Abstract: There is provided a method for forming fine patterns. The method includes forming a pattern divider on an underlying layer, forming a mask layer on the underlying layer to cover the pattern divider, forming an opening pattern that vertically penetrates the mask layer to expose a portion of the pattern divider and intersects the exposed portion of the pattern divider, and selectively removing portions of the underlying layer exposed by the opening pattern of the mask layer to form a couple of opening sub-patterns.

Abstract: A display device and a method of manufacturing a display device are provided. A manufacturing method of a display device includes: forming a display module including a first area defined therein, the display module including a display panel including a lower surface and an upper surface opposite the lower surface, a first film under the lower surface of the display panel, a second film on the upper surface of the display panel, and an adhesive layer between the lower surface of the display panel and the first film; and irradiating a laser beam in an upper direction extending from the lower surface of the display panel to the upper surface of the display panel to cut the first film and the adhesive layer along an edge of the first area, the laser beam provided to the display panel having a laser power equal to or less than about 1 W.

Abstract: Provided are apparatuses and methods, in which a disturbed measurement variable is converted to a digital signal. The digital signal is then averaged over a number of sampling values which corresponds to a period of the disturbances.

Abstract: The present disclosure relates to an integrated circuit (IC) and a method of formation. In some embodiments, a first oxide component is disposed on a substrate within a medium voltage region. A first high-k dielectric component is disposed on the substrate within a low voltage region and a second high-k dielectric component disposed on the first oxide component within the medium voltage region. A first gate electrode separates from the substrate by the first high-k dielectric component. A second gate electrode separates from the substrate by the first oxide component and the second high-k dielectric component.

Abstract: An organic light-emitting diode display device includes a first substrate that includes a display region with a plurality of pixels and a non-display region in a periphery of the display region, a first electrode disposed on the first substrate, a second electrode opposed to the first electrode, an organic light-emitting layer disposed between the first electrode and the second electrode, and at least one light sensing member disposed on a rear surface of the first substrate that overlaps the display region.

Abstract: A display panel, a fabricating method thereof and a display device are disclosed, the display device includes a plurality of pixels. Each pixel comprises: a white sub pixel comprising a tandem white OLED; and a color filter layer, disposed at the light exit side of the white sub pixel and disposed outside and along at least one side of the white sub pixel. The display panel can reduce color drift in a side view and improve viewing effect.

Abstract: A semiconductor device and manufacturing method thereof. Various aspects of the disclosure may, for example, comprise forming a back end of line layer on a dummy substrate, completing at least a first portion of an assembly, and removing the dummy substrate.

Abstract: A magnetoresistive random-access memory (MRAM) is disclosed. The MRAM device reduces stray magnetic fields generated by magnetic layers of the stack, including a reference layer and magnetic layers of the synthetic antiferromagnetic layer, in a way that reduces their impact on the other layers of the stack, including a free layer and an optional filter layer, which may include a polarizer layer or a precessional spin current magnetic layer. The reduction in stray magnetic fields in the stack increases the electrical and retention performance of the stack by reducing switching asymmetry in the free layer. The reduction in stray magnetic fields also may improve performance of a filter layer, such as a precessional spin current magnetic layer by reducing asymmetry in the dynamic magnetic rotation of that layer.

Abstract: The present application discloses an OLED display screen and a display apparatus including the display screen and a method of manufacturing the OLED display screen. The OLED display screen includes a flexible substrate, an OLED device and a packaging layer; wherein, the packaging layer includes a reinforcement part located in a predefined bending region of the display screen.

Abstract: Example implementations may relate to a cloud service that stores a detection metric corresponding to a maintenance request for a particular component. In particular, the cloud may receive sensor data from various robotic systems each having the particular component. The cloud may then determine, based on the sensor data, performance data for the particular component over time at the various robotic systems. The cloud may also determine various maintenance events for the particular component. Based on the performance data, the cloud may determine that at least one maintenance event occurs at other metrics that are different from the detection metric. Responsively, the cloud may adjust the detection metric based on a difference between the detection metric and the other metrics. The cloud may then detect operation of a particular robotic system at the adjusted detection metric and may responsively request maintenance for the particular component at the particular robotic system.

Abstract: There is herein described a low power consumption high brightness display. More particularly, there is described an integrated LED micro-display and a method of manufacturing the integrated LED micro-display.

