Abstract: A coupling structure includes an outer member attached over first and second column members, a first inner member between the first column member and the outer member, a second inner member between the second column member and the outer member, a first fixing member to fix the outer member to the first column member along with the first inner member, a second fixing member to fix the outer member to the second column member along with the second inner member, a third fixing member to fix the first inner member to the first column member, and a fourth fixing member to fix the second inner member to the second column member. The outer member and the first inner member are provided with a first positioner, and the outer member and the second inner member are provided with a second positioner.

Abstract: An item storage system includes a shelving portion and a replenishment portion. The shelving portion includes: a first shelf having a toroidal shape with a center axis; and a second shelf having a toroidal shape that is spaced apart from the first shelf along the center axis. The replenishment portion includes: an elevator portion configured to deliver items to the first shelf and the second shelf, wherein at least part of the elevator portion is positioned in the center of the shelving portion and is surrounded by the shelving portion; and a storing portion configured to load items into the elevator portion, wherein the storing portion is positioned above or below the shelving portion.

Abstract: A device of mass transferring chips includes a first substrate, which includes a first surface with a chip-connecting area configured to attach a chip, a second surface opposite to the first surface, and a patterned recess. The patterned recess is disposed on the first surface or the second surface. A projection of at least a portion of the patterned recess on the first surface is spaced apart from the chip-connecting area. The device further includes a second substrate with a third surface. The third surface has a chip-receiving area configured to attach the chip from the first substrate.