Patents Examined by L. Edmondson
  • Patent number: 7090113
    Abstract: A method is provided for assembling a shaft having a metal matrix composite mid shaft and monolithic high strength alloy forward and aft shafts. The forward and aft shafts are each inertia friction welded to separate annular transition pieces which include a barrier layer operative to prevent the formation of intermetallic compounds. Special tooling is used to avoid applying shear stresses to the transition piece during welding. The welded forward and aft subassemblies are subsequently heat treated before inertia friction welding them to the mid shaft.
    Type: Grant
    Filed: March 18, 2004
    Date of Patent: August 15, 2006
    Assignee: General Electric Company
    Inventors: Charles William Carrier, Gary Mac Holloway, Charles Robert Wojciechowski
  • Patent number: 6988652
    Abstract: A stencil used for printing solder paste on a contact pad of a printed wiring board has one or more reverse-tapered apertures passing there through, wherein the apertures have a variable cross-section that is larger at the fill side of the stencil (i.e., where solder paste enters the apertures) than at the board side of the stencil (i.e., where the stencil contacts the contact pad of the printed wiring board).
    Type: Grant
    Filed: May 29, 2002
    Date of Patent: January 24, 2006
    Assignee: Fry's Metals, Inc.
    Inventors: Ian McPhee Fleck, Ron Tripp, Prashant Chouta, Scott Craig
  • Patent number: 6948649
    Abstract: The high yield ratio problem intrinsic in high-strength steel pipes is solved and a method of producing a steel pipe, while securing the pipe roundness is provided. A steel pipe produced from a steel plate by forming and welding is subjected to 0.3 to 1.2% of expansion and then to 0.1 to 1.0% of reduction. The steel pipe produced by this method has a structure in which martensite and/or bainite accounts for more than 80% as expressed in terms of area percentage, and has a yield strength of not lower than 551 MPa and a yield ratio of not higher than 93%. The pipe reduction is desirably carried out at a lower work ratio as compared with the pipe expansion.
    Type: Grant
    Filed: September 20, 2002
    Date of Patent: September 27, 2005
    Assignee: Sumitomo Metal Industries, Ltd.
    Inventors: Nobuaki Takahashi, Akio Yamamoto, Tomoaki Ikeda, Tetsuya Fukuba
  • Patent number: 6907661
    Abstract: Nonmetallic high-temperature material, such as graphite, CFC or SiC, or components produced from these materials, are joined using the two-stage process. First the structural components are canned and the canning foil is tightly pressed onto the surface contour of the structural components. Then the components are joined to a composite component by forming a material-to-material bond between the metal canning foils. This widens the hitherto highly restricted field of technical application for materials of this type.
    Type: Grant
    Filed: April 30, 2002
    Date of Patent: June 21, 2005
    Assignee: Plansee Aktiengesellschaft
    Inventor: Peter Rödhammer
  • Patent number: 6905063
    Abstract: A semiconductor device can be formed with fewer voids in the solder bonding a laminate of a silicon chip, an insulator substrate, and a metal base, with a solder layer positioned between the layers. After placing the laminate in a furnace, it is evacuated and then pressurized with hydrogen gas, and then heated to melt the solder. While maintaining the heat, the furnace is again evacuated to remove voids in the solder, and then the furnace is positively pressurized again with hydrogen gas to prevent holes produced by the voids traveling in the solder, and to obtain a uniform solder fillet shape. Thereafter the laminate is rapidly cooled to obtain a finer grain solder to increase the rate of creep to quickly remove the warping of the laminate to the original state.
    Type: Grant
    Filed: March 26, 2003
    Date of Patent: June 14, 2005
    Assignee: Fuji Electric Co., Ltd.
    Inventors: Akira Morozumi, Tadashi Miyasaka, Katsumi Yamada, Eiji Mochizuki
  • Patent number: 6903302
    Abstract: A method for manufacturing valve seats using a laser cladding process is provided that includes forming a casting material on which the valve seats are to be formed; fabricating a valve seat target position on which laser cladding will be performed, the valve seat target position being provided at a location on the casting material where a valve seat is to be formed; removing an oxidation film formed on the valve seat target position; injecting a metal powder mixture on the valve seat target position, the metal powder mixture being realized through a mixture of two or more metal powders at a predetermined ratio by weight %; and irradiating a laser beam on the metal powder mixture to clad the metal powder mixture on the valve seat target position to thereby form the valve seat.
    Type: Grant
    Filed: April 24, 2002
    Date of Patent: June 7, 2005
    Assignee: Hyundai Motor Company
    Inventors: Yun-Seok Kim, Jea-Woong Yi, Jae-Hwan Kim, Phil-Gi Lee
  • Patent number: 6896170
    Abstract: A wire bonder for bonding an insulated wire to a surface is disclosed. The bonder includes a bond head, having a bonding position adjacent to said surface and a wire preparation position spaced apart from the surface. There is a wire holder on the bond head, the wire holder being sized and shaped to permit a free end of the insulated wire to extend from the wire holder when the bond head is in the spaced apart position. A source of insulated wire for said bond head is provided as well as an electrical discharge wand positioned adjacent to said bond head when the bond head is in the spaced apart position. The wand directs sufficient electricity at the extending free end of the insulated wire to form a bond ball on the free end. A ground associated with the insulated wire, is provided the ground being sized and positioned to conduct electrical energy away from the insulated bond wire to prevent the insulation on the bond wire remote from the free end from being damaged.
