Patents Examined by Khan V. Nguyen
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Patent number: 5596801Abstract: An apparatus and method for attaching inconsistent length plastic handles to a container. The apparatus comprises a mandrel having a bottom diameter less than that of the container and a top diameter greater than that of the container. The container rests on the mandrel until uneven forces are applied by attachment of a handle having unequal length sides, at which time the shorter arm of the handle engages the container first, causing the corresponding sides of the container to slide upwardly on the mandrel and the opposite side to slide downwardly. The downward sliding places the corresponding receptacle closer to the longer arm of the handle facilitating engagement. A die having a body and an arcuate shaped handle forming area adjacent a recess in the body delivers the handle to the container. The recess also includes end portions tapered in the direction of the arcuate bend of the handle forming area.Type: GrantFiled: September 8, 1993Date of Patent: January 28, 1997Assignee: Cardinal Packaging, Inc.Inventor: Brian Graham
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Patent number: 5594985Abstract: The invention is to an extractor for removing pins from storage tubes having a plurality of electronic semiconductor devices therein. A movable arm has an extractor pin on one end and is pivotally mounted to a frame on the other end. A head assembly for receiving a storage tube with a pin therein is moved under the extractor pin, actuating a solenoid for causing the movable arm to move the extractor pin toward and forcing the pin to be ejected from the storage tube so that the semiconductor devices can exit the storage tube.Type: GrantFiled: May 8, 1995Date of Patent: January 21, 1997Assignee: Texas Instruments IncorporatedInventor: Jerry M. Varley
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Patent number: 5590459Abstract: A rivet inserting device for inserting multiple rivets and the like into a rivet-holding belt or device omprising a hopper containing the rivets, a rotatable rivet-receiving wheel having a plural of flanges installed on both sides of a core portion, and having grooves receiving the rivets one by one displaced in the specified distance on the peripheries of the flanges, a rivet-feeding route installed between the hopper and the rivet-receiving wheel, shaped as a slit having a width lager than the diameter of the stem portions of rivets, and smaller than the diameter of the head portion thereof. A revolving roller is located in the neighborhood of the hopper across the rivet-feeding route and is provided with a groove along the axial direction on the periphery thereof.Type: GrantFiled: December 22, 1994Date of Patent: January 7, 1997Assignee: Opt Engineering Co., Ltd.Inventors: Masatoshi Ohuchi, Shuichi Mizuta
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Patent number: 5590465Abstract: A conductive metal wiring pattern 1 is printed and wired on a flexible insulation film 2, and has connection terminals 1a whose surfaces are treated into a solderable state by plating or the like. An overriding flexible insulation film 3 is formed such that it covers a portion excluding the connection terminals 1a. The connection terminals 1a are easily formed by printing, bonding and cutting out portions of the insulation film 2 between the connection terminals by a press to separate the connection terminal.Type: GrantFiled: March 15, 1996Date of Patent: January 7, 1997Assignee: Matsushita Electric Industrial Co., Ltd.Inventor: Kouichi Santo
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Patent number: 5584122Abstract: In the covered-wire connection method and structure in which at least one of members to be conductively connected to each other is a covered wire comprising a conductive wire portion and a cover portion of resin which is coated around the outer periphery of the conductive wire portion, both of the members are overlapped with each other at connection portions thereof, the overlapped connection portions are pinched between a pair of resin chips, and then the cover portion are melted and dispersed by ultrasonic vibration while pressing the connection portions of the members from the outside of the resin chips to conductively connect both of the members to each other at the connection portions thereof. Thereafter, the pair of the resin chips are melted to be fixed to each other, so that the connection portions are sealed with the melted resin chips.Type: GrantFiled: March 31, 1995Date of Patent: December 17, 1996Assignee: Yazaki CorporationInventors: Sanae Kato, Nobuyuki Asakura, Keiichi Ozaki, Mineo Takahashi
