Abstract: A method of forming a sputtering target is described that involves bonding a backing plate onto a casement having one or more recesses that contain target material to form a bonded target. During the bonding process, the bonded target is optionally vacuum sealed within the recess. The bonded target is then optionally annealed while under vacuum to form an annealed sputtering target. The sputtering target can then be retrieved by removing at least a portion of the casement from the sputtering target in one or several steps. Also described is a casement having one or more recesses containing bonded target material that is optionally vacuum sealed in the casement. The casement, as well as the backing plate that is optionally bonded onto the casement, are further described as well as other options and methods.

Abstract: A coated nickel-base superalloy article, which is otherwise susceptible to the formation of a secondary reaction zone, is prepared by furnishing a nickel-base superalloy article substrate having thereon an initial aluminum-containing coating comprising an initial-coating additive zone and an initial-coating diffusion zone. The article is susceptible to the formation of the secondary reaction zone if heated to an elevated SRZ reaction temperature for an SRZ reaction period of time. The formation of the secondary reaction zone is avoided by first removing the initial-coating additive zone and the initial-coating diffusion zone, and thereafter depositing a subsequent aluminum-containing coating onto the article substrate. The subsequent aluminum-containing coating includes a subsequent-coating additive zone and a subsequent-coating diffusion zone.

Abstract: The invention encompasses a method of bonding a first mass to a second mass. A first mass of first material and a second mass of second material are provided and joined in physical contact with one another. The first and second masses are then diffusion bonded to one another simultaneously with the development of grains of the second material in the second mass. The diffusion bonding comprises solid state diffusion between the first mass and the second mass. A predominate portion of the developed grains in the second material have a maximum dimension of less than 100 microns. The invention also encompasses methods of forming a physical vapor deposition target bonded to a backing plate.

Abstract: Compression bonding tools having a CVD-formed pressing member with a non-reactive working surface are disclosed and described. Generally speaking, the pressing member is coupled to a tool body, which may include head member, and a tail member. In some aspects, the tool body may include a support member of a super hard material that is coupled to the pressing member along a bonding surface thereof. Further, in some aspects, the tool body may contain a heat directing member that facilitates the transfer of heat energy in a direction toward the pressing member. Such compression bonding tools have been found useful in a variety of well-known procedures, such as tap bonding systems (TAB).

Abstract: This invention provides a configuration of a joint that allows a satisfactory welded joint to be formed with reduced deformation of the joint region when two-face structures (panels) are friction-welded end to end. The panels 31, 32 each have two substantially parallel plates 33, 34 and a third member 35 connecting the two plates 33, 34. The end portions of the plates 33, 34 of one panel 32 are friction-welded to the end portions of the plates 33, 34 of the other panel 32. At least one of the panels has a plate 36 at its end for connecting the plates 33 and 34 and has a rigidity to support a pressing force produced during the friction welding.

Abstract: A method of sealing an opening in a cast member that employs a green seal cap formed from the consolidation of a mixture of powdered metal and a binder under sufficient pressure to impart enough strength to the cap to maintain its shape during the blade manufacturing process. The green seal plate cap is inserted into the opening in the cast member and the cast member is subjected to iso-static pressing, which bonds the seal plate cap to the cast member and sinters the cap to form a solid seal.

Abstract: A spot joining device comprises a joining tool, an induction motor for rotating the joining tool, a servo motor for vertically moving the joining tool along an axis of the joining tool, and a receiving member placed opposite to the joining tool. The joining tool includes a short-column shaped shoulder and a pin protruded downwardly along the axis from a central portion of a lower face of the shoulder at a tip end portion thereof. Two works such as aluminum alloy plates are lapped and placed on a receiving member. When the joining tool is rotated and moved downwardly, a joint spot of the works is heated and softened due to friction heat generated by the rotating pin. Thereby, plastic flow occurs in the vicinity of the joint spot. The vicinity of the joint spot is stirred and the works are fused at the joint spot. Thus, the works are spot-joined.

Abstract: A solder ball dispenser (100) has feeder unit, head unit chambers (200, 300) and a pneumatic singulator (370). Solder balls (101) are mobilized in the chambers by moving air. The solder ball dispenser receives a continuous supply of unorganized solder balls and arranges them in a single stack (340). The singulator ejects the balls one at a time to a target device such as a Ball Grid Array. The dispenser has a plurality of conduits (331-338) for applying one of air pressure and vacuum to various points of the chambers and the channel. Solder balls are transported through the dispenser and ejected from the dispenser by the programmed application of air pressure and vacuum. The trajectory of each solder ball is stopped before moving to a next position in the pneumatic singulator. No solid object causes solder balls to move within the dispenser or to be ejected from the dispenser.

Abstract: A method of forming bumps on the active surface of a silicon wafer. An under-ball metallic layer is formed over the active surface of the wafer. A plurality of first solder blocks is attached to the upper surface of the under-ball metallic layer. Each first solder block has an upper surface and a lower surface. The lower surface of each first solder block bonds with the under-ball metallic layer. The upper surfaces of the first solder blocks are planarized. A second solder block is attached to the upper surface of each first solder block and then a reflow operation is carried out.

Abstract: Apparatus for detecting the oscillation amplitude of an oscillating object (3) includes an optical radiation source (9) and a detector (10) including first and second optical radiation sensing areas (24A, 24B) adjacent each other. The detector (10) and the optical radiation source (9) are adapted to be located opposite each other with the oscillating object (3) located between the source (9) and the detector (10) so that the object (3) blocks a portion of the sensing areas (24A, 24B) from receiving optical radiation from the source (9). A processor (18) coupled to the detector (10) receives first and second output signals representing the magnitude of optical radiation sensed by the first and second optical radiation sensing areas (24A, 24B), respectively. The processor (18) processes the first and second output signals to obtain an indication of the amplitude of oscillation of the object (3).

