Abstract: A sintering press for sintering electronic components on a substrate is provided. The sintering press includes a pressing unit having a plurality of controllable presser rods to apply sintering pressure to the electronic components to be sintered, reaction elements forming a support plane for a respective substrate, an element plate slidably supporting the reaction elements, and a heating circuit with heating elements embedded in a heating body placed around the element plate to bring the element plate to a sintering temperature. A heat diffusion plate is placed in contact with the heating body and extends onto the element plate between the reaction elements, the diffusion plate being made of a material having a higher thermal conductivity than the element plate.

Abstract: A flux dotting tool is provided that includes: a housing having an internal space and a plurality of through-holes extending from the internal space to an outside of the housing; a plurality of flux pins disposed in the internal space to correspond to the plurality of through-holes, respectively, wherein each of the plurality of flux pins includes a flux holding portion extending in a first direction and that is exposed to the outside of the housing, and a flux blocking structure protruding in a second direction, perpendicular to the first direction, from a side surface of the flux holding portion, and the flux blocking structure is configured to limit a flux wetting region; and an elastic structure disposed on the plurality of flux pins in the internal space and configured to impart elastic force in the first direction.

Abstract: Aspects of the invention include receiving a printed circuit board (PCB) having one or more of mounting pads thereon, determining a stencil for applying a solder paste to the one or more mounting pads, the stencil having a smallest aperture for a component requiring a standoff, determining a maximum threshold size for standoff particles based on the smallest aperture, determining a first concentration of the standoff particles based on the smallest aperture, determining a minimum threshold size for standoff particles to create the standoff for the component, determining a second concentration of the standoff particles to create a three-standoff seating plane for the component, introducing the standoff particles to the solder paste, the standoff particles in the solder paste having a concentration between the first concentration and the second concentration, and a size between the maximum threshold size and the minimum threshold size.

Abstract: The cold pressure welding apparatus includes a first holding part capable of sandwiching a first flat conductor, a second holding part disposed opposite to the first holding part and capable of sandwiching a second flat conductor, and a drive part for moving the first holding part and the second holding part. The drive part can move the first holding part and the second holding part between a first direction separated position and a close position along a first direction. The drive part can move the first holding part and the second holding part between a second direction separated position and a sandwiching position along a second direction.

Abstract: A metal particle aggregate includes metal particles and an organic substance. The metal particles include first particles that contain one or both of silver and copper in an amount of 70% by mass or more relative to 100% by mass of all metals and have a particle diameter of 100 nm or more and less than 500 nm at a ratio of 20 to 30% by number, and include second particles that have a particle diameter of 50 nm or more and less than 100 nm, and third particles that have a particle diameter of less than 50 nm at a ratio of 80 to 70% by number in total. Surfaces of the first to third particles are covered with the same protective film.

Abstract: A suction unit, including a first module, a second module, and a third module. The first module is provided with an air-permeable zone. The second module is provided with air holes a. The third module is provided with air holes b. A solder ribbon and a solar cell are sequentially stacked on the first module. A channel S2 is formed by the air holes b and the air holes a to fix the first module to the second module. A channel Si is formed by the air holes b, the air holes a and the air-permeable zone to fix the solder ribbon and the solar cell on the first module.

Abstract: A force sensor for determining a bonding force during wire bonding operations includes: a piezoelectric sensing element mounted in an ultrasonic transducer of an ultrasonic wire bonding device, the piezoelectric sensing element including a first portion and a second portion, and first and second opposing surfaces, wherein the first surface of the first portion has a positive electrode and the second surface of the first portion has a negative electrode respectively, and the first surface of the second portion has a negative electrode and the second surface of the second portion has a positive electrode respectively.

Abstract: An additive friction stir deposition system for refractory metals is disclosed herein. The additive friction stir deposition system includes a tool assembly and an induction element. The tool assembly includes a metal shaft defining a shaft central channel, and a ceramic tip defining a tip central channel. The metal shaft and the ceramic tip are configured to interlock to prevent relative rotation therebetween. The induction element is positioned adjacent to the ceramic tip. As a refractory metal feedstock is fed through the shaft central channel and the tip central channel, the induction element heats the portion of the refractory metal feedstock within the tip central channel, but does not heat the ceramic tip itself. Accordingly, the refractory metal feedstock can be heated prior to application to a workpiece without heating the tip of the tool assembly, improving performance of the additive friction stir deposition system and the resulting workpiece.

Abstract: Process for producing an electronic subassembly by low-temperature pressure sintering, comprising the following steps: arranging an electronic component on a circuit carrier having a conductor track, connecting the electronic component to the circuit carrier by the low-temperature pressure sintering of a joining material which connects the electronic component to the circuit carrier, characterized in that, to avoid the oxidation of the electronic component or of the conductor track, the low-temperature pressure sintering is carried out in a low-oxygen atmosphere having a relative oxygen content of 0.005 to 0.3%.

Abstract: A method (100) for processing conductor segments (2) of a winding support (3) of an electric motor, wherein at least two conductor segments (2) are arranged on the winding support (3), wherein the conductor segments (2) protrude out of the end side of the winding support (3) by way of end sections (4).

