Abstract: The process for metallically connecting the faces of rods. Axially normal dressing at least two rod free ends, then placing the cross sectional surfaces of the rod free ends one against another under pressure. Oscillating the two rod free ends in the opposite direction to one another, whereby frictional heat is generated on the contact surfaces of the rod free ends. Further, when the conditions for a metallic connection are met, the rod free ends are axially aligned and the pressurization of the cross sectional areas is increased. Resulting in the rod free ends being connected to one another over the entire surface. The instant abstract is neither intended to define the invention disclosed in this specification nor intended to limit the scope of the invention in any way.
Abstract: Two metal blocks (50, 52) are welded to respective metal sheets (30, 32) to form sealed assemblies. The sealed assemblies are then diffusion bonded together to form two metal preforms (54, 56). The thick ends (36) and (40) of the metal sheets (30, 32) and the metal blocks (50, 52) are hot formed so that a continuation of the plane X of the first surfaces (42, 46) of the metal sheets (30, 32) extends through and across the metal blocks (50, 52). The metal preforms (54, 56) are machined to remove the portion of the metal blocks (50, 52) extending above the first surfaces (42, 46) of the metal sheets (30, 32) respectively. The metal preforms (54, 56) and a metal sheet (58) are assembled into a stack (64). The metal preforms (54, 56) and the metal sheet (58) are diffusion bonded together and then superplastically formed to produce a hollow fan blade (10). The method enables thinner metal workpieces with better microstructure to be used and increases the yield of metal workpieces.
Abstract: A method of joining coiled sucker rod in the field. In its most basic form, the method includes a first step of placing abutting ends of sucker rod in face to face relation. A second step involves positioning a gas burner in proximity to the abutting ends of sucker rod and heating the abutting ends with a hydrocarbon gas flame while applying axial pressure to force the abutting ends together. A third step involves continuing heating and applying pressure until a weld is formed with a bulge formed above the weld which is at least one third of the diameter of the welded rod. A fourth step involves keeping the pressure constant until the weld cools.
Abstract: An adjustable frame fixture aims to hold a printed-circuit board (PCB) to pass over a tin oven to process wave soldering. The fixture includes at least two side frames and at least two fasteners. The two side frames are coupled to form a holding dock. The positions of the two neighboring side frames are adjustable to form an area of different sizes to hold the PCB of different sizes. After the positions of the side frames have been adjusted, the fasteners are used to anchor and couple the side frames.
Abstract: A surface of an article is heated and subjected to pressure by operation of a friction stir tool. The pressure of the face of the tool on the article surface, and the speed of rotation of the tool and of its progression along the surface of the article, are controlled to progressively hot-work a specified surface area. The face of the tool may be round and have a profiled, axially extending, smaller diameter pin for higher concentration of frictional heat and load and for plasticizing a surface layer of the workpiece. Such hot work may be applied for reducing surface porosity or for producing another change in the surface microstructure, or for effecting another change in surface material properties.
December 10, 2004
Date of Patent:
June 5, 2007
GM Global Technology Operations, Inc.
Yen-Lung Chen, Thomas Arthur Perry, Yang-Tse Cheng, Anita M. Weiner
Abstract: A structural assembly and a preform and method for forming the structural assembly are provided. The preform can be formed by linear friction welding structural members to a base member and friction welding each structural member to at least one of the other structural members. The resulting preform can be formed with dimensions and a configuration that approximate the dimensions and configuration of the structural assembly. Thus, the structural assembly can be formed by joining multiple members that are generally smaller than the finished assembly.
Abstract: An assembly, such as an aircraft component, is formed with a weld joint by, for example, using friction stir welding, FSW, to form a lap joint between a stiffer and the interior surface of the skin of the component. A sealant layer, such as a monomer sealant/adhesive is applied to the surfaces to be joined, and is cured in place by the elevated temperatures of the welding process to form an elastomeric fay surface sealing, such as a fluoroelastomeric coating, to protect the component from corrosion at the welds. Additional heat for curing may be applied by laser or induction heating or the like.
Abstract: An ultrasonic welding probe power supply for powering more than one ultrasonic welding probe with power is provided. The power supply is adapted to provide power only to one welding probe at a time. A ringdown period is monitored between termination of provision of power to a first probe and the initiation of provision of power to a second probe during which provision of power to the second probe is disabled. Circuitry is provided within an ultrasonic welding probe controller to monitor probe activity and to control the interval between termination of provision of power to one probe and the initiation of provision of power to a second probe so that efficient and safe switching is made among ultrasonic probes.
Abstract: A flip chip bonder including a substrate holding mechanism and a chip die bonder for bonding a semiconductor chip having a plurality of electrodes projecting from its front surface to a substrate held on the substrate holding means. The flip chip bonder includes a chuck table, a semiconductor chip take-out area and an electrode cutting area, a cutting mechanism having a cutting tool for cutting the plurality of electrodes projecting from the front surface of the semiconductor chip held on the chuck table and arranged in the electrode cutting area to make them uniform in height, a semiconductor chip take-in mechanism, and a semiconductor chip conveying mechanism.
Abstract: A printed wiring board has a circuit substrate 6 having a conductor circuit 5 and a through hole 60, and also has a joining pin 1 inserted into the through hole. The joining pin is manufactured by using a material unmelted at a heating temperature in joining the joining pin to an opposite party pad 81. The joining pin is constructed by a joining head portion 11 having a greater diameter than an opening diameter of the through hole. The joining pin forms a joining portion for joining and connection to the opposite party pad. The joining pin has a leg portion 12 having a diameter smaller than the through hole. The leg portion is inserted into the through hole and is joined to the through hole by a conductive material such as a soldering material 20, etc. In lieu of a joining pin, a joining ball approximately having a spherical shape can be joined to the through hole by the conductive material.
