Abstract: The application provides a Word Line (WL) drive circuit and a Dynamic Random Access Memory (DRAM). The WL drive circuit includes a first transistor, a second transistor, a third transistor and a fourth transistor. A gate of the first transistor is connected to a WL switch-off voltage, a drain is connected to the WL; a gate of the second transistor is connected to a first drive voltage of the WL, a drain is connected to the WL; and a source of the first transistor and a source of the second transistor are both connected to a negative bias through the third transistor.

Abstract: Numerous embodiments are disclosed for verifying a weight programmed into a selected non-volatile memory cell in a neural memory. In one embodiment, a circuit for verifying a weight programmed into a selected non-volatile memory cell in a neural memory comprises a converter for converting a target weight into a target current and a comparator for comparing the target current to an output current from the selected non-volatile memory cell during a verify operation. In another embodiment, a circuit for verifying a weight programmed into a selected non-volatile memory cell in a neural memory comprises a digital-to-analog converter for converting a target weight comprising digital bits into a target voltage, a current-to-voltage converter for converting an output current from the selected non-volatile memory cell during a verify operation into an output voltage, and a comparator for comparing the output voltage to the target voltage during a verify operation.

Abstract: A memory sector with trimmed reference currents, including eight unit cells corresponding to an even word line and eight unit cells corresponding to an odd word line, and each unit cell has erased state and programmed state, wherein the logic state of unit cell corresponding to the odd word line is determined by a first reference current based on cell currents of the 8 unit cells corresponding to the even word line in programmed state and cell currents of the eight unit cells corresponding to the odd word line in erased state, and the logic state of unit cell corresponding to the even word line is determined by a second reference current based on cell currents of the eight unit cells corresponding to the even word line in erased state and cell currents of the 8 unit cells corresponding to the odd word line in programmed state.

Abstract: A memory device and an operation method thereof are provided. The operation method includes: when a read operation or a write-verify operation is completed, during a word line voltage lowering phase, synchronously applying a plurality of different gradually lowering signal line reference voltages to a plurality of ground select lines and a plurality of string select lines, wherein values of the different gradually lowering signal line reference voltages are corresponding to a plurality of signal line positions of the ground select lines and the string select lines.

Abstract: A memory device may include a memory block and a control circuit. The memory block may include a first sub-block and a second sub-block that are connected between a common source line and a plurality of bit lines and may be vertically stacked. The control circuit may be configured to select any one of the common source line and the plurality of bit lines as a transmission path of an erase voltage based on positions of the first sub-block and the second sub-block, and perform erase operations on the first sub-block and the second sub-block in units of sub-blocks.

Abstract: Technology for mitigating interference to select transistors in 3D memory is disclosed. In one aspect, a control circuit pre-charges a first set of bit lines to a first voltage and pre-charges a second set of bit lines to a second voltage greater than the first voltage. The control circuit may increase the voltage on the first set of bit lines to the second voltage while the second set of bit lines are floating to couple up the voltages on the second set of bit lines to a voltage greater than the second voltage. The higher voltage on the second set of bit lines compensates for interference that some of the select transistors may experience from an adjacent select line. For example, the higher voltage can prevent a leakage current in the select transistors from occurring. Preventing the leakage current can improve boosting of NAND channel voltages, thereby preventing program disturb.

Abstract: Read and write circuitry, described herein, comprises data latches, each data latch connected to a bit line and arranged in a same column as the bit line; and transfer latches, each transfer latch connected to a data latch and arranged in a same column as the data latch. Further, circuitry described herein is configured to: transfer a word to and from the transfer latches of a first column and the subset of transfer latches of a second column; transfer a first portion of the word between the transfer latches of the first column and data latches of the first column that are connected to the transfer latches of the first column; and transfer a second portion of the word between the subset of transfer latches and data latches of the second column that are connected to the subset of transfer latches.

Abstract: A memory apparatus and method of operation are provided. The apparatus includes memory cells connected to one of a plurality of word lines and arranged in strings and configured to retain a threshold voltage. A control means is coupled to the plurality of word lines and the strings. The control means is configured to apply a primary predetermined voltage to a primary location of the memory apparatus following an erase operation of the memory cells while simultaneously applying a secondary predetermined voltage being lower than the primary predetermined voltage to a secondary location of the memory apparatus and measuring a leak current at the primary location. The control means then determines the erase operation passed in response to the leak current measured not being greater than a predetermined leak threshold.

Abstract: Systems, methods, and apparatus related to selecting memory cells in a memory array of a memory device. In one approach, bias circuitry generates a voltage on an access line used to select a memory cell for programming. During programming, a controller connects a boost capacitor to the access line by controlling a switch. Connecting the boost capacitor causes an increase in the rate of discharge of the access line (e.g., discharge of a word line to a negative voltage). After programming, the controller disconnects the boost capacitor from the access line, and the boost capacitor is pre-charged in preparation for a next programming operation (e.g., on the same or a different memory cell).

Abstract: A non-volatile memory device, described herein, comprises: a plurality of memory strings and at least one control circuit in communication with the non-volatile memory cell array. The at least one control circuit is configured to perform, for the plurality of memory strings, one erase-verify iteration in an erase operation including determining whether at least one memory string of the plurality of memory strings passes an erase-verify test. The at least one control circuit is configured to, if the at least one memory string passes the erase-verify test, inhibit the at least one memory string for erase including ramping up, to an erase voltage, of a voltage applied to a gate of a SGD transistor of the at least one memory string and to perform a next erase-verify iteration in the erase operation for remaining memory strings of the plurality of memory strings other than the at least one memory string.