Abstract: An automatic soldering processing system is disclosed and includes a soldering-point information obtaining unit, a soldering-parameter generating unit, a solder feeding unit, an iron tip, a motion control unit, and a temperature control unit. The soldering-point information obtaining unit obtains an image of at least one soldering-point of an electronic product, the soldering-parameter generating unit generates soldering parameters such as solder feeding speed, solder feeding amount, moving speed, moving path, heating temperature and heating time for the at least one soldering-point correspondingly according to the image. The solder feeding unit feeds solder based on the solder feeding speed and the solder feeding amount, the iron tip performs a soldering action by using the solder, and the motion control unit and the temperature control unit control the iron tip according to the moving speed, the moving path, the heating temperature, and the heating time.

Abstract: A stencil printer is configured to print an assembly material on an electronic substrate. The stencil printer includes a frame, a stencil coupled to the frame, a support assembly coupled to the frame, and a print head gantry coupled to the frame. The print head gantry includes an elongate beam that rides along rails provided on the frame and a print head assembly supported by the print head gantry in such a manner that the print head assembly is configured to traverse the stencil during print strokes. The print head assembly includes a print head having a squeegee blade assembly configured to roll solder paste along the stencil. The stencil printer further includes a solder paste bead recovery system configured to remove a bead of solder paste from a top surface of the stencil and to deposit the bead of solder paste onto a new replacement stencil.

Abstract: Embodiments of the present invention provides an approach for repairing defects in a structure, located in difficult to reach area, by using a self-guiding and self-melting robotic thread. The approach can use an external guidance system to find the target location of the structure and deploy a robotic thread to the defective area. Portion of the robotic thread contains a filler material can have similar materials to the structure. After the system has determined the size, length and volume of the repair, the system calculates the required length of the robotic thread and guides the thread to the defective area. Once the robotic thread is in place, the filler material begins to melt via heat. The filler material, in a melted and pliable state, can flow into the defect area. Once cooled, the filler material can now support the structure.

Abstract: A soldering iron device includes a main body, where an end portion of the main body is provided with a tip, a heating core for heating the tip is provided in the main body, and a measuring element is provided in the main body; and the measuring element includes a mounting rod and a sensor, the sensor is provided on an end portion of the mounting rod, a measuring cavity is formed in the tip, the sensor is inserted into the measuring cavity, and the mounting rod extends toward a direction away from the tip. Compared with the prior art, since the sensor is not provided in the heating core, but is directly inserted into the tip, the present disclosure overcomes the heat transfer distance between the heating core and the tip and directly measures the temperature of the tip, which is highly accurate in measurement and strongly practicable.

Abstract: A method for applying an abrasive comprises: applying, to a substrate, the integral combination of: a self-braze material; and an abrasive embedded in the self-braze material; and securing the combination to the substrate.

Abstract: A solder removal apparatus is provided. The solder removal apparatus comprises a plurality of solder-interfacing protrusions extending from a body by a length. Each of the plurality of solder-interfacing protrusions is configured to remove a corresponding one of a plurality of solder features from a semiconductor device, where each of the plurality of solder features has a height and an amount of solder material.

Abstract: A spacer grid welding fixture comprises a frame sized to receive an assembled spacer grid comprising a first set of parallel straps and a second set of parallel straps oriented orthogonally to the first set of parallel straps, the first and second sets of parallel straps interlocked together by slots cut into the straps. A first set of grid engagement bars is placed on a first side of the spacer grid with each grid engagement bar arranged parallel with the straps of the first set of parallel straps and engaging the straps of the second set of parallel straps. A second set of grid engagement bars is placed on an opposite second side of the spacer grid with each grid engagement bar arranged parallel with the straps of the second set of parallel straps and engaging the straps of the first set of parallel straps.

Abstract: A device for performing a method for producing a lamination pack, wherein in the method laminations are cut from an electric strip or sheet; the laminations are placed on top of each other to form a lamination stack; the laminations are connected by material fusion to each other by: locally plasticizing a material of the laminations in an edge region of the laminations by generating friction heat by a tool; mixing the locally plasticized material, at least of the laminations neighboring each other, with the tool; and allowing the plasticized material to cool and fuse the laminations in the edge region to form the lamination pack. The device has a punch press and/or a receptacle for one or a plurality of lamination stacks. The device further has a welding tool that is rotatably driven about an axis of the welding tool and moveable transverse to the axis of rotation.

Abstract: A filler for vacuum brazing of TU1 oxygen-free copper is an Au—Cu—Ni filler including the following elemental compositions in a specified proportion: 69% to 90% of Au, 9% to 30% of Cu, and 1% to 5% of Ni. The filler has a melting temperature of 900° C. to 910° C. The filler for vacuum brazing of TU1 oxygen-free copper can be used for brazing X-ray tube anodes, thereby realizing effective vacuum brazing.

Abstract: The present disclosure, in some embodiments, relates to a workpiece bonding apparatus. The workpieces bonding apparatus includes a first substrate holder having a first surface configured to receive a first workpiece, and a second substrate holder having a second surface configured to receive a second workpiece. A vacuum apparatus is positioned between the first substrate holder and the second substrate holder and is configured to selectively induce a vacuum between the first surface and the second surface. The vacuum is configured to attract the first surface and the second surface toward one another.