Patents Examined by Livius R Cazan
  • Patent number: 10559902
    Abstract: Disclosed aspects relate to connector structures and a card. A first connector structure is to join a first subset of a set of electrical connections. A second connector structure is to join a second subset of the set of electrical connections. The card manages the set of electrical connections and is located between the first and second connector structures to connect with the first and second connector structures.
    Type: Grant
    Filed: January 4, 2016
    Date of Patent: February 11, 2020
    Assignee: International Business Machines Corporation
    Inventors: Gerald K. Bartley, Darryl J. Becker, Matthew S. Doyle, Mark J. Jeanson, Mark O. Maxson
  • Patent number: 10553772
    Abstract: An apparatus for manufacturing a thermoelectric module is provided. The apparatus includes a thermoelectric element interposed between a lower substrate that includes a lower electrode and an upper substrate that includes an upper electrode. Additionally, the apparatus includes a first block that is configured to support the lower substrate and a second block that is configured to move vertically with respect to the first block and support the upper substrate. A jig is configured to position the thermoelectric element in connection with the upper electrode and the lower electrode.
    Type: Grant
    Filed: May 17, 2016
    Date of Patent: February 4, 2020
    Assignee: Hyundai Motor Company
    Inventors: Han Saem Lee, Jong Kook Lee, Kyong Hwa Song, Byung Wook Kim, Jin Woo Kwak, Gyung Bok Kim, In Woong Lyo
  • Patent number: 10553992
    Abstract: A method and system for a dynamic keying system is disclosed. The method and system can include a male connector device having a first plurality of settings for one or more key features, and a female connector device having a second plurality of settings for one or more key features. The female connector device can be configured to operate in an initial mode in which it is configured to, in response to the introduction of the male connector device, correspond a first setting of the first plurality of settings to a second setting of the second plurality of settings. The female connector device can also be configured to operate in a subsequent mode, in which it can permit coupling with at least one male connector device having the first setting and consistently deny access to at least one male connector device having a third setting different than the first setting.
    Type: Grant
    Filed: December 5, 2017
    Date of Patent: February 4, 2020
    Assignee: International Business Machines Corporation
    Inventors: Phillip V. Mann, Mark D. Plucinski, Sandra J. Shirk/Heath, Arvind K. Sinha
  • Patent number: 10551228
    Abstract: A method for manufacturing an apparatus for measuring flow of a fluid flowing through a measuring tube of metal using the magneto-inductive principle, comprising the method steps as follows: securing first and second collars of metal externally on the measuring tube with an orientation perpendicular to the tube axis of the measuring tube; lining the measuring tube internally with an electrically non-conductive, elastic liner; and altering a measuring section of the measuring tube located at least partially between the first collar and the second collar by means of cold deformation in such a manner that the cross sectional area of the measuring section is reduced compared with the cross sectional area of an inflow section of the measuring tube located upstream from the measuring section and an outflow section of the measuring tube located downstream from the measuring section.
    Type: Grant
    Filed: August 19, 2015
    Date of Patent: February 4, 2020
    Assignee: ENDRESS + HAUSER FLOWTEX AG
    Inventors: Florent Tschambser, Lars Dreher, Thomas Sulzer
  • Patent number: 10549432
    Abstract: A component mounting apparatus for mounting a component on a substrate includes a pair of chuck claws that sandwich and grip the component; and adapters that are detachably mounted on the chuck claws and grip the component in place of the chuck claws. The adapters are mounted on the chuck claws in accordance with the component that is an object to be mounted and the component is gripped by using the adapters.
