Abstract: A management device simultaneously clamps both the power cord and the vacuum tube of a floor preparation machine to appropriately direct the power cord and vacuum tube and protect from damage the power cord, vacuum tube cord plug and machine socket associated with the power cord and fitting associated with the vacuum tube.

Abstract: A storage shield for a disc of an angle grinder is provided according to the present invention. The storage shield includes a first shield member and a second shield member. Each of the first and second shield members includes a front face, an opposing rear face positioned parallel to and a distance apart from the front face, an end wall that joins an upper edge of the front face to an upper edge of the rear face, and a front face opening between a lower edge of the front face and a lower edge of the rear face, and an opening in a center area of the front face at the lower edge thereof. A pivot hinge assembly pivotally connects a first end of the first shield member to a first end of the second shield member. Fastening means for affixing the storage shield and stored angle grinder to a worksite surface are affixed to the rear face of one of the first shield member or second shield member. A method of protecting a disc of an angle grinder when not in use is also provided. First, the storage shield is opened.

Abstract: In an automatic wet sanding apparatus including a paper peeling unit that has a clamping shaft and a clamping hook, an inclination angle of a leading end surface of the clamping hook is equal to an inclination angle of an outer circumferential surface of a cushion pad at the start of a paper peeling step. Thus, the leading end surface of the clamping hook comes into contact with an outer circumferential end of a disc at the same time as coming into contact with the outer circumferential surface of the cushion pad, so that the cushion pad is less likely to get caught due to deformation of the outer circumferential surface and its peripheral part of the cushion pad. It is therefore possible to appropriately remove the sandpaper from the cushion pad and stably perform the task of removing the sandpaper.

Abstract: An automatic floor-disinfection robot for floors of hospital rooms, including a moving device, a alarm and a disinfection device. The moving device is a disc-shaped robot, and includes a chassis moving mechanism, a support plate and a top plate arranged successively from bottom to top. The disinfection device includes a disinfection assembly and a baffle. The disinfection assembly includes a liquid supply mechanism, a liquid spray mechanism and a fan.

Abstract: A sharpening apparatus includes a base having a top surface with a channel or mounting rail. A clamping assembly is configured to be secured to base via the rail or channel. When installed, the clamping assembly includes a pair of jaws extending upward from the top of the base in opposed alignment with distal ends of each jaw adjustably spaced to grip a cutting implement. A guide rod has an end configured to be pivotably mounted to the base via the rail or channel and so that the rod's position along the base is adjustable by sliding movement along the rail or channel.

Abstract: A grinding device is operated by grinding of a surface of the workpiece with at least one grinding medium while recording actual data of the surface after grinding with at least one data collection device. Actual data recorded during grinding is then compared with target data stored in an electronic memory in an electronic data processing device. Based on the comparison, adjustments are made to at least one grinding parameter if a deviation of the actual data from the target data exceeds a predetermined limit.

Abstract: A chemical-mechanical polishing method includes placing a wafer onto a top side of a polish pad disposed on a platen; introducing a slurry through at least one first hole of the platen to the top side of the polish pad; polishing the wafer with the top side of the polish pad; introducing a gas through a second hole of the platen to the top side of the polish pad after polishing the wafer, wherein an opening diameter of the at least one first hole is greater than an opening diameter of the second hole; and moving the wafer away from the polish pad while introducing the gas is being performed.

Abstract: A method of conditioning a polishing pad includes positioning a conditioning head to bring a conditioning pad into contact with a polishing surface of a polishing pad. The method further includes generating a first pressure signal using a first pressure sensor based on a force being applied to the polishing surface by the conditioning pad. The method further includes generating a surface condition signal using an optical scanner. The method further includes adjusting the positioning of the conditioning pad in response to at least one of the first pressure signal or the surface condition signal.

Abstract: A chemical mechanical planarization (CMP) tool includes a platen and a polishing pad attached to the platen, where a first surface of the polishing pad facing away from the platen includes a first polishing zone and a second polishing zone, where the first polishing zone is a circular region at a center of the first surface of the polishing pad, and the second polishing zone is an annular region around the first polishing zone, where the first polishing zone and the second polishing zone have different surface properties.

Abstract: Disclosed is a light transmitting member for a polishing pad. The light transmitting member has a cylindrical or truncated conical shape, and a screw thread is formed on a side portion thereof. A polishing pad includes such a light transmitting member and a substrate polishing apparatus includes such a polishing pad.

Abstract: There is provided a processing apparatus that polishes the back surface side of a wafer on which devices are formed on the front surface side. The processing apparatus includes a chuck table that holds the wafer and rotates and a polishing unit that forms scratches on the back surface side of the wafer while polishing the back surface side of the wafer. The processing apparatus includes also a scratch determining unit that determines whether or not the scratches exist on the back surface side of the wafer polished by the polishing unit and an informing unit that informs that a region in which the scratches do not exist is included in the wafer when a region for which it has been determined that the scratches do not exist by the scratch determining unit is included in the wafer.

