unit that calculates an average value of detection data of the vibration sensor in each predetermined cycle interval, converts a plurality of data points included in each interval to one data point indicating the average value to reduce calculation points, and performs vibration analysis with the reduced calculation points, and a wireless communication device that transmits processed data output from the vibration analysis performed by the calculation unit.

Abstract: A conduction inspection method for a multipole aberration corrector according to one aspect of the present invention includes applying, in a state where a predetermined potential has been applied to each shield electrode, an inspection charged particle beam to pass through a first opening, a second opening, and a third opening, using a multipole aberration corrector which includes an upper-stage substrate where the first opening is formed and a shield electrode is arranged around the first opening, a middle-stage substrate where the second opening is formed, a plurality of control electrodes are disposed to be opposite each other across the second opening, and a plurality of wirings are arranged to be individually connected to one of the plurality of control electrodes which are different from each other, and a lower-stage substrate where the third opening is formed and a shield electrode is arranged around the third opening, and which corrects aberration of a correction charged particle beam passing through

Abstract: To easily detect a crack having occurred in a steel material. A current measurement device measures a value of a current flowing through a target steel material that is immersed in an electrolyte aqueous solution and applied with tensile stress while subjected to hydrogen charging, and a device for detecting the occurrence of a crack or the like uses the measured current value to determine the occurrence of a crack in the target steel material when the amount of change in the current flowing through the target steel material, the change rate of the amount of change in the current, or the change rate of the change rate of the amount of change in the current exceeds a threshold value.

Abstract: A method for human movement classification includes a plurality of radio frequency (RF) antennas to expose a body surface of a human user to an E-field, at least a part of the human user positioned within a near-field region relative to the RF antennas. The plurality of RF antennas are scanned to determine ground-relative changes in electrical conditions. A differential-scanning subset of RF antennas are selected, including two or more RF antennas for which the changes in electrical conditions exceed a threshold. For each RF antenna in the differential-scanning subset, a set of antenna-relative changes in electrical conditions are determined by comparing the RF antenna to one or more other RF antennas in the differential-scanning subset as a plurality of pairs. Based at least in part on the ground-relative changes in electrical conditions and the antenna-relative changes in electrical conditions, a movement performed by the human user is classified.

Abstract: A monitoring system for sensing electrical parameters including current and voltage can comprise a current transformer and an antenna. The current transformer can be configured to sense current passing through a conductor. The antenna can be configured to sense electrical potential of the conductor by sensing an electric field generated by the conductor. The antenna can sense the electrical potential independent of whether current is present in the conductor. The monitoring system can further comprise a temperature sensor configured to sense a temperature of the conductor. A sensing module can include a housing supporting the current transformer, the antenna, and the temperature sensor for monitoring an electrical power circuit.

Abstract: A handheld MPI system and method based on field free line (FFL) rotation is provided. The handheld MPI system includes: a gradient module configured to construct a gradient field with an FFL; a cooling module configured to cool the gradient module; an excitation module configured to excite magnetic particles in a region of the FFL; a detection module configured to receive an excitation response signal of the magnetic particles and counteract an excitation signal directly induced by a reception coil; a rotation module configured to control the gradient module and the cooling module to rotate around an axis of an excitation coil; a control and signal processing module configured to control each module to operate as needed, and process a received magnetic particle induction signal; and an image reconstruction module configured to reconstruct a magnetic particle distribution into a two-dimensional image.

Abstract: Systems and methods are provided for characterizing shuttle capture events in a nanopore sensor. The method first collects time-dependent current blockage signatures for at least one bias voltage. The method then identifies each signature as corresponding to a permanent or transient event. The method then generates a protein dynamics landscape (PDL) for the transient event signatures. The PDL comprises a set of histograms of nanopore current data and characterizes current through the nanopore during shuttle capture events. The method can then comprise identifying an entrance level blockage value based on the permanent event signatures. Permanent event captures can be determined by time duration which is larger than a certain threshold time value. Applying a voltage between the fluidic chambers above a threshold voltage level can be used to control that the vast majority of events are permanent.