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Patent number: 5581876Abstract: In the manufacture of ceramic circuit boards having ceramic or metal support substrates, a bonding glass layer that is adherent both to the substrate material and to multilayer green tape compositions having circuitry printed thereon, is deposited and flowed onto the support substrate. The bonding glasses suitable for use with nickel plated metal substrates and green tape compositions containing forsterite-cordierite-type glasses are mixed oxides including calcium, zinc and boron as well as other oxides. These bonding glasses have a thermal coefficient of expansion that is larger than said metal substrate, and a flow temperature below that of said cordierite-type glasses.Type: GrantFiled: January 27, 1995Date of Patent: December 10, 1996Assignee: David Sarnoff Research Center, Inc.Inventors: Ashok N. Prabhu, Barry J. Thaler
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Patent number: 5577314Abstract: A rubber-like molded product with a support frame includes a support frame having a predetermined shape; a connecting member constituted by a thin film or connecting ribs and engaged with the support frame separably therefrom; and a rubber-like molded product formed integrally in a region of the connecting member in such a manner as to be capable of being cut off from the connecting member. In this rubber-like molded product with a support frame, the support frame, the connecting member, and the rubber-like molded product are formed integrally by press molding or injection molding. In the assembly process, only the rubber-like molded product is cut off from the support frame and the connecting member of the integrated rubber-like molded product with a support frame by means of a pushing jig, and is fitted in a groove formed in a predetermined portion of a fitted member.Type: GrantFiled: April 19, 1995Date of Patent: November 26, 1996Assignee: Three Bond Co., Ltd.Inventors: Nobuhiro Katsuno, Ikuzo Usami, Noriko Mizutani
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Patent number: 5572783Abstract: A sucker rod coupling tool and method for either breaking or tightening the threaded joint between a sucker rod and the coupling that joins the sucker rod to the next sucker rod. A base plate has a backup wrench mounted to one end and a friction wrench actuated by a hydraulic piston pivotally affixed to the base plate at the other end. An inversion loop is affixed to the base plate and rotatably suspended below a control platform to accommodate inversion of the base plate along with the backup wrench and the friction wrench. The control platform also supports the control levers and can be raised and lowered to allow the backup wrench to engage the sucker rod.Type: GrantFiled: May 4, 1995Date of Patent: November 12, 1996Assignee: GCW DevelopmentInventor: Samuel L. Wacker
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Patent number: 5566436Abstract: A machine part such as a shaft is inserted or pressure-fitted into a hole in a workpiece by setting the workpiece on a table which is rotatable around at least two axes, rotating the table so as to orient the hole vertically, holding the part vertically by an assembly tool, operating a two-dimensionally moving mechanism so as to move the assembly tool within a horizontal plane and to position the part vertically above the hole, and using an elevator to move the two-dimensionally moving mechanism vertically. Since both the part and the hole are vertically aligned, no torque is generated on the part during the insertion process.Type: GrantFiled: August 11, 1994Date of Patent: October 22, 1996Assignee: Hirata CorporationInventor: Yasunari Hirata
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Patent number: 5566446Abstract: The invention describes a feed device that feeds assembly parts such as nuts, bolts, and rivets, from a sorting unit to the feed channel of a processing device for pressing or mounting of assembly parts to sheet metal. The feed device consists of a nozzle with a nozzle channel through it connected on one end to a feed line coming from the sorting unit. A protrusion of the nozzle can deploy into a recess opening of a guide piece of the processing device so that the nozzle channel will open laterally into the feed channel of the device. To connect the nozzle to the guide piece, two levers linked to the nozzle are used; they are pretensioned by springs in a closed position surrounding the guide piece and can be moved manually, possibly with the assistance of a tool, into an open position. In this manner the feed device can be easily connected to the processing device and then detached from it.Type: GrantFiled: March 1, 1995Date of Patent: October 22, 1996Assignee: Multifastener CorporationInventors: Wolfgang Luckhardt, Heinrich Luckhardt, deceased