Abstract: A sealing portion on a lower end of a cover portion of a spindle cover has an upper side surface and a lower side surface that are inclined toward an outer circumferential surface of a spindle. A larger-diameter disk and the outer circumferential surface of the spindle define therebetween a second gap that is narrower than a first gap defined between the spindle and the cover portion. The second gap is effective to prevent a processing waste liquid from entering between the spindle and the spindle cover to prevent a solid waste contained in the processing waste liquid from sticking to the spindle. The spindle is thus prevented from becoming less liable to rotate smoothly due to solid waste deposits.

Abstract: A method of polishing a target surface of a waveguide to achieve perpendicularity relative to a reference surface is disclosed. The method includes i) providing a polishing apparatus having a polishing plate with a flat surface defining a reference plane, and an adjustable mounting apparatus configured to hold the waveguide during polishing at a plurality of angular orientations; ii) positioning an optical alignment sensor and a light reflecting apparatus such that a first collimated light beam is reflected off of a surface parallel to the reference plane, and a second perpendicular collimated light beam is reflected off of the reference surface; iii) aligning the waveguide within the polishing apparatus such that the reflections received by the optical alignment sensor align within the optical alignment sensor, thereby being indicative of perpendicularity between the reference plane and the reference surface; and iv) polishing the target surface of the aligned waveguide.

Abstract: A shroud assembly fixed to an abrasive blasting nozzle provides acoustic dampening during operation of the blasting system to reduce damage to the hearing of the user. The shroud assembly additionally provides features that improve safety and reduce fatigue during use. A first embodiment includes an end closure made up of flat acoustic panels and an alternate embodiment includes an end opening having peripheral chevron shaped acoustic panel edges. The shroud assembly includes a mechanism for attachment of the shroud to the abrasive blasting nozzle, a cylindrical blast column positioned forward from and coaxial with the blast nozzle, a cylindrical cone shell with at least one layer of acoustic dampening material surrounding and coaxial with the cylindrical blast column, a dead man switch handle, a second extended handle, a peripheral air curtain generator at the forward opening, and nested layers of one or more types of acoustic material(s).

Abstract: The present disclosure discloses a wheel rim finishing device. A motor is fixedly mounted on a stand through a shaft sleeve I. A supporting body is arranged on the stand. The side, close to a locating disk, of the supporting body is provided with an outer roller. An inner driving roller body and an inner driven roller body are arranged at a position, close to the outer roller, on the inner side of the locating disk. The wheel rim finishing device is simple in structure and high in universality, and may adapt to wheel types with different rim structures.

Abstract: A chemical mechanical polishing system includes a platen to support a polishing pad, a carrier head to hold a substrate and bring a lower surface of the substrate into contact with the polishing pad, and an in-situ friction monitoring system including a friction sensor. The friction sensor includes a pad portion having a substrate contacting portion with an upper surface to contact the lower surface of the substrate, and a pair of capacitive sensors positioned below and on opposing sides of the substrate contacting portion.

Abstract: Disclosed is a lens holding block for positioning and retaining a lens substrate in a processing machine, including a bottom part that is able to immobilize the lens holding block in the processing machine and an upper part. The upper part includes a chamber wherein is housed and attached a porous article so as to receive the lens substrate to be processed and which is able to be impregnated with a fluid, and a method for positioning and retaining a lens substrate onto a lens holding block.

Abstract: The present disclosure relates to a cutting machine comprising a rotating cutting wheel for performing separating cuts in a workpiece, and also relates to a workpiece positioning device for such a cutting machine. The cutting machine comprises a cutting wheel and a drive motor for driving the cutting wheel, a clamping means for clamping the workpiece, means for mechanically positioning the workpiece along one or two translational directions and additionally about one or two rotation axes, and a lifting mechanism for setting the cutting wheel on the workpiece to perform separating cuts in the positioned workpiece using the cutting wheel.

Abstract: The present disclosure provides an adjustable device for removing burrs of a back cavity of a wheel. The adjustable device for removing the burrs of the back cavity of the wheel includes a frame provided with a rotary table inside, a support frame is fixedly connected to the rotary table, and a left rotary table and a right rotary table are arranged on the support frame. The device is ingenious in design, novel in conception, high in universality, short in cycle time and high in efficiency, and is suitable for removing burrs of wheels in different specifications.

Abstract: In an automatic polishing system configured such that under control of a polishing robot and/or a polishing tool by a polishing controller, the polishing tool provides a polishing action on a polishing subject face, a color intensity measurement instrument is provided for measuring an intensity of a specified color in the polishing subject face. Based on the intensity of the specified color measured by this color intensity measurement instrument, the polishing controller controls the polishing robot and/or the polishing tool, so that an amount of polishing work by the polishing tool onto the polishing subject face is adjusted according to the intensity of the specified color.