    Type: Grant
    Filed: August 4, 2016
    Date of Patent: February 4, 2020
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Dai Yokoyama, Hideaki Watanabe, Shigeki Imafuku, Yosuke Nagasawa, Kian Hong Lam
  • Patent number: 10551413
    Abstract: A precise assembly mechanism contains: a control unit controlling a clamp unit, a loading unit, and a visual sensing unit to operate. The clamp unit includes a clamper and moves in a third direction Z, the loading unit includes a slider moving in a first direction X or a second direction Y, the holding tray moves in the first direction X or the second direction Y. The visual sensing unit includes a first sensor for identifying a position of an upper rim of each of at least one through orifice on a holding tray, a second sensor for identifying positions of a lower rim of each through orifice and a tip of each of multiple materials, a third sensor for determining a profile of each material in the second direction Y, and a fourth sensor configured to judge the profile of each material in the first direction X.
    Type: Grant
    Filed: October 23, 2017
    Date of Patent: February 4, 2020
    Assignee: INNOSERV, INC.
    Inventor: Chih-Meng Wu
  • Patent number: 10547232
    Abstract: A stator for a high efficiency motor and a manufacturing method of a stator for a high efficiency motor are disclosed. The method includes: preparing filling powder by coating a surface of soft magnetic powder with an insulating layer; providing a stator core partitioned into a center hole and inner spaces, the stator core including a yoke portion and a plurality of teeth; coiling coils around the plurality of teeth located in the inner spaces, respectively; and filling the inner spaces with a mixture of the filling powder and an adhesive, and curing the mixture of the filling powder and the adhesive.
    Type: Grant
    Filed: December 9, 2016
    Date of Patent: January 28, 2020
    Assignee: HYUNDAI MOTOR COMPANY
    Inventor: Young Min Kim
  • Patent number: 10546833
    Abstract: A method of forming a plurality of electronic component packages includes attaching electronic components to a carrier, wherein high aspect ratio spaces exist between the electronic components. A dielectric sheet is laminated around the electronic components thus filling the spaces and forming a package body. The spaces are completely and reliably filled by the dielectric sheet and thus the package body has an absence of voids. Further, an upper surface of the package body is planar, i.e., has an absence of ripples or other non-uniformities. Further, lamination of the dielectric sheet is performed with a low cost lamination system.
    Type: Grant
    Filed: June 27, 2017
    Date of Patent: January 28, 2020
    Assignee: Amkor Technology, Inc.
    Inventor: Brett Arnold Dunlap
  • Patent number: 10542649
    Abstract: A component mounting related system is provided with a first component mounting related apparatus, a second component mounting related apparatus, an electric power source provided in the first component mounting related apparatus, a first power transmission line provided in the first component mounting related apparatus, a power transmission connector, and a second power transmission line. The electric power source supplies an electric power for actuating the first component mounting related apparatus. The first power transmission line transmits the electric power in the first component mounting related apparatus. The power transmission connector transmits the electric power transmitted by the first power transmission line to the second component mounting related apparatus. The second power transmission line transmit, in the second component mounting related apparatus, the electric power supplied from the first component mounting related apparatus through the power transmission connector.
    Type: Grant
    Filed: July 14, 2015
    Date of Patent: January 21, 2020
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Masayuki Mantani, Minoru Murakami
  • Patent number: 10529688
    Abstract: A system and method of manufacture of an integrated circuit device system includes mounting a first elevated device on a first riser positioned adjacent to a base device. The first elevated device includes a first device overhang that extends over the base device. A second elevated device can be mounted on a second riser adjacent to the first riser to allow the attachment of a second elevated device mounted above the first elevated device to achieve higher component densities.
    Type: Grant
    Filed: March 19, 2017
    Date of Patent: January 7, 2020
    Assignee: SMART Modular Technologies, Inc.
    Inventors: Satyanarayan Shivkumar Iyer, Reuben J. Chang, Victor Mahran
  • Patent number: 10530227
    Abstract: A manufacturing method comprising: a process S1 of forming a plate member which has a substantially annular scrap portion having a center hole through an axial direction and a core plate portion defining a portion of the core pieces arranged continuously with the scrap portion on a radially inner side of the scrap portion; a process S2 of forming a laminated body, which has the core pieces, by laminating the plate member; a process S3 of providing the laminated body and the shaft in a mold; a process S4 of forming a molding body by inserting a molten resin or a nonmagnetic material in the mold and forming the filling portion of which at least a portion is located between the core pieces; and a process S5 of separating the scrap portion and the core plate portion.
