Patents Examined by John A. McPherson
  • Patent number: 11169439
    Abstract: Provided are a coloring composition capable of producing a film with suppressed occurrence of striation, and a method for producing a film. The coloring composition includes a coloring agent A, a resin B, a polymerizable compound C, a photopolymerization initiator D, and an organic solvent E, in which the organic solvent E includes an ester-based solvent E1 having a surface tension at 25° C. of from 25 mN/m to 35 mN/m, an organic solvent E2 having a surface tension at 25° C. of less than 25 mN/m, a ratio of a mass of the ester-based solvent E1 to the mass of the organic solvent E2 is 80:20 to 30:70 in terms of the ratio of the mass of the ester-based solvent E1:the mass of the organic solvent E2, and the organic solvent E contains 50% by mass or more of a combination of the ester-based solvent E1 and the organic solvent E2 with respect to the total mass of the organic solvent E.
    Type: Grant
    Filed: December 6, 2018
    Date of Patent: November 9, 2021
    Assignee: FUJIFILM Corporation
    Inventors: Hisamitsu Tomeba, Kaoru Aoyagi
  • Patent number: 11169417
    Abstract: The present application relates to a method for manufacturing of a multi-layer liquid crystal film and a multi-layer liquid crystal film. The present application provides the method for manufacturing of the multi-layer liquid crystal film capable of improving coatability of liquid crystals, orientation of liquid crystals and adhesive force between liquid crystal films, as well as realizing thinning of a liquid crystal film, and a multi-layer liquid crystal film manufactured by the above method.
    Type: Grant
    Filed: August 22, 2017
    Date of Patent: November 9, 2021
    Assignee: LG CHEM, LTD.
    Inventors: Young Jin Kim, Jun Won Chang, Dae Hee Lee
  • Patent number: 11163234
    Abstract: A negative-type photosensitive resin composition that has a satisfactory imidization rate and can yield a resin layer with high chemical resistance, even under low-temperature curing conditions of 200° C. or below, the negative-type photosensitive resin composition containing a photopolymerization initiator (B) in a proportion of 0.1 part by mass to 20 parts by mass with respect to 100 parts by mass of a polyimide precursor (A), the polyimide precursor (A) being a polyamic acid ester or polyamic acid salt with a specific structure, and the weight-average molecular weight (Mw) of the polyimide precursor (A) being 3,000 or greater and less than 16,000, in terms of polystyrene, according to gel permeation chromatography (GPC).
    Type: Grant
    Filed: August 17, 2017
    Date of Patent: November 2, 2021
    Assignee: ASAHI KASEI KABUSHIKI KAISHA
    Inventors: Tomohiro Yorisue, Mitsutaka Nakamura, Taihei Inoue, Tatsuya Hirata, Takahiro Sasaki
  • Patent number: 11163233
    Abstract: [Problem] To provide a chemically amplified positive type photoresist composition capable of forming a pattern having an excellent cross-sectional shape, and a pattern forming method using the same. [Means for Solution] A chemically amplified positive type photoresist composition comprising (A) a polymer which reacts with an acid to increase its solubility in an alkaline aqueous solution, (B) an organic solvent, (C) a first photo acid generator containing a cation having no polar group, and (D) a second photoacid generator containing a cation having a polar group, and a pattern forming method using the same.
    Type: Grant
    Filed: January 2, 2018
    Date of Patent: November 2, 2021
    Assignee: Merck Patent GmbH
    Inventors: Masato Suzuki, Shunji Kawato, Tetsumasa Takaichi, Kazumichi Akashi
  • Patent number: 11155093
    Abstract: A method of producing a structure having a through substrate includes: forming a protective member having an atmosphere communication layer having a structure communicating with the through hole by permeation from at least a part of a layer side surface part to the through hole, and a gas-impermeable protective layer in this order, on the second surface of the through substrate; forming a dry film resist layer having a resin layer and a support member in this order, on the first surface of the through substrate; and peeling the support member from the resin layer, the support member being peeled from the resin layer in a state that the through hole of the through substrate is communicated with atmosphere by at least the atmosphere communication layer, in the peeling.
    Type: Grant
    Filed: January 8, 2019
    Date of Patent: October 26, 2021
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Manabu Otsuka, Tamaki Sato, Tetsushi Ishikawa, Yasuaki Tominaga
  • Patent number: 11156918
    Abstract: A photosensitive composition containing at least one compound selected from the group of the following (a-1) to (a-3) and containing (b) a photosensitizer: (a-1) an epoxy compound having a C9-C19 long-chain alkyl group, (a-2) a resin having a structure represented by the following general formula (1), and (a-3) a resin having a structure represented by the following general formula (2). A photosensitive composition capable of forming a pixel division layer that has high flexibility and affords excellent light emission reliability to an organic EL display device is provided.
    Type: Grant
    Filed: March 15, 2018
    Date of Patent: October 26, 2021
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Akihiro Ishikawa, Kazuto Miyoshi
  • Patent number: 11156917
    Abstract: An actinic ray-sensitive or radiation-sensitive resin composition contains a resin having an acid-decomposable group whose polarity increases through decomposition by the action of an acid, an acid generator A capable of generating a first acid upon irradiation with actinic rays or radiation, and an acid generator B capable of generating a second acid upon irradiation with actinic rays or radiation, and the first acid and the second acid satisfy predetermined requirements.
    Type: Grant
    Filed: August 21, 2019
    Date of Patent: October 26, 2021
    Assignee: FUJIFILM Corporation
    Inventors: Kyohei Sakita, Mitsuhiro Fujita, Takumi Tanaka, Keishi Yamamoto, Akiyoshi Goto, Keita Kato
  • Patent number: 11156754
    Abstract: An object of the present invention is to provide a curable composition capable of forming a cured film having excellent linearity of a pattern, and a light-shielding film, a color filter, a solid-state imaging device, and an infrared sensor, each formed using the curable composition. Another object of the present invention is to provide a pattern forming method and a method for manufacturing a color filter, each using the curable composition.
    Type: Grant
    Filed: September 14, 2018
    Date of Patent: October 26, 2021
    Assignee: FUJIFILM Corporation
    Inventors: Junichi Ito, Hideki Takakuwa, Daisuke Hamada, Yushi Kaneko
  • Patent number: 11156915
    Abstract: An actinic ray-sensitive or radiation-sensitive composition contains a cation including a metal atom and a ligand, in which the number of particles in liquid having particle diameters of 0.15 ?m or less included in 1 mL of the actinic ray-sensitive or radiation-sensitive composition is 10 or less.
    Type: Grant
    Filed: August 22, 2018
    Date of Patent: October 26, 2021
    Assignee: FUJIFILM Corporation
    Inventors: Hideaki Tsubaki, Wataru Nihashi
  • Patent number: 11150555
    Abstract: A non-ionic photoacid generator and a chemically amplified positive-type photoresist composition for a thick film including the non-ionic photoacid generator. The non-ionic photoacid generator may not only exhibit high solubility in a solvent of the photoresist composition, but may also exhibit chemical and thermal stability and high sensitivity. In particular, the non-ionic photoacid generator is decomposed by light to generate an acid, and at the same time, can exhibit a corrosion preventing effect on a metal substrate.
    Type: Grant
    Filed: April 3, 2018
    Date of Patent: October 19, 2021
    Assignee: LG CHEM, LTD.
    Inventors: Min Young Lim, Tae Seob Lee, Ji Hye Kim
  • Patent number: 11142620
    Abstract: A photosensitive resin composition which comprises (A) an alkali-soluble resin, (B) a photopolymerization initiator and (C) an acrylate monomer and may further comprise (D) a methacrylate monomer, wherein the acrylate monomer (C) comprises (C1) an acrylate monomer having a double bond equivalent of not less than 250 and (C2) azo acrylate monomer having a double bond equivalent of not more than 150, the content of the methacrylate monomer (D) is 0 to 5 mass %, the content of the acrylate monomer having a double bond equivalent of not less than 250 (C1) is 40 to 60 mass %, and the content of the acrylate monomer having a double bond equivalent of not more than 150 (C2) is 40 to 60 mass % based on the acrylate monomer (C), and the content of the photopolymerization initiator (B) is 0.5 to 1.5 mass % based on the photosensitive resin composition, and an etching method and plating method using the above photosensitive resin composition.
    Type: Grant
    Filed: March 8, 2018
    Date of Patent: October 12, 2021
    Assignee: MITSUBISHI PAPER MILLS LIMITED
    Inventors: Munetoshi Irisawa, Kunihito Kajiya, Yuji Toyoda
  • Patent number: 11143949
    Abstract: Provided is a photomask blank including, on a substrate, a processing film and a film made of a material containing chromium which is formed to be in contact with the processing film and has a three-layer structure of first, second and third layers, each of which contains chromium, oxygen, and nitrogen, wherein the first layer has a chromium content of 40 atomic % or less, an oxygen content of 50 atomic % or more, a nitrogen content of 10 atomic % or less, and a thickness of 20 nm or more, the second layer has a chromium content of 50 atomic % or more, an oxygen content of 20 atomic % or less, and a nitrogen content of 30 atomic % or more, and the third layer has a chromium content of 40 atomic % or less, an oxygen content of 50 atomic % or more, and a nitrogen content of 10 atomic % or less.
    Type: Grant
    Filed: May 22, 2019
    Date of Patent: October 12, 2021
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Yukio Inazuki, Kouhei Sasamoto
  • Patent number: 11137674
    Abstract: The present application discloses a mask adapted to a manufacturing process of a display panel. The light filtering layer includes at least three light filtering portions for light rays with different wavelengths to pass through, the at least three light filtering portions have a one-to-one correspondence to color filter in the display panel, and each of the light filtering portions is only adapted to the light rays with the wavelength having the same color as one of the color filters to pass through. The first light shading layer includes a plurality of light shading blocks spacedly arranged, and one light shading block is arranged at both ends of each of the light filtering portions respectively. The carrier is configured in a light-transmission way, and the light filtering layer and the first light shading layer are disposed on the carrier.