Abstract: An organic light emitting diode package structure includes a first structure layer, a second structure layer, and a luminous layer disposed between the first structure layer and the second structure layer. Two recesses are formed by bending two respective opposite ends of the first structure layer. End sections of the second structure layer and the luminous layer are located in the two recesses. One of the first structure layer and the second structure layer is a substrate base layer, and the other is a package layer. An area of a display panel is thus increased.

Abstract: An adhesive sheet for laser dicing is provided that is capable of, in laser dicing by irradiation with laser light through the adhesive sheet, suppressing laser light scattering in the adhesive sheet while allowing easy chip division by expanding the adhesive sheet and enables inhibition of dust attachment during chip division for chip production in high yields. The present invention provides an adhesive sheet for laser dicing, including a substrate film having a back layer containing a friction reducing agent and an antistatic agent on one surface and having an adhesive layer on another surface, wherein the back layer has a surface with arithmetic mean roughness Ra of 0.1 ?m or less, the sheet has a tensile modulus of elasticity at 23° C. from 50 to 200 MPa, and the sheet has a parallel transmittance of 85% or more in a wavelength range from 400 to 1400 nm.

Abstract: The present invention provides a package structure with an embedded electronic component and a method of fabricating the package structure. The method includes: forming a first wiring layer on a carrier; removing the carrier and forming the first wiring layer on a bonding carrier; disposing an electronic component on the first wiring layer; forming an encapsulating layer, a second wiring layer and an insulating layer on the first wiring layer; disposing a chip on the electronic component and the second wiring layer; and forming a covering layer that covers the chip. The present invention can effectively reduce the thickness of the package structure and the electronic component without using adhesives.

Abstract: A semiconductor device including a transistor on a main surface side of a semiconductor substrate; and a resistance change element on a back-surface side of the semiconductor substrate, wherein the transistor includes a low-resistance section in the semiconductor substrate, the low-resistance section extending to the back surface of the semiconductor substrate, an insulating film is provided in contact with a back surface of the low-resistance section, the insulating film has an opening facing the low-resistance section, and the resistance change element is connected to the low-resistance section through the opening.

Abstract: A chip package including a substrate is provided. The substrate has a first surface and a second surface opposite thereto. The substrate includes a sensing or device region which is adjacent to the first surface. A recess is in the substrate. The recess extends from the second surface towards the first surface, and vertically overlaps the sensing or device region. A redistribution layer is electrically connected to the sensing or device region, and extends from the second surface into the recess. A method of forming the chip package is also provided.

Abstract: A semiconductor device includes a semiconductor substrate and first and second bipolar transistors. The semiconductor substrate includes first and second main surfaces opposing each other. The first bipolar transistor is formed on the first main surface of the semiconductor substrate and includes a first emitter layer. The second bipolar transistor is formed on the first main surface of the semiconductor substrate and includes a second emitter layer and a resistor layer. The resistor layer is stacked on the second emitter layer in a direction normal to the first main surface.

Abstract: An organic light emitting display device is provided according to the present disclosure. An organic light emitting display device comprising a first planarization layer configured to planarize an upper portion of a circuit element on a substrate, an inorganic layer comprising a first out-gassing pattern on the first planarization layer, a second planarization layer configured to planarize an upper portion of the inorganic layer and a metal layer comprising a second out-gassing pattern on the second planarization layer.

Abstract: The present disclosure provides a thin film transistor array substrate and a fabrication method thereof, and a display device. The thin film transistor array substrate includes an active layer. The active layer is formed using a zinc target under an environment of oxygen and nitrogen in a sputtering chamber. A source/drain buffer layer is formed on the active layer using the zinc target by a sputtering process in the sputtering chamber under an environment containing one of oxygen and nitrogen.

Abstract: The present invention is directed towards a thin-film device. In one embodiment, the thin film device comprises a scattering layer comprising a substrate, the substrate comprising a plurality of voids, and a device stock formed atop the scattering layer, wherein the plurality of voids have a high refractive index as compared to a refractive index of the substrate. Another embodiment of the present invention is directed towards a process for fabricating a thin-film device, the process comprising dissolving a precursor in an organic solvent to form a solution, coating the solution onto a substrate to form a film, immersing the film and the substrate into an antisolvent bath for a first period of time so as to form a plurality of air voids within the film, removing the film and substrate from the anti-solvent bath to dry and cure for a second period of time to create a porous film adhered to the substrate, the porous film and the substrate forming a scattering layer.