Patents Examined by Joseph Miller, Jr.
  • Patent number: 11643721
    Abstract: Processing methods for forming iridium-containing films at low temperatures are described. The methods comprise exposing a substrate to iridium hexafluoride and a reactant to form iridium metal or iridium silicide films. Methods for enhancing selectivity and tuning the silicon content of some films are also described.
    Type: Grant
    Filed: September 12, 2018
    Date of Patent: May 9, 2023
    Assignee: Applied Materials, Inc.
    Inventors: Feng Q. Liu, Hua Chung, Schubert Chu, Mei Chang, Jeffrey W. Anthis, David Thompson
  • Patent number: 11643749
    Abstract: The present invention provides a crucible and a SiC single crystal growth apparatus capable of improving the efficiency of using source materials. The crucible includes a lid and a container. The container includes a bottom facing the lid. The bottom includes a recess which is recessed towards the lid.
    Type: Grant
    Filed: April 23, 2019
    Date of Patent: May 9, 2023
    Assignee: SHOWA DENKO K.K.
    Inventor: Yohei Fujikawa
  • Patent number: 11643723
    Abstract: The invention includes apparatus and methods for instantiating and quantum printing materials, such as elemental metals, in a nanoporous carbon powder.
    Type: Grant
    Filed: April 19, 2022
    Date of Patent: May 9, 2023
    Assignee: Quantum Elements Development Inc.
    Inventors: Christopher J. Nagel, Chris Leo Brodeur
  • Patent number: 11639548
    Abstract: There is provided a film-forming material mixed-gas forming device including: a film-forming material supply unit that supplies a film-forming material in liquid form at a predetermined flow rate; a carrier gas supply unit that supplies a carrier gas at a predetermined flow rate; a main vaporization unit that vaporizes the film-forming material by heating the film-forming material supplied from the film-forming material supply unit and the carrier gas supplied from the carrier gas supply unit; and an auxiliary vaporization unit having a porous vaporization member which captures carried over droplets of the film-forming material in gas flowing out from the main vaporization unit and vaporizes the captured droplets of the film-forming material.
    Type: Grant
    Filed: August 18, 2020
    Date of Patent: May 2, 2023
    Assignee: ASM IP Holding B.V.
    Inventors: Hua Feng Wang, Yozo Ikedo
  • Patent number: 11629407
    Abstract: The disclosure relates to a substrate processing apparatus, comprising: a first reactor constructed and arranged to process a rack with a plurality of substrates therein; a second reactor constructed and arranged to process a substrate; and, a substrate transfer device constructed and arranged to transfer substrates to and from the first and second reactor. The second reactor may be provided with an illumination system constructed and arranged to irradiate ultraviolet radiation within a range from 100 to 500 nanometers onto a top surface of at least a substrate in the second reactor.
    Type: Grant
    Filed: February 21, 2020
    Date of Patent: April 18, 2023
    Assignee: ASM IP Holding B.V.
    Inventors: Dieter Pierreux, Werner Knaepen, Bert Jongbloed, Jeroen Fluit
  • Patent number: 11631571
    Abstract: An apparatus for atomic scale processing is provided. The apparatus may include a reactor (100) and an inductively coupled plasma source (10). The reactor may have inner (154) and outer surfaces (152) such that a portion of the inner surfaces define an internal volume (156) of the reactor. The internal volume of the reactor may contain a fixture assembly (158) to support a substrate (118) wherein the partial pressure of each background impurity within the internal volume may be below 10?6 Torr to reduce the role of said impurities in surface reactions during atomic scale processing.
    Type: Grant
    Filed: August 11, 2020
    Date of Patent: April 18, 2023
    Assignee: Kurt J. Lesker Company
    Inventors: Gilbert Bruce Rayner, Jr., Noel Christopher O'Toole, Daniel Edward Carlsen
  • Patent number: 11624107
    Abstract: A thin film deposition apparatus used to produce large substrates on a mass scale and improve manufacturing yield. The thin film deposition apparatus includes a deposition source; a first nozzle disposed at a side of the deposition source and including a plurality of first slits arranged in a first direction; a second nozzle disposed opposite to the first nozzle and including a plurality of second slits arranged in the first direction; and a barrier wall assembly including a plurality of barrier walls arranged in the first direction so as to partition a space between the first nozzle and the second nozzle.
    Type: Grant
    Filed: June 22, 2020
    Date of Patent: April 11, 2023
    Assignee: Samsung Display Co., Ltd.
