Abstract: An expansion card mounting apparatus includes a rear panel (14) defining an opening (16), a mounting frame (20) attached to the rear panel around the opening, a pressing body (30) pivotably mounted to the mounting frame, and two retention members (40) attached to opposite sides of the mounting frame. The mounting frame includes a support plate (22) for supporting an end portion (122) of a slot cover (120) of an expansion card (100). Each retention member defines a retention portion (40B) having a protrusion (44) formed thereon. When the pressing body is pivoted to an engaging position in which the pressing body presses the end portion against the support plate, the protrusion snappingly engages with opposite ends of the pressing body so as to retain the pressing body in said engaging position.

Abstract: An electrical assembly comprising a circuit board an electrical device, and a heat dissipation device. The electrical device is capable of emitting thermal energy and electromagnetic interference (EMI). The electrical device is secured to the circuit board. The heat dissipation device is secured to the circuit board and is in thermal communication with the electrical device. The heat dissipation device also includes a continuous EMI fence and a plurality of fins disposed in a matrix orientation. The fins are spaced from one another to allow for efficient heat dissipation and have a substantially square cross-sectional shape.

Abstract: A solder mask defined bond pad or a non-solder mask defined bond pad may be configured to center the solder over the bond pad using either surface attractive forces or capillary action. In some embodiments, a stub trace may be provided, for example, in opposition to the real trace to provide a capillary counter-attractive force on the solder. In other embodiments, the surface attractive action of the edge of the solder mask may be utilized to center the solder. In still other embodiments, the natural attractive force of a trace on solder may be utilized to appropriately position solder where desired, for example, to line up with other solder deposits.

Abstract: A server and data stored in a memory element or a storage medium can be protected from harmful electromagnetic waves from the outside. Shield fingers are arranged along the circumferences of openings of a front door 16 of an upper main body 12 housing servers and a router in an internal space 27. In addition, a shield finger is arranged along the circumference of an opening of a lower front door 18 of a lower main body housing a main body of an electric circuit component such as filter 26. The main bodies and the doors are made of steel and have predetermined thicknesses (40 mm in a bent portion and 21 mm in other portions). In addition, an optical fiber is used as a data line, which is led in an internal space 27 of the upper main body through a conduit 40.

Abstract: Disclosed is a device and method of attaching a housing unit, particularly an instrument cluster housing, to an IP retainer without the necessity of attaching the bottom edge of said housing with fasteners such as screws and the incumbent requirement for fastener driver and driver operator access. This achieved by providing at least one snap-in attachment member on the bottom edge of the housing. The attachment member terminating in a mounting pin mounted in corresponding pin mounts provided in the receiving IP retainer.

Abstract: A printed circuit board includes a dielectric layer and an area array of contact elements extending above a first surface of the dielectric layer. Each contact element includes a conductive portion disposed to engage a respective pad of a land grid array module for providing electrical connection to the land grid array module. The land grid array module can include a land grid array package or a second printed circuit board. In one embodiment, the contact elements are selected from the group of contact types including metal springs, bundled wires, metal in polymer, and solid metal tabs. In another embodiment, a contact element in the area array includes a base portion of conductive material and an elastic portion of conductive material formed integrally with the base portion whereby the elastic portion extends from the base portion and protrudes above the first surface of the dielectric layer.

Abstract: Mounting structures for facilitating fast and easy installation and/or removal of electronics components into or out of a computer system are disclosed. The mounting structures include a base and a stackable mounting structure. Each mounting structure generally includes generally parallel and opposing spacers, tapered supports extending from the spacers to engage holes defined on a surface of an electronics component, and a base portion extending between being generally orthogonal to the spacers. The spacers may define orifices to facilitate securing the mounting structure and the electronics component to an electronics base via, e.g., a hook and loop material. The stackable mounting structure may include sharp points and angled legs to also engage the electronics component below.

Abstract: An electromagnetic shield structure (100) has an elongated conductive wall (102) that continuously or discontinuously defines a shielding perimeter and has a flange (104) laying over laterally to form a J-shaped hook (106) in cross section. A conductive cover or lid (108) engages over the standing wall (102) and has a depending side wall skirt (110) that has a flange (112) and forms a J-shaped hook (114) facing opposite from the hook (106) of the elongated wall (102). The cover (108) is pressed onto the wall (102) for assembly, causing the flanges (104) and (112) to deflect and snap over one another in the space between the overlapping skirt (110) and wall (102). The shield enclosure (122) can be disassembled without damage by applying a tool (116) through an opening (118) in the outer one of either the skirt (110) or wall (102), to deflect and disengage the flanges (104) and (112) in the space between the overlapped skirt (110) and wall (102).

Abstract: The present invention concerns a control device for electronic apparatus of the electronic stem type, adapted to be shifted between a plurality of axial positions. According to one preferred embodiment, the stem (1), with axis X, has four different axial positions. Two contact clips (21, 22, 60, 61) mutually offset in the direction of the axis X are provided to make contact with two respective power supply terminals (19, 20, 75, 76) of a source of electrical power supply. The stem comprises a plurality of cylindrical portions (36, 38, 50, 51, 52) which cooperate with deformable extensions (27, 28, 64, 65) of the contact clips to deform them in a direction substantially perpendicular to the axis X. Thus, in accordance with the axial position of the stem (1), the contact clips (21, 22, 60, 61) can be in different electrical states, i.e. isolated or connected to the source of power supply, independently of one another.