Abstract: Bond-wire cutting device for cutting off the part of a bond wire that extends beyond the bonding contact area after a bonded connection has been produced, with a knife that can be moved with a movement component perpendicular to the surface of a substrate and hence to the bonding contact area, wherein the knife is mounted so as to be yielding with respect to the movement component perpendicular to the substrate surface, so that the force acting on the cutting edge of the knife when the knife encounters the substrate is limited to a prespecified peak value.

Abstract: The method of controlling a linear vibration welding apparatus, in accordance with the invention, may comprise the steps of: fastening a first workpiece portion in a fixed position; fastening a second workpiece portion to a reciprocating member; energizing a first single winding magnet with direct current power to create a magnetic field; sensing a location of the reciprocating member with respect to a zero point; and energizing a second magnet when the reciprocating member has crossed the zero point when moving towards the first magnet. The linear vibration welding apparatus in accordance with the invention may comprise: a frame; a flexure array; a first magnet assembly; a second magnet assembly; a digital controller; and direct current amplifiers for powering the magnet assemblies.

Abstract: A pipe aligning tool is provided for providing proper alignment and spacing between two piping components to be welded together in an end to end abutted relationship. The tool includes a spacer lying in a single plane for positioning between the ends of the piping components to provide the proper spacing. A pipe locator in the form of two projections, projects perpendicularly outwardly from each side of the spacer for concentric alignment of piping components on opposing sides of the spacer when abutted with the respective pipe locators. The simple construction of the tool permits two piping components to be both concentrically aligned and properly spaced for welding in a simple task which can be manually performed without depending upon visual alignment by the user.

Abstract: A laser cutting or welding device, the device having a laser head (10) and a robot (35), wherein the laser head is attached to the robot (35). The laser head (10) has a housing (12), a focal lens (26) disposed within the housing and a light source (18) in optical communication with the focal lens (26). The housing (12) has a nozzle with a tip (90), the tip having an exit port (17). The laser head (10) has means (33) for adjusting a light path of a light beam directed from the light source onto a focal optic to center a focusing beam formed by the focal optic coaxial with the tip. In one aspect hereof, the laser device has a crash avoidance system.

Abstract: A method for producing a joined body comprising a supporting member made of a ceramic material for supporting a semiconductor wafer, a metal member and a joining layer for joining the supporting and metal members is provided. A first metal film is formed on a joining surface of the supporting member. A second metal film is formed on a joining surface of the metal member. A metal adhesive is placed between the first and second films to provide an assembly. The assembly is then heated at a temperature not higher than a melting point of the metal adhesive while the assembly is subjected to isostatic pressing, so that the supporting and metal members are joined by diffusion joining.

Abstract: The aim of the invention is to simplify and improve the production method for circuit arrangements that are mounted on a support element (5), said element having thermal through-platings (7) which are at least partially scaled by a screen printing process. To this end, the screen printing process is carried out after the application of a first metallization layer (6) to the support element (5) which forms the base metallization layer, whereby the residue of the screen printing material (8) remaining on the underside (13) of the support element (5) is stripped once the screen printing material (8) has been cured, using at least a mechanical cleaning process and/or a chemical cleaning process.

Abstract: Systems and methods for forming a seal between members of an assembly are disclosed. In one embodiment, a seal is formed between a first member and a second member by establishing within the members a bounded volume and creating within the bounded volume a pressure differential with respect to the ambient pressure outside the bounded volume. The pressure differential results in a uniformly applied clamping force to the members thereby creating a reliable seal. A sealing member (such as solder, epoxy, or other sealant) is positioned between the first and second members and the resulting assembly is mechanically positioned such that heat can then be applied to melt the solder. Concurrently, the pressure differential is created which allows the externally applied mechanical positioning to be relaxed while the members are being sealed together. This system and method can be used to create hermetic seals.

Abstract: A barrier metal layer is provided on at least one electrodes, wherein one electrode is formed on a substrate and another is connected to an electronic component, so as to coat a base material of the electrode. The base material is made of a material containing Cu. Soldering between the electrode of the electronic component and the electrode on the substrate is conducted by supplying a solder material containing Sn and Zn, placing the solder material in contact with the barrier metal layer while the solder material is in a molten state, and solidifying the solder material. Thus, in the case where the electronic component is soldered to the substrate with the solder material such as an Sn—Zn-based material, the degradation of a soldering part is avoided, Consequently, a sufficient thermal fatigue strength of the soldering part is obtained.

Abstract: A method for manufacturing a metal structure in which the metal structure has separate walls forming channels through which a fluid can flow includes at least partially wetting the walls inside the channels with an adhesive, bringing the metal structure into contact with a solder that adheres to the adhesive, and carrying out a heat treatment to form soldered connections between the separate walls. The method is distinguished by the fact that the dosed delivery of the adhesive is performed by at least one dosing element having a honeycomb configuration and having an inlet side (8) and an outlet side, the element being connected to the adhesive. The adhesive enters the dosing element through the inlet side and is uniformly distributed into the channels through the outlet side. The invention also includes a device for wetting the metal structure with the adhesive.

Abstract: A shielding gas filter that can be readily incorporated into a gas shielding system for an arc welding apparatus. The gas shielding filter is readily installed to the system upstream of a gas solenoid valve and removes any potentially harmful particles from the supply of the shielding gas to prevent those particles from entering the gas solenoid valve. The shielding gas filter includes a housing having an inlet and an outlet and a specially formed passageway that communicates between the inlet and the outlet. A filter screen is retained within the housing to filter out the particles larger than a predetermined size. Preferably, the filter screen is constructed of stainless steel and filters out particles larger than about 100 microns.