    Inventors: Choong-Ho Lee, Jung-Min Lee
  • Patent number: 11623865
    Abstract: Described herein are apparatus, systems, and methods for the continuous production of BNNT fibers, BNNT strands and BNNT initial yarns having few defects and good alignment. BNNTs may be formed by thermally exciting a boron feedstock in a chamber in the presence of pressurized nitrogen. BNNTs are encouraged to self-assemble into aligned BNNT fibers in a growth zone, and form BNNT strands and BNNT initial yarns, through various combinations of nitrogen gas flow direction and velocities, heat source distribution, temperature gradients, and chamber geometries.
    Type: Grant
    Filed: May 20, 2020
    Date of Patent: April 11, 2023
    Assignee: BNNT, LLC
    Inventors: Michael W. Smith, Jonathan C. Stevens, Kevin C. Jordan, R. Roy Whitney
  • Patent number: 11613811
    Abstract: A film forming apparatus sequentially supplies a raw material gas of a compound containing chlorine and an element other than the chlorine, and a first reaction to form a fil. The film forming apparatus includes a rotary table, a raw material gas ejection port configured to eject the raw material gas to a first region, a reaction gas supply part configured to supply, to a second region, a first reaction gas and a second reaction gas that reacts with chlorine to generate a third reaction product, in order to prevent a second reaction product from being generated due to a reaction of the chlorine remaining in the vacuum container with air when performing the opening-to-air. The film forming apparatus further includes an atmosphere separation part, a first exhaust port and a second exhaust port, and a controller.
    Type: Grant
    Filed: September 21, 2020
    Date of Patent: March 28, 2023
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Jun Ogawa, Hiroyuki Wada
  • Patent number: 11603589
    Abstract: The present disclosure relates to systems and methods of additive manufacturing that reduce or eliminates defects in the bulk deposition material microstructure resulting from the additive manufacturing process. An additive manufacturing system comprises evaporating a deposition material to form an evaporated deposition material and ionizing the evaporated deposition material to form an ionized deposition material flux. After forming the ionized deposition material flux, the ionized deposition material flux is directed through an aperture, accelerated to a controlled kinetic energy level and deposited onto a surface of a substrate. The aperture mechanism may comprise a physical, electrical, or magnetic aperture mechanism. Evaporation of the deposition material may be performed with an evaporation mechanism comprised of resistive heating, inductive heating, thermal radiation, electron heating, and electrical arc source heating.
    Type: Grant
    Filed: December 5, 2018
    Date of Patent: March 14, 2023
    Assignee: Arizona Thin Film Research, LLC
    Inventor: Patrick Morse
  • Patent number: 11597997
    Abstract: The present disclosure discloses an apparatus. The apparatus according to the present disclosure may include a communication interface, one or more memories, and one or more processors. The one or more processors may be configured to: control the thin-film deposition devices to execute the thin-film deposition process by accessing the memory and executing a recipe; obtain in-process thin-film state data of the thin film from the thin-film measurement result received via the communication interface during the thin-film deposition process; and derive post-process thin-film state data of the thin film from the process condition data, the sensing data, and the in-process thin-film state data using a first correlation model.
    Type: Grant
    Filed: April 11, 2019
    Date of Patent: March 7, 2023
    Assignee: IVWorks Co., Ltd.
    Inventor: Young Kyun Noh
  • Patent number: 11602064
    Abstract: Process assemblies and cable management assemblies for managing cables in tight envelopes. A processing assembly includes a top chamber having at least one substrate support, a support shaft, a robot spindle assembly, a stator and a cable management system. The cable management system includes an inner trough assembly and an outer trough assembly configured to move relative to one another, and a plurality of chain links configured to house at least one cable for delivering power to the process assembly.
    Type: Grant
    Filed: September 1, 2020
    Date of Patent: March 7, 2023
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Akshay Gunaji, Uday Pai, Timothy J. Roggenbuck, Sanjeev Baluja, Kalesh Panchaxari Karadi, Tejas Ulavi
  • Patent number: 11590456
    Abstract: Atomic layer deposition is utilized to deposit a coating on a membrane. The coated membrane exhibits a tightly bound hydration layer upon exposure to water. The resultant coated membrane is oleophobic.
    Type: Grant
    Filed: May 31, 2018
    Date of Patent: February 28, 2023
    Assignees: UChicago Argonne, LLC, The University of Chicago
    Inventors: Hao-Cheng Yang, Seth B. Darling, Jeffrey W. Elam, Lin Chen, Ruben Waldman
  • Patent number: 11594415
    Abstract: Methods of forming a tungsten film comprising forming a boron seed layer on an oxide surface, an optional tungsten initiation layer on the boron seed layer and a tungsten containing film on the boron seed layer or tungsten initiation layer are described. Film stack comprising a boron seed layer on an oxide surface with an optional tungsten initiation layer and a tungsten containing film are also described.
    Type: Grant
    Filed: November 11, 2019
    Date of Patent: February 28, 2023
    Assignee: Applied Materials, Inc.
