Patents Examined by Lynne R. Edmondson
  • Patent number: 7192656
    Abstract: A zinc galvanizing method for a single surface of a metal tube includes a first step of preparing metal tubes, a second step of galvanizing the metal tubes, a third step of acid washing, a fourth step of washing the metal tubes with water, and a final fifth step of drying the metal tubes. Then only an inner surface or an outer surface of meal tube is galvanized for resisting corrosion. The metal tubes according to the invention can save the subsequent expenditure required for maintenance and treating rust, and possible to prolong their service life, and the method can be applied to steel tubes of any shape or size.
    Type: Grant
    Filed: June 24, 2005
    Date of Patent: March 20, 2007
    Inventor: Ching-Ping Tai
  • Patent number: 7188759
    Abstract: A method of forming a conductive bump is provided. The method includes depositing a conductive bump on a bonding location using a bonding tool such that a junction exists between (1) a length of wire extending at least partially within the bonding tool and (2) the deposited conductive bump. The method also includes moving the bonding tool to contact the conductive bump such that a location of the junction is moved with respect to the bonding location.
    Type: Grant
    Filed: September 8, 2005
    Date of Patent: March 13, 2007
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventors: Dodgie Reigh Manzano Calpito, Stephen Babinetz
  • Patent number: 7188502
    Abstract: The invention relates to a method for changing sets of top rolls, lateral rolls, and a bottom roll, and mounted in chocks of a welding stand of a continuously operating longitudinal tube welding machine. The inventive method enables the rolls to be changed faster, using less appliances. Said method comprises the following steps: the top rolls are lifted; a dismantling/transport means is placed beneath the top rolls; the top rolls are lowered onto the dismantling/transport means and deposited on the same; and, once the top rolls have been removed, the dismantling/transport means is laterally withdrawn.
    Type: Grant
    Filed: December 3, 2002
    Date of Patent: March 13, 2007
    Assignee: SMS Meer GmbH
    Inventor: Bernhard Heimann
  • Patent number: 7186191
    Abstract: A method of making a golf club head is disclosed. A striking plate is attached to a front open end of a metal casing to cover an opening. The striking plate is placed over the front open end by contacting a rear surface of the striking plate with the front open end, thereby creating a clearance between the rear surface and the front open end. A brazing material is positioned on one of the rear surface and the front open end externally of and immediately adjacent the clearance. When the brazing material melts, it flows into the clearance through a capillary action, thereby forming a layer of brazing material between the rear surface and the front open end.
    Type: Grant
    Filed: May 20, 2004
    Date of Patent: March 6, 2007
    Assignee: Nelson Precision Casting, Ltd.
    Inventors: Chan-Tung Chen, Chun-Yung Huang
  • Patent number: 7182241
    Abstract: Aspects of the invention provide solder compositions which include two different fluxing agents. One of the fluxing agents promotes melting of a metal of the solder at a first activation temperature and the other fluxing agent promotes melting of the metal at a second activation temperature that is higher than the first activation temperature. This dual-flux solder may be used in manufacturing microelectronic components and microelectronic component assemblies. In one specific application, the solder may be used to manufacture a flip chip or other microelectronic component which includes self-fluxing solder balls. This can obviate the need to apply another flux composition to the solder balls prior to a subsequent component attach reflow operation.
    Type: Grant
    Filed: August 9, 2002
    Date of Patent: February 27, 2007
    Assignee: Micron Technology, Inc.
    Inventors: Tsuyoshi Yamashita, Tongbi Jiang
  • Patent number: 7178710
    Abstract: A method of braze bonding a stainless steel part to a titanium part by heating a component assembly comprised of the titanium part, the stainless steel part, and a very thin substantially pure nickel foil filler material placed between the two parts and heated at a temperature that is greater than the temperature of the eutectic formed between the titanium part and the substantially pure nickel filler material, but that is less than the melting point of either the filler material, the stainless steel part, or the titanium part. The component assembly is held in intimate contact at temperature in a non-reactive atmosphere for a sufficient time to develop a hermetic and strong bond between the stainless steel part and the titanium part. The bonded component assembly is optionally treated with acid to remove any residual free nickel and nickel salts, to assure a biocompatible component assembly for implantation in living tissue.
    Type: Grant
    Filed: February 16, 2006
    Date of Patent: February 20, 2007
    Assignee: Alfred E. Mann Foundation for Scientific Research
    Inventors: Guangqiang Jiang, Atilla Antalfy
  • Patent number: 7172105
    Abstract: A counterweight assembly is especially adapted for mounting to a spinner tool allowing a workpiece to be balanced when rotated during welding or other operations. The counterweight assembly has an adjustable counterweight to provide a necessary amount of counterbalance force depending upon the particular size and configuration of the workpiece. The spinner tool is adapted to secure various diameters of pipe as well as pipe flanges. The spinner tool can be mounted within a portable vise that can be used directly at a work site.
