Patents Examined by Karen B Addison
  • Patent number: 11309861
    Abstract: Embodiments of a Surface Acoustic Wave (SAW) device having a guided SAW structure that provides spurious mode suppression and methods of fabrication thereof are disclosed. In some embodiments, a SAW device includes a non-semiconductor support substrate, a piezoelectric layer on a surface of the non-semiconductor support substrate, and at least one interdigitated transducer on a surface of the piezoelectric layer opposite the non-semiconductor support substrate. A thickness of the piezoelectric layer, a SAW velocity of the piezoelectric layer, and an acoustic velocity of the non-semiconductor support substrate are such that a frequency of spurious modes above a resonance frequency of the SAW device is above a bulk wave cut-off frequency of the SAW device. In this manner, the spurious modes above the resonance frequency of the SAW device are suppressed.
    Type: Grant
    Filed: September 13, 2018
    Date of Patent: April 19, 2022
    Assignee: Qorvo US, Inc.
    Inventors: Shogo Inoue, Marc Solal
  • Patent number: 11271542
    Abstract: An acoustic wave device includes: a mounting substrate; a first wiring layer located on an upper surface of the mounting substrate, the first wiring layer including a first bond region and a first connection region connecting with the first bond region and having a thickness substantially equal to a thickness of the first bond region; an element substrate mounted on the mounting substrate; an acoustic wave element located on a lower surface of the element substrate; and a second wiring layer located on the lower surface of the element substrate, the second wiring layer including a second bond region and a second connection region, the second bond region directly bonding with the first bond region of the first wiring layer, the second connection region connecting the acoustic wave element with the second bond region and having a thickness substantially equal to a thickness of the second bond region.
    Type: Grant
    Filed: August 25, 2017
    Date of Patent: March 8, 2022
    Assignee: TAIYO YUDEN CO., LTD.
    Inventor: Takashi Yamashita
  • Patent number: 11192140
    Abstract: According to one embodiment, a transducer includes a first electrode, a second electrode, a third electrode, a first piezoelectric portion, and a second piezoelectric portion. A resistor and an inductor are connected to the second electrode. The first piezoelectric portion is provided between the first electrode and the third electrode. The second piezoelectric portion is provided between the second electrode and the third electrode. A ratio of the absolute value of a difference between a first resonant frequency and a second resonant frequency to the first resonant frequency is 0.29 or less. The first resonant frequency is mechanical. The first resonant frequency is of the first piezoelectric portion and the second piezoelectric portion. The second resonant frequency is of a parallel resonant circuit. The parallel resonant circuit includes an electrostatic capacitance, the inductor, and the resistor. The electrostatic capacitance is between the second electrode and the third electrode.
    Type: Grant
    Filed: August 31, 2017
    Date of Patent: December 7, 2021
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Tomio Ono, Kazuhiro Itsumi
  • Patent number: 10917024
    Abstract: A vibration-type drive apparatus, which increases productivity and also prevents undesired vibration from occurring during operation, includes an elastic body, a vibrating body having an electro-mechanical energy conversion element mounted on the elastic body, a driven body that is brought into pressure contact with the vibrating body, and a pressurizing member that brings the driven body into pressure contact with the vibrating body. Relative positions of the vibrating body and the driven body change due to vibrations excited in the vibrating body. The pressurizing member has a positioning portion, and the driven body has a fitting-receiving portion that is to be fitted onto the positioning portion. During operation, the positioning portion and the fitting-receiving portion are not in contact with each other.
    Type: Grant
    Filed: October 30, 2015
    Date of Patent: February 9, 2021
    Assignee: Canon Kabushiki Kaisha
    Inventor: Kei Suefuji
  • Patent number: 10910548
    Abstract: An ultrasonic device includes: an element substrate including an ultrasonic transducer and a first connection electrode connected to the ultrasonic transducer; a reinforcing plate that is bonded to the element substrate to reinforce the element substrate; and a second connection electrode provided on the reinforcing plate. The first and second connection electrodes are connected to each other in a bonding portion between the element substrate and the reinforcing plate.
    Type: Grant
    Filed: February 9, 2017
    Date of Patent: February 2, 2021
    Inventor: Chikara Kojima
  • Patent number: 10897004
    Abstract: A piezoelectric drive device including: laminated piezoelectric element including a first end face and a second end face opposed to the first end face; a weight member attached to the first end face; and a shaft attached to the second end face, in which a moving member, engaged to the shaft movable in an axial direction, is moved by activating the laminated piezoelectric element. Inside the laminated piezoelectric element, a first internal electrode and a second internal electrode, respectively having a plane surface approximately perpendicular to the first end face and the second end face, are laminated in Y axial direction, approximately perpendicular to the first internal electrode and the second internal electrode with a piezoelectric layer in-between. The piezoelectric drive device, in which the laminated piezoelectric element is difficult to bend, even when the load is applied to the shaft from a lateral direction, is provided.
