Abstract: A memory cell of a non-volatile memory includes a select transistor, a floating gate transistor, a first capacitor, a switching transistor and a second capacitor. A first drain/source terminal of the select transistor is connected with a source line. A gate terminal of the select transistor is connected with a word line. The two drain/source terminals of the floating gate transistor are respectively connected with a second drain/source terminal of the select transistor and a bit line. The first capacitor is connected between a floating gate of the floating gate transistor and an erase node. The two drain/source terminals of the switching transistor are respectively connected with the erase node and an erase line. The gate terminal of the switching transistor is connected with a control line. The second capacitor is connected between the erase node and a boost line.

Abstract: A semiconductor structure for a phase-change memory device includes a heater element on a portion of a bottom electrode in a first dielectric material. The semiconductor structure includes a layer of phase-change material that surrounds a portion of a second dielectric material, where the layer of phase-change material forms a three-dimensional shape around the portion of the second dielectric material. A conductive liner is under a first portion of the layer of phase-change material and surrounds a portion of a bottom surface of a hardmask layer and vertical portions of the hardmask layer. A conductive material is on a portion of a top surface of the second dielectric material and abuts the vertical portions of the layer of phase-change material below the conductive liner and the hardmask layer. A top electrode is on a top surface of the conductive material.

Abstract: An operating method of a memory device includes: acquiring an address of a first bad word line, the first bad word line included in a plurality of word lines of the memory device; detecting whether word lines adjacent to the first bad word line are bad based on the address of the first bad word line, the word lines adjacent to the first bad word line included in the plurality of word lines; designating a first word line among the word lines adjacent to the first bad word line as a prohibited word line, the first word line being detected as a second bad word line; and sending first data via a second word line among the word lines adjacent to the first bad word line, the second word line being detected as a normal word line.

Abstract: A memory cell arrangement is provided that may include: one or more memory cells, each memory cell of the one or more memory cells including: a field-effect transistor structure; a plurality of first control nodes; a plurality of first capacitor structures, a second control node; and a second capacitor structure including a first electrode connected to the second control node and a second electrode connected to a gate region of the field-effect transistor. Each of the plurality of first capacitor structures includes a first electrode connected to a corresponding first control node of the plurality of first control nodes, a second electrode connected to the gate region of the field-effect transistor structure, and a spontaneous-polarizable region disposed between the first electrode and the second electrode of the first capacitor structure.

Abstract: A memory device including memory cells and edge cells is described. In one example, the memory device includes: an array of memory cells used for data storage; a plurality of first edge cells not used for data storage; and a plurality of second edge cells not used for data storage. The plurality of first edge cells and the plurality of second edge cells are arranged respectively at two opposite sides of the array of memory cells. At least one edge cell, among the plurality of first edge cells and the plurality of second edge cells, comprises a circuit configured for controlling the array of memory cells to enter or exit a power down mode.

Abstract: A memory circuit includes a first driver circuit, a memory cell array including a first column of memory cells, a first transistor coupled between the first driver circuit and the memory cell array, a second driver circuit, a first column of tracking cells and a header circuit coupled to the first driver circuit and the second driver circuit. The first transistor is configured to receive a first select signal. The first column of tracking cells is configured to track a leakage current of the first column of memory cells, and is coupled between a first conductive line and a second conductive line, the first conductive line being coupled to the second driver circuit.

Abstract: A data semiconductor device with a long retention time is provided. The semiconductor device includes a first transistor, a second transistor, a ferroelectric capacitor, a first capacitor, and a memory cell. Note that the memory cell includes a third transistor. A first gate of the first transistor is electrically connected to a first terminal of the ferroelectric capacitor, and a first terminal of the first transistor is electrically connected to a second gate of the first transistor and a first terminal of the second transistor. A second terminal of the second transistor is electrically connected to a second terminal of the ferroelectric capacitor and a first terminal of the first capacitor. A back gate of the third transistor is electrically connected to the first terminal of the first transistor. In the above structure, the threshold voltage of the third transistor can be increased by supplying a negative potential to the first terminal of the first transistor.

Abstract: In some aspects of the present disclosure, a memory device is disclosed. In some aspects, the memory device includes a first voltage regulator to receive a word line voltage provided to a memory array; a resistor network coupled to the first voltage regulator to provide an inhibit voltage to the memory array, wherein the resistor network comprises a plurality of resistors and wherein each of the resistors are coupled in series to an adjacent one of the plurality of resistors; and a switch network comprising a plurality of switches, wherein each of the switches are coupled to a corresponding one of the plurality of resistors and to the memory array via a second voltage regulator.

Abstract: The present disclosure provides an electronic circuit, a memory device, and a method for operating an electronic circuit. An electronic circuit comprises a driver circuit configured to provide a drive voltage to a word line of the electronic circuit, a suppression circuit electrically connected to the driver circuit and the word line, and a control circuit electrically connected to the suppression circuit. The suppression circuit is configured to generate a voltage drop in the drive voltage. The control circuit controls the suppression circuit.

Abstract: A sense amplifier circuit, memory device and related operation methods are provided. The sense amplifier circuit includes an amplification circuit for amplifying a voltage signal and a compensation circuit coupled to the amplification circuit. The amplification circuit includes a first inverting amplifier and a second inverting amplifier cross-coupled with each other, with the first inverting amplifier connected to a first bitline and the second inverting amplifier connected to a second bitline. The compensation circuit includes a first, a second, a third, and a fourth switch circuits, and is configured to generate a compensation voltage between the first bitline and the second bitline by conducting charge injections through operating the switch circuits to compensate an input-referred offset voltage of the amplification circuit.