Abstract: Embodiments provide a scheme for estimating an optimal read threshold voltage using a deep neural network (DNN) with reduced number of processing. A controller receives first and second program voltage (PV) levels associated with read operations on cells. The controller estimates first and second probability distribution parameter sets representing skew normal distributions of the first and second PV levels, respectively. The controller estimates an optimal read threshold voltage based on the first and second probability distribution parameter sets. The optimal read threshold voltage is a read threshold voltage such that first probability density function (PDF) value of the skew normal distribution of the first PV level is the same as the second PDF value of the skew normal distribution of the second PV level.

Abstract: A value-voltage-distribution-intersection-based read disturb information determination system includes a storage device coupled to a global read temperature identification system. The storage device identifies a value voltage distribution intersection of first and second value voltage distributions for respective first and second values in a first row in a storage subsystem in the storage device, and determines a default value voltage reference shift between a default value voltage reference level associated with the first value and the second value and the value voltage distribution intersection. Based on the default value voltage reference shift, the storage device determines read disturb information for the first row in the storage subsystem in the storage device, and uses it to generate a read temperature for a second row in the storage subsystem in the storage device that it provides to the global read temperature identification system.

Abstract: Methods, systems, and devices for sensing component with a common node are described. A set of sense circuits of a memory device may include a shared differential amplifier having a first branch for each sense circuit and a shared second branch, as well as a shared common node. A respective latch of each sense amplifier may be initialized to a second logic state, and the common node may undergo a voltage ramp to determine the state stored in the memory cell. If the memory cell stores the first logic state, the sense amplifier may couple with the common node to draw the current and switch the state of the latch to the first logic state. Alternatively, if the memory cell stores the second logic state the current may not be drawn and the state of the latch may not switch.

Abstract: An adaptive current mirror circuit for current shaping with temperature is disclosed. The adaptive current mirror includes a current generator circuit configured to receive and input current and generate an output current using the input current and an overdrive voltage. The adaptive current mirror further includes a compensation circuit configured to adjust a value of the overdrive voltage based on temperature.

Abstract: A control circuit, a memory system and a control method are provided. The control circuit is configured to control a plurality of memory cells of a memory array. The control circuit comprises a program controller. The program is configured to program a first electrical characteristic distribution and a second electrical characteristic distribution of the memory cells according to error tolerance of a first bit of a data type. A first overlapping area between the first electrical characteristic distribution and the second electrical characteristic distribution is smaller than a first predetermined value.

Abstract: A semiconductor storage device includes a memory cell array including a plurality of memory strings, each connected between one of a plurality of bit lines and a source line and includes a first select transistor, a second select transistor, and memory cell transistors that are connected in series between the first select transistor and the second select transistor, and a plurality of word lines respectively connected to gates of the memory cell transistors in each memory string. A threshold voltage of the memory cell transistor is increased when a voltage that is applied to the word line connected to the gate thereof is lower than a voltage of a channel thereof. In the erase operation, data stored in the memory cell transistors connected to a selected one of the word lines are erased while data stored in the memory cell transistors not connected to the selected word line are not erased.

Abstract: An example apparatus for writing a bit to a memory cell includes wordline driver circuitry configured to generate a first voltage in response to a row access enable signal. The apparatus also includes boost driver circuitry coupled to the wordline driver circuitry. The boost driver circuitry is configured to charge a capacitor using the first voltage and to generate a second voltage using the first voltage and a voltage at the capacitor in response to a boost enable signal. The apparatus also includes a wordline coupled to the memory cell and the wordline driver circuitry. The wordline is configured to output the first voltage or the second voltage to the memory cell.

Abstract: A compact SRAM design in a stacked architecture is provided. Notably, a 6-transistor SRAM bite cell including a bottom device level containing bottom field effect transistors and a top device level, stacked above the bottom device level, containing top field effect transistors of a different conductivity type than the bottom field effect transistors is provided.

Abstract: Apparatuses and techniques are described for programming a multi-tier block in which sub-blocks are arranged in respective tiers. When a program operation involves the source-side sub-block, the NAND strings are pre-charged from the source line. When a program operation involves the drain-side sub-block, the NAND strings are pre-charged from the bit line. When a program operation involves an interior sub-block, the NAND strings can be pre-charged from the bit line if all sub-blocks on the drain side of the interior sub-block are erased, or from the source line if all sub-blocks on the source side of the interior sub-block are erased. A table can be provided which identifies free blocks, free sub-blocks and a corresponding program order. If such a table is not available, the sub-blocks can be read to determine whether they are programmed.

Abstract: A non-volatile memory system erasing groups of connected memory cells separately performs erase verify for memory cells connected to even word lines to generate even results and erase verify for memory cells connected to odd word lines to generate odd results. The even results and the odd results are used to determine if the erase verify process indicates that the erasing has successful completed. In addition, for each group of connected memory cells, a last even result for the group is compared to a last odd result for the group. Even if the erase verify indicated that the erasing has successfully completed, the system may determine that the erasing failed (i.e. due to a defect) if the number of groups of connected memory cells that have the last even result different than the last odd result is greater than a limit.