    Type: Grant
    Filed: April 1, 2004
    Date of Patent: February 6, 2007
    Assignee: Amaesing Tools Mfg. Inc.
    Inventor: Roger V. Maes
  • Patent number: 7168606
    Abstract: Aspects of the present invention provide methods and apparatus for connecting two tubulars using a welding process with reduced inner diameter flash. The method includes connecting an end of a first expandable tubular to an end of a second expandable tubular using a welding process and reducing an inner diameter flash using a flash reducing device. In one embodiment, the flash reducing device is a plug disposed in the bore of the two tubulars. In another embodiment, the flash reducing device is a roller member. In a further embodiment, the flash reducing device is a rotating cutting member.
    Type: Grant
    Filed: February 6, 2003
    Date of Patent: January 30, 2007
    Assignee: Weatherford/Lamb, Inc.
    Inventor: Robert P. Badrak
  • Patent number: 7165710
    Abstract: A spin weld pin according the principles of the present invention can be rotated at a high speed relative to two or more framing members by a torque transmitting device. An axial force is applied to the pin as it rotates so that the pin contacts the framing members and generates frictional heat. The heat generated causes the framing members to enter a molten state and allows the pin to penetrate therethrough. Rotation of the pin is ceased and as the pin and framing members cool, a bond is formed that joins the framing members and pin together.
    Type: Grant
    Filed: June 21, 2002
    Date of Patent: January 23, 2007
    Assignee: Black & Decker Inc.
    Inventor: Michael L O'Banion
  • Patent number: 7163136
    Abstract: A tool for forming a friction stir weld joint in a workpiece is provided. According to one embodiment, the tool includes a rotatable pin having first and second ends and defining a stirring portion therebetween structured to frictionally engage the workpiece so as to at least partially form the friction stir weld joint. In particular, the stirring portion of the pin defines at least one groove and ridge, each of which extend generally circumferentially around an axis of the pin. The tool can also include a second shoulder opposing the first shoulder such that the pin extends therebetween.
    Type: Grant
    Filed: August 29, 2003
    Date of Patent: January 16, 2007
    Assignee: The Boeing Company
    Inventor: George D. Hempstead
  • Patent number: 7163138
    Abstract: An axially elongated cylindrical tool has a protrusion at a lower end thereof which is inserted into a metallic work piece substrate under pressure during rotation of the tool and displacement thereof in one direction. Mixing of a matrix of metal and particles by the protrusion occurs within a stir zone underlying the substrate surface which is thereby treated by dispersion of the particles therein in response to rotation of the tool. Influx of the hard particles into the work piece substrate is effected during said mixing by the rotating tool.
    Type: Grant
    Filed: May 9, 2005
    Date of Patent: January 16, 2007
    Assignee: The United States of America as represented by the Secretary of the Navy
    Inventors: Philip John Dudt, David R. Forrest, Jennifer P. Nguyen
  • Patent number: 7159757
    Abstract: After a metal member of an alloy containing copper and nickel is arranged on at least one side of a ceramic substrate, the metal member and the ceramic substrate are heated in an atmosphere of an inert gas or in vacuo at a temperature between solidus and liquidus lines of the alloy to bond the metal member directly to the ceramic substrate.
    Type: Grant
    Filed: September 23, 2003
    Date of Patent: January 9, 2007
    Assignee: Dowa Mining Co., Ltd.
    Inventors: Takayuki Takahashi, Nobuyoshi Tsukaguchi
  • Patent number: 7159754
    Abstract: The invention relates to a method for soldering an object comprising several soldered joints. The method comprises the steps of mechanically soldering of at least some of the soldered joints, visually assessing the soldered joints, and correctively soldering the visually assessed soldered joints that do not meet the relevant quality requirements. The visual assessment takes place by means of a video camera and a computing device connected to the video camera. The assessment criteria for the soldered joints are stored in the computing device. The invention also relates to an apparatus for carrying out the method.
    Type: Grant
    Filed: January 26, 2004
    Date of Patent: January 9, 2007
    Assignee: Vitronics Soltec B.V.
    Inventors: Johannes Coleta Maria Van Den Broek, Lambertus Petrus Christinus Willemen, Gerardus Johannes Adrianus Maria Diepstraten
  • Patent number: 7159753
    Abstract: A computing environment is provided with the ability to at least contribute to generate a representation for a weld bead to be used to weld a number of components of an article of manufacture together at one or more edges of the components in the manufacturing of the article outside the computing environment, including the ability to generate an initial set of one or more data representations of an initial set of one or more wire bodies based on one or more data representations of the one or more edges respectively to synthesize one or more corresponding wire bodies for the one or more edges, and the ability to generate a final data representation of a final wire body based on the initial set of one or more data representations of the initial set of one or more wire bodies of the one or more edges.
    Type: Grant
    Filed: August 19, 2003
    Date of Patent: January 9, 2007
    Assignee: Autodesk, Inc.