    Type: Grant
    Filed: September 5, 2017
    Date of Patent: January 19, 2021
    Assignee: TDK CORPORATION
    Inventors: Mitsunao Homma, Masahiro Hosokawa
  • Patent number: 10873314
    Abstract: Embodiments of a Surface Acoustic Wave (SAW) device having a guided SAW structure that provides spurious mode suppression and methods of fabrication thereof are disclosed. In some embodiments, a SAW device includes a non-semiconductor support substrate, a piezoelectric layer on a surface of the non-semiconductor support substrate, and at least one interdigitated transducer on a surface of the piezoelectric layer opposite the non-semiconductor support substrate. A thickness of the piezoelectric layer, a SAW velocity of the piezoelectric layer, and an acoustic velocity of the non-semiconductor support substrate are such that a frequency of spurious modes above a resonance frequency of the SAW device is above a bulk wave cut-off frequency of the SAW device. In this manner, the spurious modes above the resonance frequency of the SAW device are suppressed.
    Type: Grant
    Filed: September 13, 2018
    Date of Patent: December 22, 2020
    Assignee: Qorvo US, Inc.
    Inventors: Shogo Inoue, Marc Solal
  • Patent number: 10855206
    Abstract: Disclosed is a piezoelectric rotary drive for a shaft, which includes a piezoelectric actuator, a deformable frame that can be coupled with a coupling section to the shaft in a force-fit manner in order to accomplish a stick-slip drive, and a loading device which can apply a preloading force to the coupling section and/or the actuator and/or the shaft. To facilitate production and assembly, the loading device can be a leaf spring which in the relaxed state extends substantially in a plane, such as along a straight line.
    Type: Grant
    Filed: May 9, 2016
    Date of Patent: December 1, 2020
    Assignee: PHYSIK INSTRUMENTE (PI) GMBH & CO. KG
    Inventors: Reinhard Hübner, Hansjörg Luckert
  • Patent number: 10825979
    Abstract: A piezoelectric element includes: a substrate; a first electrode which is disposed on the substrate; a piezoelectric body layer which is disposed on the first electrode, which has a plurality of layers configured to contain a piezoelectric body material, and in which the total thickness of the plurality of layers is within a range of 1.6 ?m to 10 ?m; and an intermediate layer which is disposed on an interlayer of the piezoelectric body layer, and which is configured to contain titanium.
    Type: Grant
    Filed: August 28, 2017
    Date of Patent: November 3, 2020
    Assignee: Seiko Epson Corporation
    Inventors: Tomokazu Kobayashi, Mitsumi Kishida, Tsutomu Asakawa
  • Patent number: 10825982
    Abstract: A piezoelectric Micro-Electro-Mechanical Systems (MEMS) device comprising: a physical element; and a piezoelectric sensor element, with the physical element positioned in proximity to a moving portion of the piezoelectric sensor element, and with proximity of the physical element to the moving portion reducing a probability of breakage of the piezoelectric sensor element by limiting an excursion of the piezoelectric sensor element, relative to a probability of breakage of the piezoelectric sensor element in another piezoelectric MEMS device without the physical element.
    Type: Grant
    Filed: September 11, 2015
    Date of Patent: November 3, 2020
    Assignee: Vesper Technologies Inc.
    Inventors: Robert J. Littrell, Karl Grosh, Craig Core, Yu Hui, Wang Kyung Sung
  • Patent number: 10818834
    Abstract: A mounting structure includes a first substrate which has a first surface on which a functional element is provided, a second substrate that has a second surface facing the first surface, a wiring portion that is provided at a position which is different from a position of the functional element on the first surface, has a third surface facing the second surface, and is electrically connected to the functional element, and a conduction portion that is provided on the second surface, protrudes toward the first surface, and is connected to the third surface so as to be electrically connected to the functional element, in which an area of the third surface is larger than an area of a first end section of the wiring portion on the first substrate side in a plan view which is viewed from a thickness direction of the first substrate and the second substrate.
    Type: Grant
    Filed: August 11, 2017
    Date of Patent: October 27, 2020
    Assignee: Seiko Epson Corporation
    Inventors: Hironori Suzuki, Hiroshi Matsuda, Koji Ohashi
  • Patent number: 10819313
    Abstract: There are disclosed various apparatuses and methods for tuning a resonance frequency. In some embodiments there is provided an apparatus (200) comprising at least one input electrode (202, 204) for receiving radio frequency signals; a graphene foil (210) for converting at least part of the radio frequency signals into mechanical energy; at least one dielectric support element (212) to support the graphene foil (210) and to space apart the at least one input electrode (202, 204) and the graphene foil (210). The graphene foil (210) has piezoelectric properties. In some embodiments there is provided a method comprising receiving radio frequency signals by at least one input electrode (202, 204) of an apparatus (200); providing a bias voltage to the apparatus (200) for tuning the resonance frequency of the apparatus (200); and converting at least part of the radio frequency signals into mechanical energy by a graphene foil (210) having piezoelectric properties.
