Abstract: An optical information recording medium is manufactured by bonding a first substrate having a first central bore and a second substrate having a second central bore to each other with radiation cure resin. The radiation cure resin is coated on the first substrate. The first and second substrates are brought into close contact with each other so as to form the first and second substrates integrally with the radiation cure resin. A neighborhood of the first and second central bores is radiated. A whole of at least one of opposite outer faces of the integral first and second substrates is irradiated with radiation so as to wholly cure the radiation cure resin.

Abstract: An optical information recording medium is manufactured by bonding a first substrate having a first central bore and a second substrate having a second central bore to each other with radiation cure resin. The radiation cure resin is coated on the first substrate. The first and second substrates are brought into close contact with each other so as to form the first and second substrates integrally with the radiation cure resin. A neighborhood of the first and second central bores is radiated. A whole of at least one of opposite outer faces of the integral first and second substrates is irradiated with radiation so as to wholly cure the radiation cure resin.

Abstract: A device embodying the invention comprises a pair of members presenting a lower base surface and a member presenting an upper parallel surface when in an operative position. A platen pad material, which converts microwave energy to heat, is provided on one of the surfaces. When in an operative position the two platens provide uniform pressure over the surfaces of a laminating pouch carrying a document. The device is placed in a domestic microwave oven and the oven is operated for a period of time dependent on the rated power of the oven, the size of the document and the energy conversion capability of the platen pad. The platen pad converts the microwave energy to heat energy while applying uniform pressure over the surfaces of the pouch. This produces liquefaction of the adhesive which bonds the film to the document. The device is then removed from the microwave oven, permitted to cool, the lamination removed, and trimmed as may be necessary.

Abstract: Process and apparatus for joining endless polymer materials by means of the transillumination technique. According to the invention, in order to be joined, the endless materials are guided through two contrarotating rollers that press against each other. The first roller consists of a material that is transparent to laser beams and is tubular. The second roller is formed from a material that can be deformed easily at the surface, so that its surface can adapt to the shape of the first roller. Devices for producing a laser beam at the contact surface between the materials to be joined are arranged in the first roller. In this case, the beam is formed as a linear laser beam longitudinally with respect to the direction of movement of the materials so that during the passage, continuous heating of the material up to the melting point is achieved, without an excessively high laser output having to be provided. By means of the process and the apparatus, continuous joining is possible at high speed.

Abstract: A method for manufacturing a semiconductor device whereby semiconductor elements like semiconductor bare chips are mounted with high productivity on both surfaces of a circuit board while preventing the board from warping, and an apparatus for manufacturing a semiconductor device for faithfully embodying the manufacturing method. Semiconductor elements temporarily fixed on both surfaces of a circuit board are heated while being pressurized in directions to be each pressed against the board, whereby adhesive on both surfaces of the board is thermally set simultaneously and bumps on each semiconductor elements are press-bonded to their opposing board electrodes on the board to be electrically connected. Ultraviolet rays are irradiated to a circumference of mixed curing adhesive applied to at least one surface of the circuit board to form an ultraviolet curing part only on the circumference of the adhesive, thereby increasing strength for temporarily fixing the semiconductor elements to the circuit board.

Abstract: A metal material adhesion method is described. The method is used for an optical transceiver module assembly process to adhere a protection cover of a laser diode in a metal shell and enhance the adhesion strength thereof. The method employs the following steps. First, the protection cover and the metal shell are provided. A primer layer is coated inside the metal shell. The laser diode is aligned with the metal shell to provide a maximum signal strength position. An epoxy layer is glued between the metal shell and the protection cover to fix the laser diode in the best position. The method further provides a sealant layer to protect the epoxy layer from moisture and a second premier layer to enhance the adhesion strength between the protection cover and the epoxy layer.

Abstract: The present invention provides a process for joining plastics components by a combination of pressing and laser welding, wherein, at the joining points (1) of the components (3, 4), at least a first component (3) has a resilient and/or compressible sealing lip (5), wherein the sealing lip (5) is resiliently deformed by pressing the components (3, 4) together, while the external pressure is maintained, the laser beam is directed onto the joining point (1) and, by purposeful irradiation of the joining point (1), the components (3, 4) are joined together.

Abstract: A method of improving the properties of adhesion of a non-oxide ceramic substrate before gluing it includes the steps of irradiating the surface of the ceramic substrate using an excimer laser and applying a coupling agent to the irradiated surface.

Abstract: A forming jig includes a grid pattern of support walls arranged on a support base and having upper free ends located along an imaginary curved surface, and modular sectional profile members arranged on the walls to enclose a vacuum chamber within the jig. Grooves, channels and air passages between neighboring profile members communicate into the vacuum chamber. The outer surface of the profile members matches the intended inner surface of a structural component to be fabricated using the jig. In the fabrication process, a film is applied to the outer surface to pre-establish a vacuum, the film is removed while simultaneously a vacuum skin is applied, stringer members are set into the grooves, fiber skin layers are laid up, a sealant is applied around the perimeter, a structural shell is vacuumed onto the skin layers, and then this preformed component is removed from the jig, injected with resin unless the skin layers were pre-impregnated with resin, and cured.

