Abstract: A capillary guide device (40) includes: a guide body portion (41) capable of being in contact with a capillary (8) held in a hole (7h); and a drive portion (42) which arranges the guide body portion (41) at a position capable of being in contact with the capillary (8) by moving the guide body portion (41) along an X-axis direction. The drive portion (42) includes: a table (46) connected to the guide body portion (41); a drive shaft (47b) extending in the X-axis direction and exhibiting a frictional resistance force with the table (46); and an ultrasonic element (47a) fixed to an end of the drive shaft (47b) and supplying an ultrasonic wave to the drive shaft (47b).

Abstract: The invention relates to tooling for holding parts in position to enable them to be friction welded together in order to construct a hollow structure, the tooling comprises: a framework made up of two frames for receiving the parts for welding together in their positions for forming the hollow structure, the parts comprising preformed parts and an intermediate section; shape-holder members for holding the hollow structure, associating backing thrust members and lateral grip members for gripping the outsides of the preformed parts; anvils suitable for being placed inside the set of preformed parts beside the section; and clamping means operable to take up a clamping position in which they cause opposing thrust to be applied against the anvil and the inside face of a preformed part, its part itself bears against the shape-holder members.

Abstract: A method of fusing first and second metal objects together at respective first and second ends thereof, the first and second ends being partially defined by respective first and second end walls thereof. One or more recesses is formed in one or both of the first and second ends. The ends are heated to a hot working temperature in an inert atmosphere, and the first and second end walls are engaged with each other, to form one or more deformed parts of the first and second ends. While the first and second end walls are engaged, one or more objects is rotated around its axis, to squeeze the one or more deformed parts into the one or more recesses respectively. The first and second metal objects are allowed to cool, to fuse the first and second metal objects together at the first and second ends.

Abstract: A method for manufacturing an electrostatic chuck with multiple chucking electrodes made of ceramic pieces using metallic aluminum as the joining. The aluminum may be placed between two pieces and the assembly may be heated in the range of 770 C to 1200 C. The joining atmosphere may be non-oxygenated. After joining the exclusions in the electrode pattern may be machined by also machining through one of the plate layers. The machined exclusion slots may then be filled with epoxy or other material. An electrostatic chuck or other structure manufactured according to such methods.

Abstract: Implementations of the disclosure are directed to a lead-free mixed solder powder paste suitable for low temperature to middle temperature soldering applications. The lead-free solder paste may consist of: an amount of a first solder alloy powder between 44 wt % and 83 wt %, the first solder alloy powder comprising Sn; an amount of a second solder alloy powder between 5 wt % to 44 wt %, the second alloy powder comprising Sn, where the first solder alloy powder has a liquidus temperature lower than a solidus temperature of the second solder alloy powder; and a remainder of flux. The solder paste may be used for reflow at a peak temperature below the solidus temperature of the higher solidus temperature solder powder but above the melting temperature of the lower solidus temperature one.

Abstract: A wafer processing method for processing a wafer formed on a front surface thereof with a plurality of devices having projection-shaped electrodes, the devices being partitioned by streets, includes a cutting step of holding a back surface of the wafer by a holding surface of a chuck table and cutting head portions of the projection-shaped electrodes by a cutting tool slewed in parallel to the holding surface, to make uniform the electrodes in height and expose metallic surfaces; a thermocompression bonding sheet laying step of laying a thermocompression bonding sheet on the front surface of the wafer; a thermocompression bonding step of heating and pressing the thermocompression bonding sheet to perform thermocompression bonding; and a peeling step of peeling off the thermocompression bonding sheet from the wafer, before dividing the wafer into individual device chips and bonding the electrodes to a circuit board.

Abstract: Systems and methods are presented herein for a method of attaching a strip to a housing. An internal support member is inserted into a collapsible housing, such that it is arranged along a longitudinal axis of an inner surface of the collapsible housing. An outer support member is arranged along an outer surface the collapsible housing opposite the internal support member. A strip is positioned along the outer surface using the outer support member and the internal support member. Then the strip is permanently welded to the outer surface using a welding element. Welding is performed by a welding element located in one (or both) of the internal support member or the outer support member.

Abstract: An apparatus for manufacturing a heat exchanger for a vehicle has a plurality of cooling panels bonded to each other by pressing a cooling panel module where the plurality of cooling panels are stacked vertically, including: a fixing portion for supporting top and bottom ends of the cooling panel module; and a pair of elastic portions that are provided between the top or bottom end of the cooling panel module and the fixing portion, and are arranged symmetrically based on a top or bottom surface of the cooling panel module to compress the cooling panel module.

Abstract: The disclosure herein describes various methods for producing a composite thickness metal part. Such methods include cutting out a base component having a first thickness, cutting out a foil sheet having a second thickness less than the first thickness, and loading the base component and the foil sheet into a fixture. Then the methods include passing the fixture containing the base component and the foil sheet through an ultrasonic welding machine to join the foil sheet to the base component and form an interim part that includes the foil sheet joined to the base component and cutting away preselected sections of the foil sheet from the interim part to produce a final geometry of the composite thickness metal part.

Abstract: A collar flange assembly welding fixture is disclosed, including a stand, a circular mount structure, and a support assembly which are configured to provide access to a front side and a back side of a collar flange assembly held by the support assembly. The stand has a plurality of circumferential bearings equidistant from an axis of rotation, the circular mount structure is rotatably supported by the circumferential bearings, and the support assembly is configured for mounting on the circular mount structure.