    Type: Grant
    Filed: May 19, 2016
    Date of Patent: January 7, 2020
    Assignee: NIDEC CORPORATION
    Inventors: Takeshi Honda, Yosuke Yamada, Yasuaki Nakahara, Hisashi Fujihara, Takayuki Migita, Tsuyoshi Nakamura
  • Patent number: 10510485
    Abstract: A magnetic assembly includes a winding and a housing disposed about the winding. The housing includes an interior surface contoured to conform to the winding to facilitate heat transfer between the winding and the housing. A method of manufacturing a magnetic assembly includes forming a contoured interior surface on a housing and assembling a winding into the housing such that the interior surface of the housing conforms to the winding to facilitate heat transfer between the winding and the housing.
    Type: Grant
    Filed: November 22, 2016
    Date of Patent: December 17, 2019
    Assignee: Hamilton Sundstrand Corporation
    Inventors: John Huss, William D. Sherman
  • Patent number: 10511077
    Abstract: A method for manufacturing a mode converter including a substrate that is a single member and includes a first main surface, a second main surface opposite to the first main surface, and a micro hole which is formed in the first main surface, grounding conductor layers that are formed on the first main surface and the second main surface, a plane circuit that is formed on the first main surface, and a pin that is formed so as to cover an inner surface of the micro hole and is electrically connected to the plane circuit, the method includes: irradiating the substrate with laser light to form a first modified portion to a desired depth from one main surface of the substrate; removing the first modified portion to form the micro hole; and filling the micro hole with a conductive material to form the pin.
    Type: Grant
    Filed: August 13, 2015
    Date of Patent: December 17, 2019
    Assignee: FUJIKURA LTD.
    Inventor: Yusuke Uemichi
  • Patent number: 10505414
    Abstract: A rotor core assembly that includes a magnet, a first end cap located at an end of the magnet, a second end cap located at an opposite end of the magnet, and a sleeve that surrounds the magnet and the end caps. The sleeve forms an interference fit with each of the end caps, and an adhesive is located between the magnet and the sleeve. Additionally, a method of manufacturing the rotor core assembly.
    Type: Grant
    Filed: March 5, 2014
    Date of Patent: December 10, 2019
    Assignee: Dyson Technology Limited
    Inventors: David Ions, Paul Theo Heyting, Matthew John Childe, David Michael Jones
  • Patent number: 10492350
    Abstract: A position and orientation of an electronic component attitude are recognized, a mounting head is moved above the electronic component, a rotator is horizontally rotated so that a lower surface of the electronic component is oriented in a direction opposite to a pusher, the electronic component of the fallen-down attitude is sucked and held by the nozzle by lowering a component holder, a attitude of the electronic component that is held is changed to a stand-up attitude by vertically rotating the component holder, leads of the electronic component of which the attitude is changed to the stand-up attitude and insertion holes of the substrate into which the leads are inserted are positioned, and the leads are inserted into the insertion holes of the substrate by pushing the electronic component toward the substrate by causing the pusher to abut against an upper surface of the electronic component of the stand-up attitude.
    Type: Grant
    Filed: July 10, 2016
    Date of Patent: November 26, 2019
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Dai Yokoyama, Hideaki Watanabe, Yosuke Nagasawa, Shigeki Imafuku, Kian Hong Lam
  • Patent number: 10483454
    Abstract: A method for producing a piezoelectric component is disclosed. In an embodiment, the method includes producing a ceramic precursor material of the general formula Pb1-x-y-(2a-b)/2V(2a-b)/2?BaxSry[(TizZr1-z)1-a-bWaREb]O3, where RE is a rare earth metal and V? is a Pb vacancy, mixing the ceramic precursor material with a sintering aid, forming a stack which includes alternating layers including the ceramic precursor material and a layer including Cu and debindering and sintering the stack thereby forming the piezoelectric component having Cu electrodes and at least one piezoelectric ceramic layer including Pb1-x-y-[(2a-b)/2]-p/2V[(2a-b)/2-p/2]?CupBaxSry[(TizZr1-z)1-a-bWaREb]O3, where 0?x?0.035, 0?y?0.025, 0.42?z?0.5, 0.0045?a?0.009, 0.009?b?0.011, and 2a>b, p?2a?b.
