Abstract: A plasma discharge electrode having a front surface with a central portion thereof including gas outlets discharging a process gas which forms a plasma and a peripheral portion substantially surrounding the gas outlets. The peripheral portion has at least one step for controlling a density of the plasma formed by the electrode. The electrode can be used as the grounded upper electrode in a parallel plate plasma processing apparatus such as a plasma etching apparatus. The geometric features of the step and of a corresponding edge ring on the lower electrode can be varied to achieve the desired etch rate profile across a wafer surface.

Abstract: The mounting of semiconductor chips onto a flexible substrate takes place in three steps: Firstly, at a dispensing station, adhesive is applied to predetermined substrate sites on the substrate. Then, at a bonding station, semiconductor chips are placed onto the substrate sites. Finally, curing of the adhesive takes place. In accordance with the invention, the substrate is fixed onto a level support surface by means of vacuum during the hardening of the adhesive.

Abstract: A semiconductor device in chip format having a chip which has at least one first insulating layer and electrical connection pads free of the insulating layer is described. On the first insulating layer, interconnects run from the electrical connection pads to base regions of external connection elements. A further applied insulating layer is provided with openings leading from the outside to the base regions of the external connection elements. In the openings there is a conductive adhesive, onto which small balls which are metallic at least on the outside are placed. The semiconductor element can also contain a solder paste instead of a conductive adhesive in the openings, and metallized small plastic balls are placed onto the solder paste. The invention furthermore relates to methods for producing the semiconductor device described.

Abstract: A method for manufacturing a printed wiring board, comprising the step of forming a hole by an energy beam such as a laser beam, wherein formation of a resin film by a substrate-material resin oozing to the inner-wall surface of a hole is prevented, by lowering the water-absorption percentage of a substrate material through the dehumidifying step as the preprocess of the hole-forming step for forming a through-hole or non-through-hole for interconnecting circuits formed on both sides or in multiple layers, thereby it is possible to realize high-quality hole-formation by preventing a defective resin film formation and obtain a high-reliability printed wiring board.

Abstract: A process for producing a sealed crimp joint between two substrates, each substrate having a predefined crimp area utilized to form the crimp joint. The process includes the steps of: a) applying a photocurable sealant composition to a portion of the crimp area of at least one of the substrates, b) irradiating the photocurable sealant in place on the substrate to fully cure the sealant, and then c) forming a crimp joint between the two substrates utilizing the respective crimp areas thereof. The process is suitable for forming crimp joints between housing parts of an oil filter.

Abstract: A charging bar applies a static charge to a printed label as it is fed in to a grounded adhesive applicator roll. The charged label is drawn to the grounded roll, and thereby obtains even coating of adhesive on the underside of the label, while avoiding contamination of the printed surface of the label with adhesive. The adhesive coated label is carried by a transfer roll to a laminating nip where it is adhered to a corrugated substrate.

Abstract: The current invention provides a method of attaching a plurality of cores wherein a core has a via with a conductive surface to be electrically connected to a conductive surface on another core. The method provides for applying a metallurgical paste to a conductive surface, removing a portion of the flux from the paste and joining the two cores. The current invention also provides a structure including a plurality of cores wherein a metallurgical paste electrically connects a via with a conductive surface on a core to a conductive surface on another core.

Abstract: A process for transmission laser welding of a first plastic part and a second plastic part that can be at least partially received in the first plastic part is proposed. The second plastic part is introduced into the first plastic part, to which it is connected by means of an interference fit connection, whereby at least one contact zone between the second plastic part and the first plastic part is formed as a result of this interference fit. A laser beam is directed to impinge on the second plastic part, through the first plastic part, along the at least one contact zone to form a weld.

Abstract: The present invention relates to a method of bonding a conductive adhesive and an electrode together, which is capable of obtaining electrical bonding between a conductive electrode and an electrode. In this method, a conductive adhesive containing a conductive filler and an organic binder is coated on an electrode having a layer formed thereon by plating a low-melting-point material, and then heated to cure the organic binder and melt the plated layer on the electrode. As a result, the conductive filler contained in the adhesive enters the plated layer to obtain strong bonding between the plated layer and the conductive filler.

Abstract: A plastic product is fabricated from plastic sheets by heat sealing the plastic sheets to form an enclosure member. In order to strengthen the heat-sealed joints of the plastic sheets, the plastic sheets are thickened at portions where the heat-sealed joints are to be formed. Preferably, the heat-sealed joints are formed in such a manner that the cross-section of the heat-sealed joints is smaller than that of the thickened portions of the plastic sheet, thereby preventing effectively the non-thickened portions of the plastic sheets from being affected adversely by the heat sealing process.