Abstract: A mounting apparatus for mounting a motherboard (30) having several first mounting holes (33) includes a chassis (10), a fixing member (70), and a supporting tray (50). The chassis comprised a post (24) protruding from a bottom wall (12) thereof, and a number of standoffs (18) received in first the mounting hole. The fixing member is slidably mounted to the post, and includes an engaging portion (82) protruding from a lower portion thereof. The supporting tray is attached to the motherboard, and includes a slice (66) projecting from a side portion thereof. When the engaging portion of fixing member engages with the slice of supporting tray, the motherboard is in a locked state; when the engaging portion of fixing member disengages from the slice of supporting tray, the motherboard is in an unlocked state.

Abstract: A low alternating current loss superconducting cable is provided, including a plurality of superconducting tapes spirally wound around a longitudinally extending core. The tapes are provided in a path between about 5° and 85° relative to the longitudinal axis of the core such that the tape completely covers the surface of the core. The tapes are generally parallel to each other and include first and second tapes that are adjacent to each other. The first and second tapes partially overlap each other.

Abstract: A heat dissipating microdevice includes a board, a fluid microsystem, and a coolant. The board includes an insulator layer that has first and second surfaces, a conductor layer formed on the first surface, and a cover member disposed on the second surface. The fluid microsystem is formed in the insulator layer of the board, and includes first and second micro-channel structures, and first and second micro-conduit structures that permit fluid communication between the first and second micro-channel structures. The coolant is contained in the fluid microsystem, and flows from the second micro-channel structure to the first micro-channel structure through the first micro-conduit structure, and from the first micro-channel structure back to the second micro-channel structure through the second micro-conduit structure.

Abstract: A memory device has a variable storage capacity depending on the object of use by a user, thereby improving convenience in use of the device. The memory device has a casing which may be loaded into host equipment. The casing has a plural number of loading sections in each of which a memory chip can be mounted. The casing carrying the memory chips has a terminal unit at the end insertable in the host equipment. Data readout from or writing into the memory chip is controlled by a semiconductor unit forming a control circuit disposed in the casing. The memory device may be of a recording capacity as desired by a user by changing the number of the memory chips mounted in the loading sections or by mounting memory chips of variable recording capacities in the loading sections.

Abstract: The invention pertains to a chip module 20 and a method for producing a chip card module that comprises a chip module with a chip carrier 21 and a chip 22 that is contacted with strip conductors 25, 26 of the chip carrier, wherein the chip carrier comprises a flexible carrier material and the strip conductors respectively extend over the length of the carrier substrate, and wherein the chip carrier 21 contains two longitudinal regions 35, 36 of identical length which are offset relative to one another in the longitudinal direction of the chip carrier and respectively assigned to one strip conductor 25, 26.

Abstract: An electronics assembly, for example for use as a network server, comprises a frame that encloses a number of components of the assembly, a facia panel that is attached to a surface of the frame, and is formed as an upper and a lower part that are retained together generally horizontally. The assembly includes a printed circuit board for providing information relating to the assembly, the printed circuit board being located within the facia panel between the two parts. The frame and the fascia panel have a locating element at each side of the fascia panel for ensuring correct positioning of the panel with respect to the frame.

Abstract: A sun dial including a housing, a light detector mounted on the housing exposed to detect ambient light, a logic circuit mounted in the housing for processing the detected light for determining over a preselected period of time the average light detected by the light detector, and an indicator to indicate upon demand, the average light detected during the preselected period of time. A method for determining average light detected over a period of time by detecting light above a preselected threshold indicative of darkness, while noting the time of darkness, adjusting the period of time by subtracting the time of darkness from the period of time, calculating the average light detected over the adjusted period of time, and giving a visual indication of the average light detected.

Abstract: A mounting apparatus for mounting a motherboard (70) having several first mounting holes (73) includes a chassis (10), a fixing member (30), and a supporting member (50). The chassis comprised a post (13) protruding from a bottom wall (11) thereof, and a number of standoffs (17) received in first the mounting hole. The fixing member is slidably mounted to the post, and includes a first engaging portion (35) protruding from a middle portion thereof. The supporting member is attached to the motherboard, and includes a second engaging portion (57) projecting from an end thereof. When the first engaging portion of the fixing member engages with the second engaging portion of the supporting member, the motherboard is in a lock state; when the first engaging portion of the fixing member disengages from the second engaging portion of the supporting member, the motherboard is in an unlock state.

Abstract: An intermediate jointing structure having excellent mechanical and electrical characteristics and method of preparing the same. The intermediate jointing structure includes a metal pipe and a jointing sleeve. The metal pipe is inserted between a pair of superconducting cables and is fixed to the formers by welding. A plurality of superconductor wires, shorter than the conductive metal tube, are arranged around a conductive metal tube in a longitudinal direction. The arranged superconductor wires are taped with Ag tape so as to form the jointing sleeve. The jointing sleeve is jointed and fixed on an outer surface of the metal pipe.

Abstract: A circuit board securing device for a computer case includes a computer case, on a base panel of which are separately disposed vertical protruding beams. An elastic leaf is affixed to a side wall surface of each of the protruding beams. An end portion of each of the elastic leaves forms a vertical top abutting wall, a front portion of which is configured with a raising member. A rear abutting wall is formed on a side of the top abutting wall, and a clamping groove is formed between the top abutting wall and the rear abutting wall. Protruding holding bodies, between which are defined securing grooves, are formed on the base panel, and an opening of each of the securing grooves corresponds to an opening of each of the clamping grooves, thereby securing a circuit board without applying screws, enabling fast clamping and disassembling of the circuit board.

Abstract: A multi use circuit module has a front half module. The front half module is a functional circuit module having electrical contacts on a front portion there of for electrically coupling the multi use circuit module to a host device. A rear half module is removably coupled to the front half module. The rear half module increases functionality of the multi use circuit module by allowing functional and non functional components to be coupled to the front half module.