Abstract: A low temperature target and backing plate bonding process and assemblies made thereby. A plurality of projections are formed in the harder member of the assembly. The assembly is bonded by conventional techniques around the peripheral assembly boundaries. The assembly is then pressure consolidated at low temperature so that the projections, circumscribed by the bonded zone, penetrate into the softer member promoting the formation of metal to metal cold diffusion type bonds.

Abstract: The invention provides a wire-bonding apparatus for forming electrical connections between a semiconductor chip and a leadframe, comprising a plurality of bond-heads associated with a plurality of work holders on said wire bonding apparatus for holding a plurality of leadframes, wherein each bond-head of the apparatus is capable of independent bonding operation simultaneously with the other bond-heads, without synchronization of movement with the other bond-heads.

Abstract: The present invention relates to a method for producing AlMn strips or sheets for producing components by soldering, wherein a precursor material is produced from a melt which contains (in weight-percent) Si: 0.3-1.2%, Fe: ≦0.5%, Cu: ≦0.1%, Mn: 1.0-1.8%, Mg: ≦0.3%, Cr+Zr: 0.05-0.4%, Zn: ≦0.1% , Ti: ≦0.1% , Sn: ≦0.15%, and unavoidable companion elements, whose individual amounts are at most 0.05% and whose sum is at most 0.15%, as well as aluminum as the remainder, wherein the precursor material is preheated at a preheating temperature of less than 520° C. over a dwell time of at most 12 hours, wherein the preheated precursor material is hot rolled into a hot strip using a final hot rolling temperature of at least 250° C., wherein the hot strip is cold rolled into a cold strip without intermediate annealing.

Abstract: The method of manufacturing a structural assembly includes positioning a first structural member at least partially adjacent a second structural member to define an interface therebetween and inserting a rotating plug into the first and second structural members at the interface to thereby join the first structural member to the second structural member. The resulting friction plug weld provides a relatively strong joint between the structural members, requires less forming and machining time, and is compatible with single-sided tooling. Additionally, the friction plug weld is compatible with other joining methods, such as friction stir welding.

Abstract: A soldering machine for tape carrier package. The soldering machine includes a cylinder, a linking rod, a cushioning pad, a floating connector and a press head assembly. The cylinder has a first end and a second end. The linking rod passes through the interior of the cylinder. The linking rod also has a first end and a second end. The first end of the linking rod protrudes from the first end of the cylinder while the second end of the first linking rod protrudes from the second end of the cylinder. The first end of the linking rod has a threaded section with an adjusting nut screw onto the threaded section. There is a cushioning pad between the adjusting nut and the cylinder. The second end of the linking rod has a floating connector. The press head assembly and the linking rod is connected together via the floating connector.

Abstract: The present invention relates to composite metallic ultrafine particles which have excellent dispersion stability and can be produced on an industrial scale, and a process for producing the same, and a method and an apparatus for forming an interconnection with use of the same. A surface of a core metal produced from a metallic salt, a metallic oxide, or a metallic hydroxide and having a particle diameter of 1 to 100 nm is covered with an organic compound including a functional group having chemisorption capability onto the surface of the core metal.

Abstract: A solder ball attachment system for manufacturing an integrated circuit or the like is disclosed. The solder ball attachment system includes a flux station adapted to apply flux onto a substrate and a solder ball placement station adapted to place solder balls onto the flux. A conveyor assembly is included to move the substrate between the flux station and the solder ball placement station.

Abstract: A method of tinning one or more electrical terminals by hot solder dipping is disclosed herein. The process generally involves placing a solder resistant material in a through hole formed in an electrical terminal, and then dipping at least a portion of the terminal into a hot solder. The solder resistant material may include, for example, a titanium or stainless steel wire, and the solder may be a tin-lead solder such as Sn63.

Abstract: A system for joining a pair of structural members having widely differing coefficients of thermal expansion is disclosed. A mechanically “thick” foil is made by dispersing a refractory metal powder, such as molybdenum, niobium, tantalum, or tungsten into a quantity of a liquid, high expansion metal such as copper, silver, or gold, casting an ingot of the mixture, and then cutting sections of the ingot about 1 mm thick to provide the foil member. These foil members are shaped, and assembled between surfaces of structural members for joining, together with a layer of a braze alloy on either side of the foil member capable of wetting both the surfaces of the structural members and the foil. The assembled body is then heated to melt the braze alloy and join the assembled structure. The foil member subsequently absorbs the mechanical strain generated by the differential contraction of the cooling members that results from the difference in the coefficients of thermal expansion of the members.

Abstract: A soldering method including: bonding a first electronic component having electrodes plated with a material containing lead to one surface of an interconnect substrate through solder containing no lead; and flow-soldering to bond a second electronic component to the other surface of the interconnect substrate. In the soldering method, a joint section between the first electronic component and the interconnect substrate is heated at the same time as or after the step of flow soldering to melt the joint section.