    Type: Grant
    Filed: March 11, 2013
    Date of Patent: October 27, 2020
    Assignee: Lyten, Inc.
    Inventor: Martti Voutilainen
  • Patent number: 10804878
    Abstract: There are provided an acoustic resonator module, and a method of manufacturing the same. An acoustic resonator module includes a resonating part disposed on a substrate and an inductor electrically connected to the resonating part, and having at least a portion disposed to be spaced apart from the substrate.
    Type: Grant
    Filed: September 26, 2016
    Date of Patent: October 13, 2020
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: June Kyoo Lee, Chul Soo Kim, Won Kyu Jeung
  • Patent number: 10801373
    Abstract: A lead screw actuator device includes a base configured to support a plurality of actuators. A first bridge is supported by one of the plurality of actuators and a second bridge is supported by another one of the plurality of actuators. A nut is supported by the first bridge and the second bridge and is rotatably coupled to a screw with a sliding contact friction between the screw and the nut. The plurality of actuators generate small movements of the first bridge, the second bridge, and the nut that produce relative rotation between the nut and the screw. A method of making a lead screw actuator device is also disclosed.
    Type: Grant
    Filed: February 9, 2017
    Date of Patent: October 13, 2020
    Assignee: NEW SCALE TECHNOLOGIES, INC.
    Inventor: David A. Henderson
  • Patent number: 10802588
    Abstract: Methods, systems, and apparatuses for micro actuators are presented. In some embodiments, a micro actuator can comprise a substrate coupled to an actuation member. A corrugating portion of the substrate in a first state can be uncontracted to form a substantially planar surface and in a second state can be contracted along a dimension parallel to the planar surface. The actuation member can be at least partially rigid. The micro actuator can be configured to move the actuation member relative to the corrugating portion upon a change in state of the corrugating portion. At least a layer of the substrate can be unitary and the actuation member can include at least a portion of the layer. The substrate can comprise a conducting polymer film.
    Type: Grant
    Filed: September 17, 2015
    Date of Patent: October 13, 2020
    Assignee: QUALCOMM Incorporated
    Inventor: Russel Allyn Martin
  • Patent number: 10790797
    Abstract: An acoustic resonator includes: a substrate; a resonance part mounted on the substrate and including resonance part electrodes, the resonance part being configured to generate acoustic waves; a cavity disposed between the resonance part and the substrate; a frame part disposed on at least one electrode among the resonance part electrodes, and being configured to reflect the acoustic waves; and a connection electrode configured to connect the at least one electrode to an external electrode, and having a thickness less than a thickness of the at least one electrode.
    Type: Grant
    Filed: September 23, 2016
    Date of Patent: September 29, 2020
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Won Han, Moon Chul Lee, Jae Chang Lee, Sang Uk Son, Tae Hun Lee
  • Patent number: 10790798
    Abstract: An acoustic resonator includes a substrate having via holes provided therein and having a membrane structure formed on a first surface of the substrate, and a cap accommodating the membrane structure and bonded to the substrate. The cap includes a support block in contact with the membrane structure.
    Type: Grant
    Filed: September 27, 2016
    Date of Patent: September 29, 2020
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jeong Suong Yang, Sang Hyun Yi, Ho Joon Park, Yeong Gyu Lee
  • Patent number: 10784434
    Abstract: A piezoelectric element includes a plate-shaped piezoelectric body having one principal face and the other principal face which are opposite to each other; and a first surface electrode mounted on the one principal face and a second surface electrode mounted on the other principal face, at least one of the first surface electrode and the second surface electrode including a center part and a peripheral part which is greater in thickness than the center part, the peripheral part having a thicker region and a thinner region which is thinner than the thicker region.
    Type: Grant
    Filed: April 20, 2016
    Date of Patent: September 22, 2020
    Assignee: KYOCERA Corporation
    Inventor: Hidekazu Sanada
  • Patent number: 10772603
    Abstract: An ultrasound probe comprising a housing, a transducer assembly operable to transmit ultrasonic energy towards a zone of the probe adapted to be acoustically coupled to an object or area of interest, a cooling system comprising a heat transfer device arranged to transfer heat generated by the transducer assembly to one or more regions or areas located outside such transducer assembly. The heat transfer device comprises graphene.
    Type: Grant
    Filed: July 27, 2015
    Date of Patent: September 15, 2020
    Assignee: Esaote S.p.A.
    Inventors: Lorenzo Spicci, Paolo Palchetti, Francesca Gambineri
  • Patent number: 10775583
    Abstract: A value obtained by adding an output of a speed feedforward calculation unit that uses a speed calculated from a change over time in an instruction value to a stage downstream from a feedback calculation unit that uses a positional deviation is used as a control amount, and at least one of an elliptic ratio of elliptical motion and a driving direction is controlled.
    Type: Grant
    Filed: July 11, 2016
    Date of Patent: September 15, 2020
    Assignee: Canon Kabushiki Kaisha
    Inventor: Jun Sumioka