Abstract: A method and system for tuning a bulk acoustic wave device at the wafer level by adjusting the thickness of the device. In particular, the thickness of the device has a non-uniformity profile across the device surface. A mask having a thickness non-uniformity profile based partly on the thickness non-uniformity profile of the device surface is provided on the device surface for etching. A dry etching method is used to remove part of the mask to expose the underlying device surface and further removed the exposed device surface until the thickness non-uniformity of the device surface falls within tolerance of the device.

Abstract: A surface acoustic wave filter having compensated capacitive and inductive crosstalk between adjacent IDT input and output transducers includes electromagnetically coupled transducers split into partial transducers. The routing of the partial transducer pads is modified such that the flux directions of the magnetic couplings between the adjacent partial transducers are oppositely directed so that the total induced magnetic flux is zero. The partial transducers are connected in series or in parallel such that, in the case of symmetric operation, the crosstalk capacitances between adjacent pads and transducer surfaces are balanced at the corresponding port.

Abstract: An object of the present invention is to provide an NRD guide which can be used in a wide band in a state where output levels of distributed high-frequency signals are nearly equal and does not require precise positioning, thereby enhancing mass productivity thereof. The NRD guide comprises a first straight dielectric strip made of cordierite ceramics having a dielectric constant of 4.8 and a dielectric loss of 2.7×10−4 (at a measurement frequency of 77 GHz) and having a section of 1.0 mm width×2.25 mm height, and a second dielectric strip joined to the first dielectric strip at a midway position thereof so as to be branched along an arc and bent at an angle of 90°, wherein the first and second dielectric strips are integrally produced, and the radius of curvature r of a junction (branched portion) of the second dielectric strip is 12.7 mm, which is larger than the wavelength &lgr;≈5 mm of high-frequency signals of 60 GHz.

Abstract: An LC resonator includes insulation sheets and inductor patterns that are electrically connected through long via-holes provided in insulation sheets, so that tubular structures each having an insulator material disposed therein and having a substantially rectangular cross section are produced. The tubular structures are laminated through sheets to define an inductor having a double structure. A capacitor pattern is opposed to the open ends of the inductor patterns, respectively, to produce a capacitor. That is, the capacitor pattern is arranged between the tubular structures. The capacitor and the inductor having the double structure define an LC parallel resonance circuit.

Abstract: A differential conversion circuit for converting an unbalanced signal to a balanced signal is provided. The differential conversion circuit is arranged with primarily passive components, and so avoids introducing noise or other disturbances to the signal. The differential conversion circuit has a terminal input for receiving an unbalanced signal that is related to a communication input signal. An inductor and a resonating capacitor connect to the terminal input, and a coupling capacitor connects to the inductor. One differential output line is provided by the resonating capacitor, while the other differential output line is provided by the coupling capacitor. The output from the capacitors is thereby a pair of lines that provide a balanced differential signal which is deliverable to a balanced load.

Abstract: A conductive slip ring system functions to transfer information electrically between a moving frame and a stationary frame. The conductive slip ring system includes a conductive transmission line and a conductive probe. The conductive transmission line is attached to the stationary frame or the moving frame. The conductive transmission line includes a first portion and a second portion. The first portion includes a first end and a second end. The first end of the first portion is coupled to a first terminator. The second end of the first portion is coupled to a signal source through a first reflection path impedance matching resistor. The second portion includes a first end and a second end. The first end of the second portion is coupled to a second terminator and the second end of the second portion is coupled to the signal source through a second reflection path impedance matching resistor.

Abstract: A substrate-type non-reciprocal circuit element comprises a substrate, a ferrite embedded in the substrate, a central electrode formed on the ferrite at one principal surface of the substrate, a plurality of signal conductors formed on the one principal surface of the substrate to extend from the central electrode into a plurality of different outward directions, a first ground electrode formed on the one principal surface of the substrate, separately from the central electrode and the plurality of signal conductors, and a second ground electrode formed on the other principal surface of the substrate and electrically connected to the first ground electrode. Thus, the substrate-type non-reciprocal circuit element can be easily electrically connected to a measurement machine, to enable to precisely and easily measure an electrical characteristics with a good repeatability.

Abstract: A laminated LC filter having very large inductance and an excellent Q characteristic, includes insulation layers, inductor patterns having substantially the same shapes and capacitor patterns. The inductor patterns are laminated through the insulation layers, and constitute the inductor of the duplex structure. Similarly, the inductor patterns also constitute the inductor of the duplex structure. The capacitor patterns are opposite to the increased width portions of the inductor patterns, and define the capacitor. Similarly, the capacitor patterns are opposite to the increased width portions of the inductor patterns, and define the capacitor. The coupling capacitor pattern is located between the inductor patterns.

Abstract: A non-reciprocal circuit element includes a microstrip TMn10 resonator (n is a positive integer) with a metal disk and branches projecting from the metal disk in a trigonally symmetric structure, and a ferrite magnetic body spontaneously magnetized and coaxially disposed on the microstrip TMn10 resonator. The metal disk and the branches are formed on a non-magnetic dielectric board having a ground conductor on its bottom face. The ferrite magnetic body is arranged so that a position of an electric field node matches to one of the branches.