    Type: Grant
    Filed: November 27, 2016
    Date of Patent: November 19, 2019
    Assignee: TDK ELECTRONICS AG
    Inventors: Alexander Glazunov, Adalbert Feltz
  • Patent number: 10476358
    Abstract: A method for manufacturing an electrical machine includes printing a stator core; printing a first part of a stator winding; coupling the first part of the stator winding to the stator core; printing a second part of the stator winding onto the first part of the stator winding to form a stator assembly; printing a first part of a rotor shaft; printing a rotor core onto the first part of the rotor shaft; printing a second part of the rotor shaft onto the rotor core; printing a first part of a rotor winding; coupling the first part of the rotor winding to the rotor core; and printing a second part of the rotor winding onto the first part of the rotor winding to form a rotor assembly.
    Type: Grant
    Filed: August 8, 2017
    Date of Patent: November 12, 2019
    Assignee: General Electric Company
    Inventors: Hao Huang, Xiaochuan Jia, Joshua Tyler Mook, Victor Bernard Bonneau
  • Patent number: 10477084
    Abstract: A manufacturing method for a camera module including a multilayer body in which an image sensor IC and a lens are arranged with an optical path provided in the multilayer body being disposed therebetween includes a first step and a second step. In the first step, the multilayer body is formed by stacking and combining flexible sheets. In the second step, a through hole is formed in flexible base material layers that constitute a portion of the multilayer body to form the optical path defined by the through hole.
    Type: Grant
    Filed: August 14, 2015
    Date of Patent: November 12, 2019
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Nobuo Ikemoto, Atsushi Kumano, Jerry Hsieh, Jun Sasaki
  • Patent number: 10468847
    Abstract: A handheld hydraulically actuatable crimping device includes a hydraulic piston that can be displaced in a cylinder against the force of a spring. The piston is connected to a crimping part by a piston rod in order to carry out a crimping operation. The piston includes first and second partial pistons with first and second partial application faces which can be acted upon with hydraulic medium that has the same hydraulic pressure. Both partial pistons are respectively connected to a first and a second crimping part. The second crimping part can at a greater traveling distance only be acted upon with the second partial piston. The second crimping part can be acted upon with both partial pistons over a first partial traveling distance that is defined by the displacement of the first partial piston from its initial position up to the point, at which it reaches a stop. The first crimping part is axially covered in its entirety by the second crimping part.
    Type: Grant
    Filed: January 6, 2014
    Date of Patent: November 5, 2019
    Assignee: GUSTAV KLAUKE GMBH
    Inventor: Egbert Frenken
  • Patent number: 10455705
    Abstract: A device configured for making a wire aerial of an element of radio frequency identification (RFID), which device comprises: a main body, extending along a longitudinal direction and having a longitudinal seat adapted to house a wire; a putting-wire head arranged at one end of the main body and constrained to the main body, the putting-wire head comprising: a guide element adapted to engage the wire and to deposit it onto a substrate, and which guide wire has a translational degree of freedom along the longitudinal direction with respect to the main body; and a wire-restraining element adapted to selectively abut on the guide element, wherein the putting-wire head is adapted to assume a first rest configuration, wherein the restraining element is abutted onto the guide element and the wire is retained between the restraining element and the guide element, and a second operative configuration.
    Type: Grant
    Filed: October 6, 2016
    Date of Patent: October 22, 2019
    Assignee: Mecstar S.r.l.
    Inventors: Marcello Lolli, Massimiliano Carlucci, Marco Carlucci