Patents Examined by Johyannes P Mondt
  • Adhesive wafer bonding with sacrificial spacers for controlled thickness variation
    Patent number: 9153548
    Abstract: A method and structure for forming an array of micro devices is disclosed. An array of micro devices is formed over an array of stabilization posts included in a stabilization layer. Patterned sacrificial spacers are formed between the stabilization posts and between the micro devices. The patterned sacrificial spacers are disposed upon the patterned sacrificial spacers.
    Type: Grant
    Filed: September 16, 2013
    Date of Patent: October 6, 2015
    Assignee: Lux Vue Technology Corporation
    Inventors: Clayton Ka Tsun Chan, Andreas Bibl