Abstract: A monolithic LC resonator includes insulation sheets and inductor patterns that are electrically connected through long via-holes formed in the insulation sheets. The long via-holes are arranged along the right edge and left edge of the inductor patterns, respectively. The inductor patterns and the long via-holes define an inductor having a tubular structure with a substantially rectangular cross-section and filled with an insulator therein. A capacitor pattern is opposed to the open ends of the inductor patterns through the sheets, respectively, to define a capacitor. That is, the capacitor pattern is laminated inside of the tubular structure of the inductor. The capacitor and the inductor having the tubular structure define an LC parallel resonance circuit.

Abstract: An EMI attenuation device comprising at least two substrates such that the spacing between these substrates is selected to maximize shielding performance at a particular frequency. The device further comprises additional substrates arranged at predetermined distances from the first two substrates to optimize shielding performance. A method also is provided for a multistep, attenuation of impinging EMI, wherein the method also enables see-through and/or hear-through monitoring. Salient features of the method include relatively positioning a plurality of electrically conductive substrates, each of a particular topology, so as to maximize attenuation of the EMI at particular frequencies.

Abstract: The invention is a cancellation circuit that suppresses electromagnetic interference in a high speed circuit, which achieves the objects of canceling the magnetic field and coupling the electric field through a differential signal under the premise of not affecting the signal quality. The differential signal is generated from the original high speed circuit using a phase shifter. Suitable phase shifters include a same-layer type, a meander type and a different-layer stacking type.

Abstract: A high power adjustable rf coupling loop which is used to interface a transmission line to a resonant cavity is described. The coupling loop is made entirely of metallic parts and therefore is ideal for high power rf applications. Contrary to all existing loops it does not require water cooling Among the unique features of this loop is the fact that it is adjustable. Subsequently the combined impedance of the loop and cavity can be adjusted to match perfectly with the line impedance rendering almost zero reflected power.

Abstract: A circuit package for a microwave signal comprises a substrate defining a MMIC surface of the substrate and an opposing non-MMIC surface of the substrate. The substrate is devoid of signal carrying vias. A waveguide is disposed on the MMIC surface of the substrate. A MMIC is disposed on the MMIC surface of the substrate, and the MMIC is in electrical communication with the waveguide. An I/O port is in electrical communication with the waveguide wherein a transmission path for the signal is provided from the I/O port, through the waveguide and to the MMIC. In an alternative exemplary embodiment of the invention, the I/O port of the circuit package is electrically connectable to a PC board. The MMIC surface of the substrate faces the PC board when the I/O port is electrically connected to the PC board.

Abstract: An integrated filter circuit and a method of fabrication are disclosed, wherein the integrated filter has an input and an output parasitic shunt impedance. Input and output electrical components are coupled to the input and output terminals, respectively, to reduce the input and output parasitic shunt impedances. The input and output electrical components each include one of a coil, a section of transmission line, a coil and tuneable capacitance connected in a series tuned circuit, or a coil and tuneable capacitance connected in a parallel tuned circuit.

Abstract: A laminated LC filter has an excellent Q characteristic and includes at least three LC resonators. Each of the LC resonators includes an inductor pattern and a capacitor pattern. The pattern widths of the inductor patterns of the LC resonator located at the approximate center portion are wider than the pattern widths of the inductor patterns of the LC resonators located at both ends.

Abstract: In a differential surface acoustic wave resonator, when an unbalanced electric signal is inputted between an input terminal 301 and an output terminal connected to a ground potential, this electric signal is inputted to two-terminal-pair surface acoustic wave resonators 351 and 352. The electric signal inputted to the two-terminal-pair surface acoustic wave resonator 351 is converted into a surface acoustic wave, and thereafter it is again converted into an electric signal to be outputted to a two-terminal-pair surface acoustic wave resonator 353. The electric signal inputted to the two-terminal-pair surface acoustic wave resonator 353 is converted into a surface acoustic wave, and thereafter it is again converted into an electric signal to be outputted from an output terminal 302 of the differential surface acoustic wave filter as a balanced signal.

Abstract: A stacked LC filter includes a layered body defined by a plurality of insulating layers, a plurality of inductor patterns, and a plurality of capacitor patterns in a stacked arrangement At least three LC resonators are disposed in the layered body including a plurality of inductors, which are defined by the inductor patterns, and a plurality of capacitors, which are defined by the capacitor patterns disposed so as to face the inductor patterns. At least two coupling capacitor patterns are stacked in the layered body and are arranged to couple the LC resonators. A pole adjusting pattern is stacked in the layered body and faces the at least two coupling capacitor patterns.

Abstract: A better impedance match between a signal transmitting component and a signal transmitting component circuit in a semiconductor circuit is achieved by controlling the parameters of the conducting path coupling the signal transmitting and receiving components. The parameters are controlled such that the portion of the conducting path coupled to the transmitting component has a characteristic impedance generally matching the output impedance of the transmitting component and the portion of the conducting path coupled to the signal receiving component has a characteristic impedance generally matching the input impedance of the signal receiving component. The impedance in portions of the conducting path can controlled by varying the geometric cross-section of the conducting path, the composition of the portion of the conducting path, and/or the amount or nature of the doping of the portion of the conducting path.

Abstract: A &lgr;/2 resonator comprises an inner conductor formed hole having an inner conductor with both open-ends, formed therein, and &lgr;/4 resonators comprise inner conductor formed holes having inner conductors with one short-circuited ends and the other open ends, respectively. The resonators are coupled, whereby a terminal electrode connected to the vicinity of the one open end of one of the &lgr;/4 resonators functions as an unbalanced terminal, and terminal electrodes connected to both open ends of the &lgr;/2 resonator function as balanced terminals.