Abstract: A backing plate of Ti for supporting a Ti sputtering target is formed of at least two components welded together. The backing plate is welded by interposing a Cu or Zr foil or powder between faces to be welded, and then heating the assembly to a reaction temperature high enough to melt one of the Ti and Cu or Zr to produce a liquid phase. The heating temperature is retained for a time long enough to permit diffusion of the Cu or Zr into the Ti to produce a liquid phase diffusion weld. By permitting diffusion to occur, a separate metallic compound is not produced at the welding face. In effect welding is accomplished without producing a welding face, whereby no interface exists in the finished weld. The resulting weld has a strength substantially equal to the strength of the Ti material, and very good welding qualities.

Abstract: The invention provides a friction stir welding apparatus and method and a processing apparatus and method, which are not easily affected by deformations of a work being processed. The friction stir welding apparatus inserts a rotating tool into the work and moves the rotating tool relative to the work to join members of the work. The friction stir welding apparatus and method and the processing apparatus and method of the invention, the latter cutting or grinding the work with a rotating cutter or grindstone, comprises controlling a relative distance between the tool, cutter or grindstone and the work under the joining or processing operation or an insertion depth so that the load factor or electric current of a spindle motor for rotating the tool, cutter or grindstone is within a predetermined range, and a controller therefor.

Abstract: A first metal member is contacted with a second metal member. A metal fastener is provided including a core and a cladding disposed upon the core. The fastener is driven through the first member and into the second member, inducing friction between the fastener, the first member and the second member for at least locally melting portions of the cladding, the first member and the second member to form a flowable material that solidifies and metallurgically bonds the fastener to the first member and the second member for attaching the members together.

Abstract: A component mounting method for mounting several micro component chips aligned in parallel onto a board by soldering. An allowable offset is set for each electrode, taking into account a self-alignment effect of melted solder in soldering for bonding component terminals onto electrodes formed on the board corresponding to a component layout. Solder printing and component placement onto the electrodes are shifted by the offset. This offset is balanced by the self-alignment effect of melted solder, and each component is secured at an appropriate position. This mounting method allows less stringent spacing conditions to be applied for mounting and prevents the occurrence of defects during printing and placement.

Abstract: A stir friction pin tool has at least a portion of its distal end or tip which is either more rough than the cylindrical portion of the pin tool, or which has a surface roughness greater than 128 &mgr;″ regardless of the roughness of the cylindrical portion. The pin tool may include machined holes or slots, or may have an etched tip surface. The roughness aids in generating heat during the plunging portion of a stir friction welding or heating operation, to thereby reduce the overall time required for the operation.

Abstract: A method for plugging a hole, particularly a hole provided in a cooling element, in which method a hole formed in a piece essentially made of mainly copper, for instance in the housing element of a cooling element, there is arranged a plug mainly made of copper. Between the side surface of the plug and the inner surface of the hole, there is arranged brazing agent with a melting temperature lower than that of the pieces to be joined together, and the junction area between the plug and the piece, such as the housing element of the cooling element, is heated at least up to the melting temperature of the brazing agent or to the vicinity thereof, whereafter the junction area is cooled. The invention also relates to a cooling element manufactured according to said method.

Abstract: A rotary tool (140) is relatively moved against members (30, 30) to be welded so as to perform friction stir welding of said members, while blades (145) mounted on the rotary tool (140) and a rotary brush (220) are used to cut the welded portion, and swarfs on the cut surface are removed through a suction opening (225), before medium liquid is supplied on said cut surface through a supply opening (240). Next, an inspection roller (250) is rotated on the surface of the welded portion for inspection. A probe (251) is provided within the roller (250). Upon detecting a defect, paint is applied to the position of defect by a marking device (270). Thereafter, based on said marking, the joint portion is cut and repaired by welding.

Abstract: A method and apparatus are provided for reworking electronic component assemblies where the components are joined by solder interconnections. A cutting device employing a heated wire, blade or other cutting element is forced against and through the solder interconnections to sever the interconnections. A preferred cutting device employs moving the cutting element transverse to the solder interconnections to also provide a sawing action to the solder interconnections. Another cutting device employs a water jet to provide a high pressure stream of water that cuts and severs the solder interconnections.

Abstract: A transducer vibrated by a vibrator and used in a bonding apparatus, the transducer including holding portions provided so as to protrude at at least two locations that correspond to the nodes of vibration of a transducer main body, and connecting portions each connecting the tip ends of two protruding holding portions to each other. The transducer main body, holding portions and connecting portions are integrally formed from a single material member.

Abstract: In a method for joining a steel tube with an aluminum rib, a zinc-aluminum alloy layer, having an aluminum content of 0.5% by wt. to 20% by wt., is applied to the surface of the steel tube or the aluminum rib, and then a fluxing agent in the form of cesium-aluminum tetrafluoride is applied between the steel tube and the aluminum rib at room temperature before or during the mechanical contact of the aluminum rib with the steel tube. The steel tube provided with the aluminum rib is then heated to a soldering temperature of between 370° C. and 470° C. and subjected to room temperature to cool down.