Abstract: A microfluidic disc having one or more enclosed microchannel structures, and the microchannel structures are intended to be used for transport of transporting liquids. The device is characterized in that at least a part of the inner walls of each of one or more microchannel structures are treated with a gas plasma having one or more organic precursor compounds.

Abstract: An apparatus for vacuum bonding a liquid crystal display device includes a unitary vacuum processing chamber, upper and lower stages provided at upper and lower spaces within the vacuum processing chamber for receiving first and second substrates, and at least one first substrate receiving system provided within the vacuum chamber to contact dummy areas between cell areas of one of the first and second substrates.

Abstract: In a trim part for decorative purposes, especially in the interior, and in this case preferably for the interior trim of the passenger compartments of vehicles, a cover layer of natural stone is applied to the visible side of a base part. For this purpose, the negative shape of the base part is machined from a natural stone block and the two are combined permanently to form a sandwich. Then the surface is machined on the visible side, and finally clear lacquer is applied.

Abstract: An RFID webstock containing a relatively high pitch-density array of semiconductive chips is provided and joined to a web bearing relatively widely spaced antennas in a continuous process. The RFID webstock is separated or cut into individual chip sections, with the spacing of the chips being increased as the RFID webstock is die cut. The individual chips on the sections are then joined to corresponding antennas to form an RFID inlay stock. This process is conducive to high speed roll-to-roll production of RFID tag and label roll stock.

Abstract: A method and apparatus are disclosed for mounting a wafer on a mount and thinning the wafer. The wafer includes a front surface having bumps with an adhesive tape having a backing attached thereto and a back surface. The front surface of the wafer is mounted facedown on a suction surface with the backing of the adhesive tape abutting the surface. The wafer is then suctioned, after which the back surface of the wafer undergoes a grinding process to thin the wafer. Since the backing attached to the bumps on the wafer is substantially planar and sits substantially flat on the suction surface of the wafer mount, the force exerted on the wafer from the thinning process does not overcome the suction force holding the wafer on the wafer mount. Thus, the bumped wafer may be thinned without damaging the bumps and the active surface of the wafer.

Abstract: A method of sealing parts of a plastic capsule by forming a weld seam in an overlapping region of the parts of the capsule, wherein the capsule comprises a capsule cap having an open end and a capsule body having an open end, the method comprising: (a) holding the capsule cap and the capsule body in a capsule holder comprising a first holding part and a second holding part which can be guided synchronously with one another, wherein the first holding part interlockingly surrounds the capsule cap and the second holding part interlockingly surrounds the capsule body; (b) closing the capsule holder holding the capsule cap and the capsule body so that the open end of the capsule cap and the open end of the capsule body form a sealed cavity therebetween and form an overlapping region, wherein the overlapping region is not covered by the capsule holder, to obtain a closed capsule; and (c) welding the closed capsule using an energy beam of hot gas or laser light on the overlapping region by forming the weld seam t

Abstract: The present invention provides a method of manufacturing a circuit board module for connecting a circuit conductor (2) of a first circuit board (1) to a circuit conductor (4) of a second circuit board (5) using at least one selected from the group consisting of an anisotropic conductive film (6), an anisotropic conductive paste and an adhesive resin, wherein a difference in a pattern width between the circuit conductor of the first circuit board and that of the second circuit board is in a range of 5 ?m to 50 ?m. In such a method of manufacturing a circuit board module, connection of a connecting conductor with a narrow pitch can be realized, and poor connection can be reduced, thus providing a method of manufacturing a circuit board module having higher reliability.

Abstract: A method of low-temperature (150-300° C.) patterned wafer bonding of complex 3D MEMS comprising providing a first pre-processed wafer having a first surface and a second pre-processed wafer having a second surface. Photosensitive benzocyclobutene (BCB) polymer is then applied to the first surface of the first wafer in a predetermined pattern to define a bonding layer. The second wafer is then bonded to the first wafer only along the bonding layer.

Abstract: A manufacturing line has a feeder for feeding a hoop substrate, a bake oven for heating and drying the fed hoop substrate, a die bonding device for applying an adhesive to a predetermined position on the dried substrate to mount an IC chip, and a cure oven for bonding the IC chip to the hoop substrate by heating and curing the adhesive.

Abstract: A machine for joining opposite respective edges of respective pairs of large sheets (2) of plastic comprises a frame (1), a rectangular table (10) having a horizontal surface for supporting the sheets in position for joinder, the table provided with an elongated linear slot (18) extending centrally of and between opposite ends of the table and disposed between first and second rows (150, 150?) of spaced apart air suction holes (15, 15?) that open on the table for pulling the sheets against the table, a fixed electrode (11) disposed in the slot (18), a mobile electrode (14) mounted for vertical up and down movement on top of the fixed electrode, push buttons (19, 19?) for activating suction of air through the holes, and control means in the form of a robot to control different operations.

Abstract: This invention relates to a labeling system for continuously applying a layer of a UV curable adhesive to plastic, sheet fed, cut and stack, labels, irradiating the adhesive on the labels to render the adhesive sufficiently tacky to effectively adhere the labels to containers in a commercial labeling machine and thereafter applying the labels to discrete containers through the sufficiently tacky adhesive layer. The plastic labels can be clear, opaque (including metallized) plastic films and can be retained in a dispensing magazine prior to the application of the UV curable adhesive to the labels.