Abstract: Systems and methods are provided for detecting water within an electronic power steering assembly. A sensor assembly includes a resistor and a water-sensitive capacitor arranged to provide a series resistor-capacitor (RC) network having a cut-off frequency that is a function of a capacitance of the water-sensitive capacitor. An oscillator provides an excitation to the series RC network having a known frequency, such that the series RC network provides an output in response to the excitation. An envelope detector receives the output of the series RC network and generates an output representing an amplitude of the output of the series RC network. A microcontroller determines if water is present within the electronic power steering assembly from the amplitude of the output of the series RC network.

Abstract: An electrical test device for testing electrical characteristics of a cable assembly with a plurality of cable connectors includes a frame having a test platform, and an electrical tester mounted on the frame for testing the electrical characteristics of the cable assembly. A cable connecting and holding mechanism is provided on the test platform and includes a plurality of connector carriers, wherein each connector carrier holds one of the plurality of cable connectors of the cable assembly and electrically connecting the one cable connector to the electrical tester.

Abstract: A method for the testing of optoelectronic chips which are arranged on a wafer and have electrical interfaces in the form of contact pads and optical interfaces which are arranged to be fixed relative thereto in the form of optical deflection elements, e.g., grating couplers, with a specific coupling angle. The wafer is adjusted in three adjustment steps with one of the chips relative to a contacting module such that the electrical interfaces of the chip and contacting module contact one another, and the optical interfaces of the chip and contacting module occupy a maximum position of the optical coupling.

Abstract: A semiconductor wafer evaluation apparatus brings a contact maker (mercury liquefied at room temperature), as a Schottky electrode, into contact with a semiconductor wafer, intermittently applies a voltage from a pulse power supply, and evaluates the state (kinds, density) of point defects by an evaluation means based on the status of the electrostatic capacity of the semiconductor wafer. In this manner, the state (kinds, density) of the point defects in the plane of a large-diameter semiconductor wafer is directly evaluated using a large table.

Abstract: A sensor system, particularly for monitoring the mixing of at least two fluids and a method for monitoring the mixture of at least two liquids. The present invention provides a sensor system for fluids, comprising at least two level sensor which are arranged vertically one upon the other on and connected to an electronic circuit board, four electrodes of four conductivity sensors which are arranged horizontally next to each other at the bottom of and connected to the electronic circuit board; and a temperature sensor which is connected to the electronic circuit board; a connector for connecting the electronic circuit board to a controller; wherein the electronic circuit board is embedded in a hot melt compound which is surrounded by an injection molded housing.

Abstract: In an optical carrier injection method, a pulsed optical beam having pulse duration of 900 fs or lower is applied on a backside of a substrate of an integrated circuit (IC) wafer or chip, and is focused at a focal point in an active layer on a frontside of the substrate. Photons of the optical beam are absorbed at the focal point by nonlinear optical interaction(s) to inject carriers. The pulsed optical beam may be applied using a fiber laser in which the fiber is doped with Yb and/or Er. An output signal may be measured, comprising an electrical signal or a light output signal produced by the IC wafer or chip in response to the injected carriers. By repeating the applying, focusing, and measuring over a grid of focal points in the active layer, an image of the IC wafer or chip may be generated.

Abstract: A fingerprint sensor package includes a first substrate including a core insulating layer; a first bonding pad on the core insulating layer; and an external connection pad between an edge of the second surface of the core insulating layer and the first bonding pad, a second substrate on the core insulating layer, the second substrate including: a plurality of first sensing patterns spaced apart in a first direction and extending in a second direction intersecting with the first direction; a plurality of second sensing patterns spaced apart from each other in the second direction and extending in the first direction; and a second bonding pad, a conductive wire connecting the first bonding pad to the second bonding pad; a controller chip on the second substrate; and a molding layer covering the second substrate and the first bonding pad and spaced apart from the external connection pad.