    Type: Grant
    Filed: November 20, 2002
    Date of Patent: May 24, 2005
    Inventors: Robert J. Lyn, John I. Persic, Young-Kyu Song
  • Patent number: 6892924
    Abstract: A friction stir rivet is rotated in a precessing motion and driven through a first fusible workpiece into an engaged second fusible workpiece, causing local portions of the first and second workpieces to plasticize. When the rivet is driven through the first workpiece and into the second workpiece, rotation is stopped and the plasticized material solidifies around the rivet creating an enlarged weld joining the metal workpiece and encompassing the rivet, which provides additional mechanical strength.
    Type: Grant
    Filed: December 18, 2002
    Date of Patent: May 17, 2005
    Assignee: General Motors Corporation
    Inventors: Robin Stevenson, Pei-Chung Wang
  • Patent number: 6889886
    Abstract: Conductive balls are transferred from a pallet onto an array of conductive pads on a semiconductor chip by means of a transfer apparatus; the transfer apparatus includes a pallet formed with an array of recesses same in pattern as the array of conductive pads, a movable head formed with an array of vacuum holes and a driving mechanism for moving the head from an idle position onto the pallet and from the pallet to the semiconductor chip; when the head is moved to the pallet, the vacuum holes are connected to the recesses so as to confine the conductive balls in the narrow spaces; the vacuum is developed; then the conductive balls are traveled through the closed spaces to the vacuum holes; even if the conductive balls have been charged, the conductive balls are never attracted to the adjacent balls, and are surely captured by the vacuum holes.
    Type: Grant
    Filed: March 25, 2002
    Date of Patent: May 10, 2005
    Assignees: NEC Corporation, Japan E.M. Co., LTD.
    Inventors: Ichiro Hazeyama, Sakae Kitajo, Yuzo Shimada, Akeo Katahira, Jun Ishida, Masaru Terashima, Kazuhiko Futakami
  • Patent number: 6889888
    Abstract: This invention relates to a method of spatially integrating multiple pipeline datasets. The method involves weld matching multiple inline inspection datasets by selecting one dataset as master and designated the other datasets as slaves, then spatially slaving the weld positions in the slaves to the weld positions in the master. After the weld matching process is completed, the method repositions the other data in the slave datasets relative to the master datasets, and which itself was previously spatially fit against a centreline model.
    Type: Grant
    Filed: December 19, 2002
    Date of Patent: May 10, 2005
    Assignee: Baseline Technologies, Inc.
    Inventors: Bruce Robin Dupuis, Michael John Webb
  • Patent number: 6883700
    Abstract: A turbine blade closure system composed of a closure member capable of being friction welded in an aperture in a hollow-cast turbine blade to prevent the escape of cooling fluids from an internal cavity in the turbine blade. In one embodiment, the aperture is formed in the turbine blade during the manufacturing process as a result of one or more support projections used to position a core block in a turbine blade mold.
    Type: Grant
    Filed: September 26, 2002
    Date of Patent: April 26, 2005
    Assignee: Siemens Westinghouse Power Corporation
    Inventors: Srikanth Chandrudu Kottilingam, Peter J. Ditzel
  • Patent number: 6883701
    Abstract: A plurality of parts are brazed using an iron/chromium filler metal. The parts are preferably composed of stainless steel. The brazed assembly forms a heat exchanger characterized by good corrosion resistance and low rates of leaching of Ni, which are further improved by a post-brazing conditioning step in an oxygen-containing atmosphere at a temperature of about 150° to 600° C. The preferred brazing filler metal consists essentially of a composition having the formula FeaCrbCocNidMoeWfBgSih wherein the subscripts are in atom percent and total 100%, “b” is about 5 to 20, “c” ranges from 0 to about 30, “d” is 0 to about 20, “e” is 0 to about 5, “f” is 0 to about 5, “g” is about 8 to 15, “h” is about 8 to 15, the balance being incidental impurities of up to about 1 percent by weight of the total composition.
    Type: Grant
    Filed: December 2, 2003
    Date of Patent: April 26, 2005
    Assignee: Metglas, Inc.
    Inventors: Anatol Rabinkin, Nicholas J. DeCristofaro
  • Patent number: 6877651
    Abstract: A brazed product has a metal substrate, a ceramic or graphite substrate, and a brazing alloy containing one of a high nickel content and cobalt content joining the ceramic or graphite substrate to the metal substrate. A method of joining these materials include providing a metal layer coating of titanium or nickel on the surface of the ceramic or graphite substrate to be joined or using a high nickel content or high cobalt content and containing titanium. The brazing alloy contains a high nickel content 70-95% by weight, or a high cobalt content between 45-55% by weight. This brazing alloy can contain titanium in the range between 0.5-5% by weight.