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Patent number: 5564177Abstract: A fitting body is provided with a lip that protrudes radially from at least one of the side walls of the seal groove in the sealing face toward the other side wall to form an undercut whereby an annular seal is trapped axially behind the lip to prevent the annular seal from falling out of the groove. The lip is formed by forming the fitting body with a ledge that is integral with the fitting body and protrudes axially from the sealing face adjacent one of the side walls of the groove in the sealing face. The ledge is then flattened to form the lip and an annular seal such as an elastomeric O-ring seal is then inserted into the groove with the annular seal being mechanically trapped axially behind the lip to prevent the annular seal from falling out of the groove.Type: GrantFiled: June 5, 1995Date of Patent: October 15, 1996Assignee: Parker-Hannifin CorporationInventors: Edward M. Fernandes, Hiralal V. Patel
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Patent number: 5561894Abstract: Method for providing a decorative cover by providing a flower pot, positioning a sleeve about the floral grouping with a portion of the sleeve extending along a portion of the flower pot, disposing a sheet of material about the outer peripheral surface of the flower pot; and positioning a collar about the outer peripheral surface of the flower pot with a portion of the sleeve and the sheet of material being disposed between the collar and the flower pot whereby the collar secures the sleeve and the sheet of material to the flower pot.Type: GrantFiled: May 10, 1995Date of Patent: October 8, 1996Assignee: Southpac Trust International, Inc.Inventors: Donald E. Weder, Franklin J. Craig, William F. Straeter, Joseph G. Straeter
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Patent number: 5561893Abstract: A personal computer includes a metallic main chassis section and a metallic subchassis hinged thereto. The subchassis includes a side wall and a floor forming a corner therebetween. The corner is formed by integral pieces of the subchassis extending between the side wall and floor, the pieces being spaced in a longitudinal direction. The pieces are bent to form first pockets opening transversely to the longitudinal direction. First tabs extend from the side wall in the transverse direction. The main chassis section includes an edge having second tabs spaced longitudinally and bent into U-shaped pockets. To assemble the hinge, the second pockets are inserted into spaces formed between the first pockets and first tabs, so that the first and second pockets become aligned. A hinge pin is inserted into the pockets so as to lie in the longitudinal direction. The first and second tabs are bent around the hinge pin.Type: GrantFiled: May 1, 1995Date of Patent: October 8, 1996Assignee: Apple Computer, Inc.Inventor: Wayman Lee
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Patent number: 5561898Abstract: A tool for inserting wires into more than one type of insulation displacement connector comprises a stepped locating device such that a first portion (230) locates in one connector type and a second portion is of a width (W) suitable to locate in a further connector type.Type: GrantFiled: October 26, 1994Date of Patent: October 8, 1996Assignee: Mod-Tap W CorporationInventors: Rowland S. White, David E. Ivey
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Patent number: 5560096Abstract: A method of manufacturing a distal femoral knee prosthesis includes the initial step of forming a rough prosthesis workpiece member that has the approximate size and shape of a final polished distal femoral prosthesis. The rough prosthesis workpiece member can be a casting, forging or a rough machined part. The prosthesis member is then attached to a fixator and movably supported adjacent a rotary grinder. Relative motion between the rotary grinder and the prosthesis is controlled with a computer. An articular surface of the prosthesis is shaped by engaging the prosthesis with the rotary grinder. The workpiece is primarily polished to remove "scallops" that form on the outer surface during a shaping with the rotary grinder. The prosthesis workpiece member is then secondarily polished until the articular surface provides a highly polished mirror finish.Type: GrantFiled: January 23, 1995Date of Patent: October 1, 1996Assignee: Smith & Nephew Richards Inc.Inventor: Ron Y. Stephens