Abstract: There is disclosed a semiconductor bonding apparatus which mounts a semiconductor chip via an elastic member disposed between the semiconductor chip and a mounting substrate, comprising a holding section which holds the semiconductor chip facing the mounting substrate, a translatory gas bearing which is connected to the holding section and which is capable of moving the semiconductor chip in a bonding direction with respect to the mounting substrate, a voice coil motor connected to the translatory gas bearing, a load cell which detects a pressing force to be applied to the elastic member by the holding section, and a driving section which generates a driving signal in accordance with the pressing force detected by the load cell to drive the voice coil motor.
Abstract: Provided are a solder bump, a method of manufacturing the same, and a method of bonding a light emitting device using the method of manufacturing the solder bump. In particular, the solder bump is formed of a compound including a first element through a third element, in which the first and third elements together form a compound having a plurality of intermediate phases and solidus lines.
Abstract: A device (100) and method (200) for bonding a ribbon wire (104) to a workpiece (106) comprising feeding the ribbon wire through a passageway (116) of an ultrasonic bond capillary (102) and clamping the ribbon wire against an engagement surface (120) of the bond capillary via a clamping jaw (118) operably coupled to the bond capillary. The ribbon wire (104) is bonded to the workpiece (106) along a bonding surface (112) of the bond capillary (102) and penetrated, at least partially, between the bonding surface and the engagement surface (120) of the bond capillary by a cutting tool (124). The cutting tool (124) may comprise an elongate member (126) positioned between the bonding surface (112) and engagement surface (120), and may have a cutting blade (128) positioned at a distal end (130) thereof. The cutting tool (124) may further comprise a ring cutter (132), wherein the ribbon wire passes through a ring (134) having a cutting surface (138) defined about an inner diameter thereof.
June 9, 2005
Date of Patent:
May 15, 2007
Texas Instruments Incorporated
Bernhard P. Lange, Steven Alfred Kummerl
Abstract: Disclosed is a braze bar carrier system for utilization in holding and maintaining the alignment of a plurality of components in an apparatus during a brazing process. The braze bar carrier system includes a graphite insert that prevents the brazing flux from wetting the braze bar carrier system thereby preventing brazing filler material from adhering to the carrier system. The graphite insert is readily removable and replaceable. Use of the graphite insert dramatically reduces the number of scrap and damaged assemblies in a brazing operation.
Abstract: A liquid prime mover can be used to position a component on a substrate. For example, a liquid material can be provided on the substrate adjacent the component such that the component has a first position relative to the substrate. A property of the liquid material can then be changed to move the component from the first position relative to the substrate to a second position relative to the substrate. Related structures are also discussed.
Abstract: A method is provided for forming a metallic overlay having enhanced toughness. The metallic overlay may be a weld, a metallic coating, or similar application. The method includes applying a glass forming metallic alloy to a substrate while the alloy is in a molten or semi-molten state. At the interface of the metallic alloy overlay and the substrate the substrate metal becomes at least partially molten and combines with the alloy to form metallurgical bonds. When the metallic alloy cools it experiences a high relative degree of thermal contraction. The metallurgical bonds between the substrate and the alloy constrain the contraction of the alloy at the interface with the substrate. This results in the inducement of compressive stresses in the metallic alloy overlay. The induced compressive stresses inhibit the formation of cracks in the overlay and/or mitigation of the effects of any cracks in the overlay.
Abstract: Aspects of the invention provide solder compositions which include two different fluxing agents. One of the fluxing agents promotes melting of a metal of the solder at a first activation temperature and the other fluxing agent promotes melting of the metal at a second activation temperature that is higher than the first activation temperature. This dual-flux solder may be used in manufacturing microelectronic components and microelectronic component assemblies. In one specific application, the solder may be used to manufacture a flip chip or other microelectronic component which includes self-fluxing solder balls. This can obviate the need to apply another flux composition to the solder balls prior to a subsequent component attach reflow operation.
Abstract: A tool for making simultaneously a plurality of parallel friction stir welds includes at least one shank for holding in a chuck or collet of a friction stir welding machine, a plurality of friction stir welding pins, and friction stir welding shoulders including at least four working surfaces adjacent said pins, the shoulders and pins mounted in axial relationship; dimensions of said friction stir welding pins and shanks corresponding to dimensions and spacings of said friction stir welds.
Abstract: The present invention includes a mechanical joint between a die and a substrate that is reflowed by microwave energy and a method of forming such a mechanical joint by printing a solder over a substrate, placing the solder in contact with a bump over a die, reflowing the solder with microwave energy, and forming a mechanical joint from the solder and the bump.
July 21, 2003
Date of Patent:
April 3, 2007
Glenn Ratificar, Carlos Gonzalez, Lejun Wang
Abstract: A semiconductor part 1 in which a metal terminal 2 is formed on its back surface and side surface is mounted so that only the back surface portion of the metal terminal 2 is in contact with a cream solder 3. When the side surface portion of the metal terminal 2 is irradiated with laser beams, the back surface portion of the metal terminal 2 is heated by thermal conduction from the side surface portion to the back surface portion of the metal terminal 2 and the cream solder 3 in contact with the back surface portion of the metal terminal 2 is melted, whereby soldering is performed.