Patents Examined by Livius Radu Cazan
  • Patent number: 7107676
    Abstract: Manufacturing equipment and manufacturing process steps that improve upon prior art processes for the manufacturing of filament tube and arc tube light sources, their components and subassemblies, and lamps employing said light sources. A double ended, tipless filament tube or arc tube light source incorporates a drawn-down tubular body, and one piece foliated leads with spurs for process handling and for spudding into a filament with stretched-out legs. Bugled ends on the body provide a novel cutoff means, facilitate a flush-fill finishing process, and enhance mounting and support of the light sources in lamps. The foliated leads are made from a continuous length of wire in a process including foil hammering and two-bath AC electrochemical etching. Cost-reduced light source and lamp production enables affordable household consumer lamps, even when containing two series-connected halogen filament tubes.
    Type: Grant
    Filed: November 5, 2003
    Date of Patent: September 19, 2006
    Inventor: Elmer G. Fridrich
  • Patent number: 7103961
    Abstract: An amorphous laminated core and a method of making an amorphous laminated core by punching core pieces from amorphous thin sheet material, laminating the plural sheets of core pieces, and forming caulking through-holes by punching. Rod shaped materials are directed into the caulking through-holes of the laminated core pieces.
    Type: Grant
    Filed: January 9, 2003
    Date of Patent: September 12, 2006
    Assignee: Mitsui High-tec, Inc.
    Inventor: Katsufusa Fujita
  • Patent number: 7100279
    Abstract: A method of mounting an electronic part on a board, in which an electronic part and a mounting board on which the electronic part is to be mounted are placed in a vacuum or inert atmosphere, and the electronic part is mounted on the board by bringing the bonding members of the electronic part and the board into contact with each other at normal temperature to thereby mount the electronic part on the board, the method comprising forming the bonding members of at least one of the electronic part and the board out of a solder material, and bringing the bonding members of the electronic part and the board into contact with each other without preprocessing the bonding surfaces of the bonding members.
    Type: Grant
    Filed: April 21, 2004
    Date of Patent: September 5, 2006
    Assignees: Shinko Electric Industries Co., Ltd., Oki Electric Industry Co., Ltd., Sanyo Electric Co., Ltd., Sharp Kabushiki Kaisha, Sony Corporation, Kabushiki Kaisha Toshiba, NEC Corporation, Hitachi, Ltd., Fujitsu Limited, Matsushita Electric Industrial Co., Ltd., Mitsubishi Denki Kabushiki Kaisha, Rohm Co., LTD
    Inventors: Tadatomo Suga, Toshihiro Itoh, Hideto Nakazawa, Masatoshi Akagawa
  • Patent number: 7093356
    Abstract: A wiring substrate with bumps protruding from a surface of the substrate covers one side of a metallic base with an electrical insulating film thereon, having open holes exposing the base, etching the base through the open holes to form concavities in the base, electroplating the interior faces of the concavities to form a barrier metal film thereon filling the concavities with a bump material by electroplating, and forming a barrler layer on the bump material in each concavity. A stack of wiring patterns is formed on the insulating film, adjacent wiring patterns being separated by a respective intervening insulating layer and being electrically connected to each other through vias in the intervening insulating layer, and to the bump material filled in the concavities. Thereafter, the base and barrier metal film are removed.
    Type: Grant
    Filed: September 15, 2003
    Date of Patent: August 22, 2006
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventors: Kei Imafuji, Tadashi Kodaira, Takeshi Chino, Jyunichi Nakamura, Miwa Abe
  • Patent number: 7089658
    Abstract: A clamp remover is disclosed. In one example of the present embodiments, a wire clamp remover includes a first engaging member configured to engage a clamp and a second engaging member configured to engage the clamp. In addition, the wire clamp remover also comprises a first interface member coupled to the first engaging member and a second interface member coupled to the second engaging member.
    Type: Grant
    Filed: November 12, 2003
    Date of Patent: August 15, 2006
    Assignee: BellSouth Intellectual Property Corporation
    Inventor: John LoGuidice
  • Patent number: 7073256
    Abstract: In a method of manufacturing a center electrode for a spark plug, a core member is press-fitted into a metal cup and, thereafter, a cold-forging process is performed to form a small-diameter portion at a closed end of the metal cup. The small-diameter portion is completely free from deformation which may occur during press-fitting operation. Thus, the small-diameter portion has excellent accuracy in shape. Furthermore, since the press-fitting is performed before the cold-forging of the small-diameter portion, it is possible to increase the press-fitting load or pressure to the extent that the core member and the metal cup are joined together with a sufficient degree of adhesion which will insure the a center electrode to have good thermal conductivity.
    Type: Grant
    Filed: October 21, 2003
    Date of Patent: July 11, 2006
    Assignee: Denso Corporation
    Inventors: Hirofumi Muranaka, Kazuhiko Tanaka, Akihiro Endou