    Type: Grant
    Filed: December 2, 2002
    Date of Patent: April 12, 2005
    Inventor: Thomas A. Sandin
  • Patent number: 6875532
    Abstract: This invention relates to prospective electric energy sources to be employed in both mobile and stationery high-power electric stations. A method is disclosed for manufacturing a High Temperature Fuel Cell (HTFC), and the associated components, having a solid oxide electrolyte, and designed to transform chemical energy directly into electrical power. The disclosed method for manufacturing an HTFC and its components employs a narrow class of organic reagents which are well known, and widely used in the art. The manufacturing and assembly is performed within the framework of a single physical/chemical process and uniform technological equipment.
    Type: Grant
    Filed: November 9, 2001
    Date of Patent: April 5, 2005
    Inventors: Liliya Fedorovna Gorina, Vladimir Vladimirovich Sevastyanov, Vladimir Vitalievich Morozov, Sergei Vasilievich Nikitin, Alexander Sergeevich Lipilin, Igor Vladimirovich Rodionov, Alexander Vladimirovich Sevastyanov, Jury Grigorievich Yatluk
  • Patent number: 6871776
    Abstract: A process and apparatus for manufacturing Solid Solder Deposit-Printed Circuit Board (SSD-PCB) by melting dry solder powder previously deposited on a pocketed-PCB 20. The process and apparatus utilize as heat source an electrically heated conveyor wire mesh 76 instead of a reflow oven. This invention, unlike the prior art for producing SSD-PCB, can readily utilize dry solder powder in conjunction with flux layers 116 separately deposited on top of the conveyor wire mesh 76 thereby excluding the use of solder paste and associated paste printing equipment. Specifically the invention reduces the manufacturing cost because: shortens manufacturing time, reduces manufacturing energy consumption and requires less manufacturing equipment than prior art.
    Type: Grant
    Filed: March 10, 2003
    Date of Patent: March 29, 2005
    Inventor: Horacio Andrés Trucco
  • Patent number: 6871773
    Abstract: The present invention relates to composite metallic ultrafine particles which have excellent dispersion stability and can be produced on an industrial scale, and a process for producing the same, and a method and an apparatus for forming an interconnection with use of the same. A surface of a core metal produced from a metallic salt, a metallic oxide, or a metallic hydroxide and having a particle diameter of 1 to 100 nm is covered with an organic compound including a functional group having chemisorption capability onto the surface of the core metal.
    Type: Grant
    Filed: March 19, 2004
    Date of Patent: March 29, 2005
    Assignee: Ebara Corp.
    Inventors: Akira Fukunaga, Hiroshi Nagasawa, Kaori Kagoshima, Makiko Emoto
  • Patent number: 6863208
    Abstract: In a wire-bonding process, a chip is provided with at least a first contact pad. A chip carrier is further provided with at least a second contact pad. A plurality of stacked conductive bumps are formed on the first contact pad. A conductive wire is formed by a reverse bonding process. The conductive wire electrically connects the second contact pad of the chip carrier to the stacked conductive bumps over the first contact pad of the chip.
    Type: Grant
    Filed: December 31, 2002
    Date of Patent: March 8, 2005
    Assignee: Advanced Semiconductor Enigneering, Inc.
    Inventor: Chun-Chi Lee
  • Patent number: 6854637
    Abstract: An electrical connection for connecting a bond pad of a first device and a bond pad of a second device with an insulated or coated wire. The electrical connection includes a first wirebond securing a first portion of the insulated bond wire to the first device bond pad. A second wirebond secures a second portion of the insulated bond wire to the second device bond pad. A bump is formed over the second wirebond, and the bump is offset from the second wirebond. The offset bump enhances the second bond, providing it with increased wire peel strength.
    Type: Grant
    Filed: February 20, 2003
    Date of Patent: February 15, 2005
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Fuaida Harun, Kong Bee Tiu
  • Patent number: 6854634
    Abstract: A rivet having improved formability is provided. The rivet has a shank having a head at one end. The shank and the head have a refined grain structure. The rivet is manufactured from the region of the workpiece having a refined grain structure by first forming a region having a refined grain structure in a workpiece and then forming the rivet. The refined grain structure results in improved mechanical properties, such as formability, strength, toughness, ductility, corrosion resistance, and fatigue resistance. The improved formability of the rivet reduces the formation and propagation of cracks during the manufacture and installation of the rivets.
    Type: Grant
    Filed: May 14, 2002
    Date of Patent: February 15, 2005
    Assignee: The Boeing Company
    Inventors: Edward Litwinski, Rahmatollah F. Toosky
  • Patent number: 6851598
    Abstract: An electronic component with at least one semiconductor chip and a wiring layer are described. The wiring layer has elastic contact elements of low mechanical strength in the spatial directions x, y and z, which can be electrically connected to corresponding contact terminal areas of a printed circuit board. The semiconductor chip or the wiring layer additionally has at least two spacers for the mechanical connection to a printed circuit board. A method for producing the electronic component is also described.
    Type: Grant
    Filed: July 25, 2002
    Date of Patent: February 8, 2005
    Assignee: Infineon Technologies AG
    Inventors: Uta Gebauer, Harry Hedler, Jürgen Högerl, Volker Strutz