    Inventor: Somashekar Ramachandran Subrahmanyam
  • Patent number: 7159756
    Abstract: The invention relates to using the heat generated during thermal treatment of one or more glass sheets to melt solder. In one nonlimiting embodiment, a lead providing external access to an electrical conductive arrangement, e.g. a conductive member between and connected to spaced bus bars between laminated sheets has an end portion of a connector, e.g. a lead soldered to each of the bus bars during thermal processing of the sheets, e.g. during the lamination of the sheets during a windshield manufacturing process. In another nonlimiting embodiment, the connector is soldered to the electrically conductive arrangement during the annealing of glass blanks following the heating and shaping of the glass blanks. Soldering the leads during the annealing or laminating process eliminated possible thermal damage to the sheet by having the sheet heated during the soldering operation instead of only a small surface portion of the sheet at and eliminates the cost of a separated soldering operation.
    Type: Grant
    Filed: August 29, 2003
    Date of Patent: January 9, 2007
    Assignee: PPG Industries Ohio, Inc.
    Inventors: John A. Winter, Cheryl E. Belli, James P. Thiel, Charles S. Voeltzel
  • Patent number: 7156275
    Abstract: Welding head 1 for friction stir welding, adapted for connection and driving of a tool 2 intended for simultaneous friction stir welding from two opposite surfaces on an object for welding, comprising a tool holder 9, a force-generating device 3, 13 and a rotary driving device 5 which, during operation, can impart to the connected tool 2 a cyclic movement around the centre axis 10 of the tool and relative to the object for welding arranged in conjunction with the welding head. The force-generating device is controllable during operation and adapted so as, during operation, to act between a primary shoulder 6 and a secondary shoulder 7 on a tool 2 connected in the tool holder 9. The invention also comprises a welding system for friction stir welding, with the force between the shoulders of the tool being controlled depending on the current torque for rotary driving. Also indicated are a method for initiating friction stir welding and computer program for such a method.
    Type: Grant
    Filed: February 3, 2003
    Date of Patent: January 2, 2007
    Assignee: ESAB AB
    Inventor: Rolf Larsson
  • Patent number: 7156277
    Abstract: A friction stir welding (FSW) method and apparatus are provided by which power needed for FSW is reduced and a compact FSW tool can be used. In the FSW method, metal members are lapped one on another and a rotating probe of an FSW tool is inserted into a contact portion of the metal members. The contact portion is softened by frictional heat and stirred by the probe so that the metal members are welded together. A portion of the metal members surrounding the probe is heated by a heater.
    Type: Grant
    Filed: August 23, 2005
    Date of Patent: January 2, 2007
    Assignee: Mitsubishi Heavy Industries, Ltd.
    Inventors: Soichiro Ishikawa, Haretaro Hidaka
  • Patent number: 7156278
    Abstract: An auxiliary soldering tool includes a first jaw plate having a first holding portion and a first holding portion, a second jaw plate having a second holding portion and a second holding portion, and two elastic press plates each respectively rested on the first holding portion of the first jaw plate and the second holding portion of the second jaw plate. Thus, the auxiliary soldering tool facilitates the soldering work of two wires, so that the worker can solder and connect the two wires easily and conveniently.
    Type: Grant
    Filed: September 24, 2003
    Date of Patent: January 2, 2007
    Inventor: Pi-Liang Wu
  • Patent number: 7156280
    Abstract: A nickel-based high-temperature braze alloy composition includes Cr, Hf, and B. Furthermore, a cobalt-based high-temperature braze alloy composition includes Cr, Hf, and B. The braze alloys can be used, for example, as a single homogenous braze. The braze alloys can also be used, for example, as a component in a wide gap braze mixture where higher or lower melting point superalloy and/or brazing powder is used. The braze alloys may permit joining/repairing of superalloy articles with complex shape and may be used in high temperature applications.
    Type: Grant
    Filed: December 15, 2005
    Date of Patent: January 2, 2007
    Assignee: General Electric Company
    Inventors: Liang Jiang, Laurent Cretegny, Warren M. Miglietti
  • Patent number: 7150390
    Abstract: A method for underfilling and encapsulating a flip chip in one step is disclosed. The flip chip is immersed in a polymer bath to apply a coating of the polymer to the surface of the flip chip except for the distal end of the conductive projections on the flip chip electrically conductive pads. The coated flip chip is exposed to ultraviolet light or heat (e.g., IR radiation) to surface cure a skin over the polymer coating. The skin-cured flip chip is placed on a substrate which is then heated to reflow the conductive material from the projections and to cause the polymer from the coating to underfill the flip chip and thermally cure to encapsulate and underfill the flip chip.
    Type: Grant
    Filed: November 18, 2002
    Date of Patent: December 19, 2006
    Assignee: Micron Technology, Inc.
    Inventors: Farrah J. Johnson, Tongbi Jiang