Abstract: Thin films of the Group IV materials silicon and germanium are produced in the range of 2.5 to 25 nm thick from nanocrystal precursors. According to the invention a solid, continuous film of silicon or germanium is formed by depositing a contiguous layer of nanocrystals of the semi-conductor materials onto a substrate, then heating the layer to a temperature below the bulk melting temperature which is nonetheless adequate to melt the nanocrystals and form a continuous liquid thin film upon cooling. The resulting thin film may be doped or intrinsic. The lower processing temperatures make it possible to form these thin semi-conductor films with less stringent thermal requirements on the underlayers, substrates and other related structures, thus supporting applications in microelectronics, solar conversion and so forth.

Abstract: A method for forming an oxide film in a semiconductor device comprises a pre-oxidation process, a main oxidation process and a post-oxidation process. N.sub.2 O gas is used for the pre-oxidation process, a mixed gas of N.sub.2 O gas and NH.sub.3 gas is used for the main oxidation process, and N.sub.2 O gas is used for the post-oxidation process. The insulation characteristics of the oxide film are increased by introducing nitrogen, and amount of introduced nitrogen can be regulated by the controlling of amount of NH.sub.3 gas. