Abstract: The disclosed embodiments relate to a system for assembling an optical connector. During the assembly process, the system first fabricates the optical connector, wherein the optical connector is precut and includes a fiber coupler for connecting to an external optical fiber. Next, the system bonds the optical connector to a photonic chip, wherein the photonic chip includes an optical coupler, which is coupled to one or more optical components within the photonic chip. Finally, after the optical connector is bonded to the photonic chip, the system uses a laser to write a coupling waveguide in the optical connector, wherein the coupling waveguide is routed through the optical connector to connect the optical coupler in the photonic chip with the fiber coupler for connecting to the external optical fiber.

Abstract: An SOI substrate includes a base substrate, a polycrystalline silicon layer formed on the base substrate, an insulating layer formed on the polycrystalline silicon layer, and a semiconductor layer formed on the insulating layer, and optical waveguides are formed in the semiconductor layer of the SOI substrate. Thus, by arranging the polycrystalline silicon layer under the insulating layer, the insulating layer can be made thin. Since the polycrystalline silicon layer includes a plurality of grains (a mass of grains made of a single crystal Si), even when leakage of light is generated beyond the insulating layer, reflection (diffusion) of light can be suppressed. In addition, by arranging the polycrystalline silicon layer under the insulating layer, the insulating layer can be made thin, so that distortion of a substrate can be suppressed.

Abstract: An embodiment is directed to an optical element arrangement including at least one optical element. A first optical element includes a fiber and a curved surface. The fiber emits light beams during oscillation at different angular positions relative to a system axis of the first optical element. The curved surface includes an array of lenslets. Each of the lenslets in the array of lenslets is configured to receive light beams from the fiber that are emitted within a particular range of the first curved surface and to collimate the light beams received by the lenslet at a lenslet-specific field angle relative to the system axis. In other embodiments, one or more additional optical elements with respective fibers can be deployed as part of the optical element arrangement, and any of the optical elements in the optical element arrangement may include multiple curved surfaces with respective lenslet arrays.

Abstract: A spot size converter may include a tapered periodic segmented waveguide (PSW). The tapered PSW may include a plurality of waveguide segments defined by a plurality of gaps between the plurality of waveguide segments. The plurality of gaps may be at one or more angles that are not substantially parallel to a direction of a width of the tapered PSW. The direction of the width of the tapered PSW may be substantially perpendicular to a direction in which light passes through the tapered PSW.

Abstract: A hollow-core photonic bandgap fiber having a hollow core and a cladding which surrounds the core at a core boundary and comprises a lattice or network of struts and interstitial nodes which together define an array of cavities, wherein a ratio between a difference in a length of a longest and shortest pitch spacing of the nodes at the core boundary to an average pitch spacing at the core boundary is less than about 0.3.

Abstract: Provided are: an optical waveguide that relatively easily expands a spot size and that can suppress an increase in optical coupling loss with another optical waveguide element; and an optical component and variable-wavelength laser that use the optical waveguide. The optical waveguide is provided with: a cladding member; and a core layer that is disposed within the cladding member and that is formed as an elongated body having a rectangular cross-sectional shape from a material having a higher refractive index than the material configuring the cladding member. Here, the cross-sectional shape of the core layer is characterized in having a rectangular shape in which the length in the lateral direction is at least 10 times the length in the vertical direction.

Abstract: A novel, hybrid optical fiber stub device comprises a first ferrule transparent to UV light and a second ferrule including a conventional material. An optical fiber is disposed through the first ferrule and second ferrule. The input and output faces of the optical fiber are prepared suitable for optical coupling. A photonic device is coupled to the first optical fiber surface. A UV curable epoxy is disposed between the photonic device and the first optical fiber surface. The UV curable epoxy includes an index of refraction between an index of refraction of the first optical fiber and an index of refraction of the photonic device. A second optical fiber is coupled to the first optical fiber.

Abstract: An apparatus comprising a substrate having a silicon waveguide thereon. The apparatus also comprises a semiconductor layer with a direct band gap. The semiconductor layer is located on a segment of the silicon waveguide and the semiconductor layer and the silicon waveguide are in a hybrid optical waveguide.

Abstract: A fiber-optic adapter with enhanced alignment is described. The adapter has two opposing housing halves and two opposing floating connector latches. Each housing half has a channel. The channels are configured to align when the two housing halves are secured together. The channels of the housing halves also have pockets which are configured to utilize a clearance fit, allowing the connector latches to float when the housing halves are secured together.

Abstract: A multicore fiber including two or more cores each capable of single mode transmission, a cladding covering around the two or more cores in common, and a low refractive index portion having a refractive index lower than a refractive index of the cladding, wherein a cross-section perpendicular to a longitudinal direction includes a region where two or more cores of a part or all of the two or more cores are arranged in a circular shape and at least a part of the low refractive index portion is arranged inside an inscribed circle of the cores included in the region.

Abstract: A cable pulling assembly includes an enclosure that is adapted for enclosing an end of a fiber optic cable. The enclosure includes a first member that defines a first cavity. The first cavity is adapted to receive a portion of the end of the fiber optic cable. The enclosure further includes a second member that is selectively engaged to the first member. The second member defines a second cavity. The second member is structurally identical to the first member. The enclosure is adapted to transfer a tensile force applied to the enclosure to the strength layer of the fiber optic cable.

Abstract: A wavelength division multiplexing (WDM) transistor-outline (TO)-can assembly is provided that is capable of transmitting optical data signals having multiple wavelengths. The WDM TO-can assembly can be packaged in a relatively small package without requiring a large amount of plant retooling or capital investment, and that can be made available in the market relatively quickly. A plurality of the WDM TO-can assemblies can be incorporated into a small form factor or C form factor pluggable-type optical communications module to achieve high data rates.

Abstract: The present disclosure is directed to a method of making an optical fiber with improved bend performance, the optical fiber having a core and at least one cladding layer, and a chlorine content in the in the last layer of the at least one cladding layer that is greater than 500 ppm by weight. The fiber is prepared using a mixture of a carrier gas, a gaseous chlorine source material and a gaseous reducing agent during the sintering of the last or outermost layer of the at least one cladding layer. The inclusion of the reducing gas into a mixture of the carrier gas and gaseous chlorine material reduces oxygen-rich defects that results in at least a 20% reduction in TTP during hydrogen aging testing.

Abstract: The wavelength response of an arrayed waveguide grating can be tuned, in accordance with various embodiments, using a beam sweeper including one or more heaters to shift a lateral position of light focused by the beam sweeper at an interface of the beam sweeper with an input free propagation region of the arrayed waveguide grating.

Abstract: The invention relates to a grating coupler and an optical waveguide device having a stripe width that can be easily realized where light is transferred by means of a beam of which the form is close to that of a Gaussian beam. A striped member that becomes a grating and that is formed of a material of which the refractive index is different from that of the core layer is divided into a plurality of sections, and at the same time, the distance between the core layer and the surface of the striped member on the side opposite the surface that faces the core layer is different for each section.

Abstract: A crimp comprises a hollow crimp body that is open at each end and includes, a first end, a first crushable crimp tube for crimping onto a connector; and at a second end a second crushable crimp tube for crimping onto a cable, the portion of the crimp between the said ends including a recess for engagement by a closure housing.

Abstract: In an example embodiment, a WSS may include a steering element, an optical subsystem, and a cylindrical lens. The optical subsystem may include a collimating lens and a dispersive element. The optical subsystem may be located between a fiber array and the steering element. The collimating lens may be located between the fiber array and the dispersive element. The cylindrical lens may be located between the optical subsystem and the steering element.

Abstract: A connectorized optical chip assembly connectable to an external optical fiber having a fiber connector is provided. The connectorized optical chip assembly includes a substrate, an optical chip having an on-chip optical waveguide and a connectorized interface. The connectorized interface includes an optical coupling element mounted in optical alignment with the on-chip optical waveguide. The connectorized interface includes a chip connector engaging the optical coupling element and configured for mating with the fiber connector of the external optical fiber, so as to provide an optical coupling of light between the optical coupling element and the external optical fiber. The connectorized optical chip assembly also includes a mechanical support structure supporting the connectorized interface onto the substrate. Preferably, the components of the connectorized optical assembly are made of materials heat resistant to temperatures used to melt solder in surface mount processes.

Abstract: An optic module cage assembly configured to selectively receive and retain an optic module, including: an optic module cage body configured to selectively receive and retain the optic module; a stationary heatsink fixedly attached to a side of the optic module cage body; one or more spring members disposed opposite the stationary heatsink and configured to bias the optic module towards the stationary heatsink; and a floating connector disposed partially within the optic module cage body and configured to make an electrical connection with the optic module, wherein the floating connector is configured to move in a constrained manner with respect to the optic module cage body. Optionally, the optic module cage assembly also includes a floating heatsink coupled to the one or more spring members. Optionally, the optic module cage assembly further includes a heat pipe that is thermally coupled to the stationary heatsink.

Abstract: Methods for forming magneto-optical films for integrated photonic devices and integrated photonic devices incorporating same are described. An optical isolator or any nonreciprocal photonic component for an integrated photonic device can be fabricated by depositing a functional garnet layer directly onto a non-garnet substrate; depositing a seed garnet layer on the functional garnet layer; and after depositing both the functional garnet layer and the seed layer performing an annealing process. Since the seed garnet layer crystalizes faster than the functional garnet layer, crystallization of the functional garnet layer can be accomplished directly on the non-garnet substrate during a single annealing step for the seed layer and the functional garnet layer.