    Inventors: Susmit Singha Roy, Pramit Manna, Rui Cheng, Abhijit Basu Mallick
  • Patent number: 11584988
    Abstract: A dry powder MOCVD vapor source system is disclosed that utilizes a gravimetric powder feeder, a feed rate measurement and feeder control system, an evaporator and a load lock system for continuous operation for thin film production, particularly of REBCO type high temperature superconductor (HTS) tapes.
    Type: Grant
    Filed: September 27, 2021
    Date of Patent: February 21, 2023
    Assignee: MetOx Technologies, Inc.
    Inventors: Mikhail Novozhilov, Alex Ignatiev
  • Patent number: 11584991
    Abstract: Systems and techniques for depositing organic material on a substrate are provided, in which one or more shield gas flows prevents contamination of the substrate by the chamber ambient. Thus, multiple layers of the same or different materials may be deposited in a single deposition chamber, without the need for movement between different deposition chambers, and with reduced chance of cross-contamination between layers.
    Type: Grant
    Filed: June 3, 2020
    Date of Patent: February 21, 2023
    Assignee: Universal Display Corporation
    Inventors: Gregory McGraw, William E. Quinn, Gregg Kottas, Siddharth Harikrishna Mohan, Matthew King
  • Patent number: 11578004
    Abstract: Methods and apparatus for depositing material on a continuous substrate are provided herein. In some embodiments, an apparatus for processing a continuous substrate includes: a first chamber having a first volume; a second chamber having a second volume fluidly coupled to the first volume; and a plurality of process chambers, each having a process volume defining a processing path between the first chamber and the second chamber, wherein the process volume of each process chamber is fluidly coupled to each other, to the first volume, and to the second volume, and wherein the first chamber, the second chamber, and the plurality of process chambers are configured to process a continuous substrate that extends from the first chamber, through the plurality of process chambers, and to the second chamber.
    Type: Grant
    Filed: June 2, 2017
    Date of Patent: February 14, 2023
    Assignee: APPLIED MATERIALS, INC.
    Inventors: David Masayuki Ishikawa, Brian H. Burrows
  • Patent number: 11560622
    Abstract: Disclosed is a degradable film (1) in which a barrier layer (3) is disposed on a surface of a water-soluble polymer layer (2). The water-soluble polymer layer (2) is made of a water-soluble polymer such as polyvinyl alcohol or polyvinyl pyrrolidone. The barrier layer (3) is made of silicon oxide or silicon oxynitride. The barrier layer (3) is formed on the water-soluble polymer layer (2) by a CVD process with the supply of a raw material gas containing a precursor of a substance that forms the barrier layer (3), an ozone gas with an oxygen concentration of 20 vol % or higher and an unsaturated hydrocarbon gas to the water-soluble polymer layer (2).
    Type: Grant
    Filed: August 9, 2019
    Date of Patent: January 24, 2023
    Assignee: MEIDENSHA CORPORATION
    Inventors: Toshinori Miura, Mitsuru Kekura, Naoto Kameda
  • Patent number: 11557463
    Abstract: In a vacuum processing apparatus including: a vacuum container including a processing chamber therein; a plasma formation chamber; plate members being arranged between the processing chamber and the plasma formation chamber; and a lamp and a window member being arranged around the plate members, in order that a wafer and the plate members are heated by electromagnetic waves from the lamp, a bottom surface and a side surface of the window member is formed of a member transmitting the electromagnetic waves therethrough.
    Type: Grant
    Filed: January 28, 2021
    Date of Patent: January 17, 2023
    Assignee: Hitachi High-Tech Corporation
    Inventors: Hiroyuki Kobayashi, Nobuya Miyoshi, Kazunori Shinoda, Kenji Maeda, Yutaka Kouzuma, Satoshi Sakai, Masaru Izawa
  • Patent number: 11549182
    Abstract: Disclosed are Group 6 film forming compositions comprising Group 6 transition metal-containing precursors selected from the group consisting of: M(=O)2(OR)2??Formula I, M(=O)(NR2)4??Formula II, M(=O)2(NR2)2??Formula III, M(=NR)2(OR)2??Formula IV, and M(=O)(OR)4??Formula V, wherein M is Mo or W and each R is independently H, a C1 to C6 alkyl group, or SiR?3, wherein R? is H or a C1 to C6 alkyl group. Also disclosed are methods of synthesizing and using the disclosed compositions to deposit Group 6 transition metal-containing films on substrates via vapor deposition processes.
    Type: Grant
    Filed: September 30, 2021
    Date of Patent: January 10, 2023
    Assignee: L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude
    Inventors: Clément Lansalot-Matras, Julien Lieffrig, Christian Dussarrat, Antoine Colas, Jong Min Kim