    Type: Grant
    Filed: April 27, 2017
    Date of Patent: October 5, 2021
    Assignees: HKC CORPORATION LIMITED, CHONGQING HKC OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventor: Chung-Kuang Chien
  • Patent number: 11137676
    Abstract: The present application discloses a photomask and an exposure system, the photomask comprising a completely transparent region and a completely shading region disposed around the periphery of the completely transparent region, and a shading region is disposed in the completely transparent region, and a light transmittance of the shading region is defined as T, 0?T<100%.
    Type: Grant
    Filed: February 22, 2019
    Date of Patent: October 5, 2021
    Assignees: HKC Corporation Limited, Chongqing HKC Optoelectronics Technology Co., Ltd.
    Inventor: Zeyao Li
  • Patent number: 11131927
    Abstract: A chemically amplified positive-type photosensitive resin composition which is highly sensitive and in which it is easy to form a resist pattern whose cross-sectional shape is rectangular, a photosensitive dry film which includes a photosensitive resin layer formed from the composition, a method of manufacturing the photosensitive dry film, a method of manufacturing a patterned resist film using the composition, a method of manufacturing a substrate with a template using the composition and a method of manufacturing a plated article using the substrate with the template. A Lewis acid compound is included in the composition that also includes an acid generator which generates an acid by application of an active ray or radiation, and a resin whose solubility in alkali is increased by action of an acid.
    Type: Grant
    Filed: April 25, 2019
    Date of Patent: September 28, 2021
    Assignee: Tokyo Ohka Kogyo Co., Ltd.
    Inventors: Akiya Kawaue, Shota Katayama, Kazuaki Ebisawa
  • Patent number: 11130838
    Abstract: The present specification provides a cardo-based binder resin represented by Chemical Formula 1, and a photosensitive resin composition, a black matrix, a color filter and a display apparatus including the same.
    Type: Grant
    Filed: February 1, 2019
    Date of Patent: September 28, 2021
    Assignee: LG CHEM, LTD.
    Inventors: Doyun Lee, Kwang Han Park, Eunjoo Choi
  • Patent number: 11130856
    Abstract: A resin composition includes a resin A, a resin C, and a solvent. The resin A includes a sulfonic-acid-group-containing structural unit in an amount exceeding 5 mol % with respect to total structural units included in the resin A. The resin A has a content of a fluorine atom of 30 mass % or less with respect to a total mass of the resin A. The resin C includes a fluorine atom in a larger content per unit mass than the content of a fluorine atom per unit mass in the resin A. A content of the resin A in the resin composition is lower than a content of the resin C in the resin composition in terms of mass.
    Type: Grant
    Filed: April 26, 2019
    Date of Patent: September 28, 2021
    Assignee: JSR Corporation
    Inventors: Tomohiko Sakurai, Sosuke Osawa, Hiromitsu Nakashima
  • Patent number: 11127592
    Abstract: A method includes forming a photoresist layer over a substrate, where the photoresist layer includes a polymer blended with a photo-acid generator (PAG), exposing the photoresist layer to a radiation source, and developing the photoresist layer, resulting in a patterned photoresist layer. The PAG is bonded to one or more polarity-enhancing group (PEG), which is configured to increase a dipole moment of the PAG. The exposing may separate the PAG into a cation and an anion, such that a PEG bonded to the cation and a PEG bonded to the anion each increases a polarity of the cation and the anion, respectively.
    Type: Grant
    Filed: May 31, 2018
    Date of Patent: September 21, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Ya-Ching Chang, Ching-Yu Chang, Chin-Hsiang Lin, Yen-Hao Chen
  • Patent number: 11124477
    Abstract: A novel sulfonium compound has formula (A). A positive resist composition comprising a polymer and a quencher containing the sulfonium compound is improved in resolution and LER during pattern formation and has storage stability. In formula (A), R1, R2, R3, and R4 are independently a C1-C20 monovalent hydrocarbon group, p is an integer of 0-5, q is an integer of 0-5, and r is an integer of 0-4.
    Type: Grant
    Filed: September 4, 2019
    Date of Patent: September 21, 2021
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Naoya Inoue, Masaki Ohashi, Daisuke Domon, Keiichi Masunaga, Masaaki Kotake
  • Patent number: 11118059
    Abstract: Provided are a film having excellent heat resistance and a film forming method. In addition, provided are an optical filter, a laminate, a solid image pickup element, an image display device, and an infrared sensor. The film includes an aggregate of a dye and a resin, in which an average particle size of the aggregate of the dye is 30 to 450 nm.
    Type: Grant
    Filed: August 1, 2018
    Date of Patent: September 14, 2021
    Assignee: FUJIFILM Corporation
    Inventors: Kazuya Oota, Kyohei Arayama, Daisuke Sasaki, Tokihiko Matsumura, Shunsuke Kitajima