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Patent number: 5555616Abstract: Apparatus and method for positioning tooling with respect to a workpiece such as for positioning an anvil and clamping members on the inner surface of a fuselage being riveted. The apparatus comprises a tooling head, a frame for supporting the head, a carriage for moving the frame relative to the workpiece including movement of the frame along an axis. The frame is movable radially of the axis toward and away from the workpiece for macro-movement of the head. The head is also movable relative to the frame for movement of the tooling radially of the axis toward and away from the workpiece for micro-movement of the tooling for clamping to and unclamping from the workpiece as well as to clear flange portions of stringers being riveted to the workpiece.Type: GrantFiled: October 13, 1993Date of Patent: September 17, 1996Assignee: Gemcor Engineering CorporationInventors: David Michalewski, Ernest K. Krell
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Patent number: 5551142Abstract: The invention is a stator lamination jig system which comprises a centrally located spindle and a support for a stator lamination having a plurality of holes therein. The support is rotatively-mounted on the spindle for driving the lamination during a notching operation. A plate is included to secure the lamination on the support and a non-rotatable ejector is located below the support which has a lowered position and a raised position. An ejection cylinder is seated upon the ejector which is shaped and positioned to extend through holes in the support. The invention also comprises a cylinder connected to the ejector for driving the ejector. When the cylinder is actuated upwards, the ejector is in a raised position which urges the ejection cylinder through the holes in the support to cause the lamination to be released from the jig.Type: GrantFiled: January 5, 1995Date of Patent: September 3, 1996Assignee: Dayton-Phoenix Group, Inc.Inventors: Gale A. Kooken, John W. Murphy, Roger D. Fleming
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Patent number: 5548891Abstract: A connector 1 is provided with first leads 3--3 protruding forward from a front surface of a connector main body 2 so as to constitute a longer lead row, and second leads 4--4 shorter than the first leads 3--3 and protruding forward from the front surface of the connector main body 2 so as to constitute a shorter lead row. The longer lead row is parallel to and spaced in a vertical direction from the shorter lead row. The connector 1 is held with an installation head 6. The connector 1 is horizontally transported until the protruding distal ends of the first leads 3--3 are positioned just above an end (i.e. terminals 14--14) of a printed circuit board 11 while the protruding distal ends of the second leads 4--4 are offset from the end (i.e. terminals 15--15) of the printed circuit board 11.Type: GrantFiled: December 20, 1994Date of Patent: August 27, 1996Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Shoji Sakemi, Teruaki Nishinaka
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Patent number: 5544412Abstract: An electronic module and a method for coupling a power lead (32) to a bond pad (28) on a semiconductor die (17) within the electronic module. A clip support (13) having a slot (27) is coupled to a baseplate (11) via an isolation structure (14). The semiconductor die (17) is coupled to the baseplate (11) via an isolation structure (19). The power lead (32) is coupled to the isolation structure (14). The clip support (13) is coupled to the semiconductor die (17) via a clip (29), wherein a first end of the clip (29) is inserted in the slot (27) and a second end of the clip (29) is compressively mated with the semiconductor die (17). Compressively mating the clip (29) with the semiconductor die (17) eliminates the need for bond feet, thereby increasing the reliability of the module.Type: GrantFiled: May 24, 1994Date of Patent: August 13, 1996Assignee: Motorola, Inc.Inventors: Guillermo L. Romero, Joe L. Martinez, Jr.
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Patent number: 5544399Abstract: A monolithic capacitive pressure transducer (12, 12') is made by separately forming under pressure a diaphragm (22, 22') and a base (24, 24') having a recess (26) in the top surface using ceramic powder coated with an organic binder. Metal layers are deposited on the two pieces and the pieces are then joined together to form a single unit. A spacer (36) may be inserted in the recess to ensure that a predetermined gap is maintained between the two parts during the joining operation. The parts are then heated to allow the binder organics, as well as the spacer organics if a spacer is employed, to be vaporized and/or decomposed and removed through the open pores of the diaphragm and base and then sintered to change the parts into a monolithic body and to convert the metallized layer into a conductive layer bonded to the ceramic.Type: GrantFiled: February 17, 1995Date of Patent: August 13, 1996Assignee: Texas Instruments IncorporatedInventors: Robert P. Bishop, Paul L. Hainey