Abstract: A brazing apparatus and method for brazing an anode target plate of an X-ray generator are disclosed. The brazing apparatus comprises: a vacuum part for providing, during brazing, a vacuum environment at least for a target plate main body formed of an alloy, a brazing material, and a substrate; an induction brazing part for applying an induction current to the target plate main body, the brazing material and the substrate in the vacuum part so as to achieve heating to a temperature higher than the melting point of the brazing material, causing the substrate to be welded to the target plate main body through melting of the brazing material and a resulting reaction; and a directional energy welding part for applying a generated directional energy beam to a position of lower temperature determined on the target plate main body to perform heating.

Abstract: A method of fitting a fastener to an object is introduced. The fastener has a weldable surface and an engaging portion or a hole portion. One end of the hole portion or one end of the engaging portion has a holding portion. During a welding heating process, solder flows into or enters the holding portion and then cools down and solidifies therein so as to be held therein. Therefore, the weldable surface and the holding portion together enable the fastener to be firmly coupled to an object. The engaging portion and the hole portion together enable an object to be coupled to or removed from another object, so as to couple together and separate at least two objects repeatedly and quickly.

Abstract: A device for inductively soldering at least one ferromagnetic contact element to at least one conductor structure on a nonmetallic plate, includes a system for fastening a plate during the soldering operation, at least one soldering tool having at least one induction loop or induction coil suitable for emitting a magnetic field, a system for mutually positioning the soldering tool and the contact element such that the switched-on magnetic field of the soldering tool reliably heats the ferromagnetic contact element and thus the solder joint, a generator that is suitable for generating an alternating voltage with a frequency of up to 1500 kHz and that can be connected to the induction loop or induction coil.

Abstract: An ultrasound horn is provided which vibrates a bonding tool, attached at a tip, in a plurality of directions with a simple structure. There is provided an ultrasound horn having: a longitudinal vibration generator; a horn portion; and a torsional vibration generator. The torsional vibration generator includes a body including a polygonal pillar portion, second layered elements in which a plurality of second piezoelectric elements are layered, and which are attached to side surfaces of the polygonal pillar portion, weights, and a pressure application ring which applies a pressure by pressing the second piezoelectric elements against the polygonal pillar portion via the weights.

Abstract: Certain exemplary embodiments can provide a manufacturing method, process, machine, and/or system for continuously consolidating granular materials, creating new alloys and/or composites, and/or modifying and/or refining material microstructure, by using plastic deformation of feedstock(s) provided in various structural forms. Materials produced during this process can be fabricated directly and/or in forms such as, e.g., wires, rods, tubes, sheets, plate and/or channels, etc.

Abstract: A sleeve soldering device has a displacement sensor and a heat flux sensor. The displacement sensor detects a physical quantity related to a pressure from a heated sleeve heated by a heater onto an electric board when the heated sleeve presses the electric board. The displacement sensor detects a physical quantity related to a deformation amount of the electric board due to thermal energy from the heater. The heat flux sensor detects a physical quantity related to a heat transfer amount from the heater to the electric board when the heated sleeve is pressed to the electric board. A control part compares each of detection values obtained from the displacement sensor and the heat flux sensor with a respective judgment reference so as to detect whether each detection value satisfies the respective reference.

Abstract: Disclosed is a method for activating a surface of metals, such as self-passivated metals, and of metal-oxide dissolution, effected using a fluoroanion-containing composition. Also disclosed is an electrochemical cell utilizing an aluminum-containing anode material and a fluoroanion-containing electrolyte, characterized by high efficiency, low corrosion, and optionally mechanical or electrochemical rechargeability. Also disclosed is a process for fusing (welding, soldering etc.) a self-passivated metal at relatively low temperature and ambient atmosphere, and a method for electrodepositing a metal on a self-passivated metal using metal-oxide source.

Abstract: A heat assisted flip chip bonding apparatus includes a semiconductor assembly having a substrate and a chip, a heating source and a press and cover assembly having a cover element and press elements. The chip is disposed above the substrate and includes conductors which contact with conductive pads on the substrate. The heating source is provided to emit a heated light which illuminates the chip via an opening of the cover element. The press elements are located between the cover element and the semiconductor assembly and each includes an elastic unit and a pressing unit. Both ends of the elastic unit are connected to the cover element and the pressing unit respectively, and the pressing unit is provided to press a back surface of the chip.

Abstract: Disclosed is a pressing jig for welding an electrode lead located in a lead slit formed at the bus bar to the bus bar in a closely adhered state. The pressing jig includes a first frame having a first distance adjusting unit and a first pressing unit, and a second frame having a second distance adjusting unit facing the first distance adjusting unit and a second pressing unit facing the first pressing unit. The first frame and the second frame are coupled so that a distance between first pressing unit and the second pressing unit is increased when a distance between the first distance adjusting unit and the second distance adjusting unit is decreased, and the distance between first pressing unit and the second pressing unit is decreased when the distance between the first distance adjusting unit and the second distance adjusting unit is increased.

Abstract: A soldering iron hand piece that may be used for both a soldering tip and a soldering cartridge, allowing the same hand piece to be used for both a soldering tip and a soldering cartridge.