Abstract: In a plate bonding system for bonding first and second substrate discs (or other plates) with adhesive, there are provided a first section for bringing the first and second substrate discs closer to each other with the interposition of adhesive, and a second section for producing an electric field in the interspace between the first and second substrate discs. The second section produces the field and thereby deforms the adhesive into a tapered shape to minimize the initial contact area and thereby prevent voids from being involved in the adhesive.

Abstract: Embodiments of the invention include a method comprising disposing a thin metallic layer having a low melting temperature between one end of a conductive post on a substrate and a conducting structure on an opposing substrate. Heated platens in contact with the substrates can apply pressure and heat to the thin metallic layer and cause it to be entirely consumed and subsequently transformed into a bonding layer having a melting temperature higher than the melting temperature of the original thin metallic layer. Prior to, during, or after the conductive post is bonded to the conducting structure, the region around the conductive post and between the substrates may be filled with a dielectric material, such as polyimide.

Abstract: A production method of multi-layer information record carriers that involves forming a signal duplication layer on a substrate that contains signals, then replacing a metallic stamping plate with the substrate that comprises the signal duplication layer for manufacturing a signal layer of high molecular materials. After the signal layer has been subjected to curing by exposure to ultra violet light, the signal layer is separated from the signal duplication layer because of the difference between the adhesive forces of the different materials. Multi-layer information record carriers can be manufactured by repeating the manufacturing process. Since the manufacturing process of the invention is simple and speedy, it facilitates the creation of automated facilities for mass production.

Abstract: A method for making an optical composite composed of glass and plastic is disclosed. The method can be used to create a photochromic lens of high optical and refractive quality that is both scratch resistant and of high impact resistance. The method can also be used to create a strong sheath and/or cladding for an optic fiber. The method can also be used to create a scratch resistant coating for polycarbonate material, such as bulletproof glass. Vacuum pressure and optical contacting are used to hold the glass and plastic portions together. A flexible, peripheral seal, whose kinetic reaction strength has been enhanced with microwave radiation, is used maintain the vacuum adhesion of the glass and the plastic. This structural seal is located in a peripheral, non-optical portion of the optical composite to minimize any interference the seal may have with the optical function of the composite.

Abstract: The present invention provides a plastics-covered metal plate excellent in chipping resistance, corrosion resistance etc. made by covering one surface or both surfaces of a metal plate with at least two kinds of plastics layers whose rates of elongation are different and a process of covering a car body by using said covered metal plate.

Abstract: It is an object to provide an optical recording medium (disk) bonding apparatus which eliminates the warpage of a disk during bonding and has high precision in the bonding. There are provided means for bonding two substrates and then irradiating radioactive rays from both sides of the substrates when carrying out radiation curing, and a mechanism for shifting the irradiation starts of both radioactive rays to control an amount of warpage of each substrate after the curing.

Abstract: A method for creating adhesion includes plasma treating two substrates and thereafter contacting the substrates. The method can be used on a variety of dry surfaces. The method is used to adhere nonadhesive surfaces such as a cured silicone with a ceramic or semiconductor.

Abstract: A sheet-form, curable pressure-sensitive adhesive is disclosed which includes a high molecular weight polymer (A) such as an acrylic polymer for constituting a pressure-sensitive adhesive component, a compound (B) containing an epoxy group, and a polymerization initiator (C) which is activated upon application of an activation energy such as a light to cause the compound (B) having an epoxy group to undergo a ring-opening polymerization.

Abstract: A method for producing small pitch z-axis electrical interconnections in layers of dielectric materials which are applied to printed wiring boards and diverse electronic packages. A method for parallel fabrication of intermediate structures which are subsequently jointed to form a final structure. In addition there is provided a z-interconnected electrical structure, employing dielectric materials such as resin coated copper, employable in the manufacture of diverse type of electronic packages, including printed wiring boards (PWBs), substrates, multi-chip modules and the like.

Abstract: A method for manufacturing an ink jet head by bonding with liquid-like adhesive a member at least having a discharge port for discharging ink, and a substrate having energy generating elements to generate energy for discharging ink comprises the steps of coating the liquid-like adhesive on the member or the substrate, the liquid-like adhesive containing at least ultraviolet curing cation polymeric starter and epoxy resin; irradiating ultraviolet rays to the liquid-like adhesive to activate the ultraviolet curing cation polymeric starter; positioning the member and the substrate without heating process; and heating in a state of the member and the substrate being positioned to cure the activated liquid-like adhesive.