Abstract: Methods, systems, and devices for coding to decrease error rate discrepancy between pages are described. For example, to identify a unit-distance code for operating a memory device, voltage drifts of a set of read voltages after a duration may be identified and each of the read voltages may be mapped to one of a set of pages of the memory cell using various possible unit-distance codes. Thus, for each unit-distance code the set of pages may be associated with respective subsets of the set of read voltages. Then, for each unit-distance code a set of average read voltage drifts corresponding to one of the set of pages may be identified. The memory device may be operated using a unit-distance code associated with a smaller range of the set of average read voltage drifts than ranges of sets of average read voltage drifts associated with other unit-distance codes.

Abstract: Memory array structures might include a first conductive plate connected to memory cells of a first dummy block of memory cells and to memory cells of a second dummy block of memory cells on opposing sides of a first isolation region; a second conductive plate connected to memory cells of the first dummy block of memory cells and to memory cells of the second dummy block of memory cells on opposing sides of a second isolation region; first and second conductors selectively connected to a first global access line, and connected to the first conductive plate on opposing sides of the first isolation region; third and fourth conductors selectively connected to a second global access line, and connected to the second conductive plate on opposing sides of the second isolation region; and a fifth conductor connected to the third conductor and connected to the second conductor.

Abstract: Methods, systems, and devices for setting switching for single-level cells (SLCs) are described. A memory system may receive an access command from a host. The access command may correspond to an SLC block or to a multiple-level cell block. If the access command corresponds to an SLC block, the memory system may modify the access command to include one or more bits indicating a setting to use for performing the access operation corresponding to the access command. The setting may define one or more operating parameters for performing the access operation. The memory system may use bits to indicate the setting that are used to indicate a page address for multiple-level cell blocks. The memory system may issue the access command to a memory device, which may perform the access operation using the setting indicated in the one or more bits included by the memory system.

Abstract: A semiconductor storage device includes a semiconductor substrate including a first region, a second region, and a third region, located apart from each other in such an order in a first direction in an element region. Each of the first to third regions including a source and/or drain region. The semiconductor storage device further includes a first conductor layer provided above the element region and having a first opening; a second conductor layer provided above the element region, having a second opening, and located apart from the first conductor layer in the first direction; a first contact, in the first opening, that is connected to the first region; a second contact, in the second opening, that is connected to the third region; a first memory cell connected to the first contact; and a second memory cell connected to the second contact.

Abstract: Among other things, an apparatus comprises quantum units; and couplers among the quantum units. Each coupler is configured to couple a pair of quantum units according to a quantum Hamiltonian characterizing the quantum units and the couplers. The quantum Hamiltonian includes quantum annealer Hamiltonian and a quantum governor Hamiltonian. The quantum annealer Hamiltonian includes information bearing degrees of freedom. The quantum governor Hamiltonian includes non-information bearing degrees of freedom that are engineered to steer the dissipative dynamics of information bearing degrees of freedom.

Abstract: According to one embodiment, a memory system includes a semiconductor memory and a controller. The semiconductor memory includes first to fourth word lines and first to fourth memory cells. The controller is configured to issue first and second instructions. The controller is further configured to execute a first operation to obtain a first read voltage based on a threshold distribution of the first memory cell, and a second operation to read data from the second memory cell.

Abstract: A method of operating a memory circuit includes generating a first current in response to a first voltage. The first current includes a first set of leakage currents and a first write current. The method further includes generating, by a tracking circuit, a second set of leakage currents configured to track the first set of leakage currents of the first column of memory cells, and mirroring the first current in a first path with a second current in a second path by a first current mirror. The second current includes the second set of leakage currents and a second write current. The first write current corresponds to the second write current. The first set of leakage currents corresponds to the second set of leakage currents.

Abstract: A memory device includes memory cells in rows, word lines respectively coupled to the rows, and a control circuitry coupled to the memory cells via the word lines. The control circuitry is configured to apply a first program voltage to a first word line of the word lines. The first word line is coupled to a first row of the memory cells. The control circuitry is also configured to, after applying the first program voltage to the first word line, apply a second program voltage to a second word line of the word lines. The second word line is coupled to a second row of the memory cells. The control circuitry is also configured to, after applying the second program voltage to the second word line, apply a first pre-charge voltage to the first word line and a second pre-charge voltage to the second word line. The second pre-charge voltage is greater than the first pre-charge voltage.

Abstract: A non-volatile storage circuit (10) of an embodiment includes a volatile storage unit (11) that stores information, a non-volatile storage unit (20) into which the information in the volatile storage unit is written by a store operation, and from which the information is read out to the volatile storage unit (11) by a restore operation via a restore path different from a store path in the store operation, a driver unit (12, 15) that receives a power supply and performs the store operation, and a switch unit (13, 14, 16, 17) that shuts off the power supply to the driver unit (12, 15) during the restore operation.

Abstract: Techniques for controlling current through memory cells is disclosed. In the illustrative embodiment, a fine-grained current source and a coarse-grained current source can both be activated to perform an operation on a phase-change memory cell. The coarse-grained current source is briefly activated to charge up the capacitance of an electrical path through the memory cell and then turned off. The fine-grained current source applies a current pulse to perform the operation on the memory cell, such as a reset operation. By charging up the electrical path quickly with the coarse-grained current source, the fine-grained current source can quickly perform the operation on the memory cell, reducing the thermal disturbance caused by the operation on nearby memory cells.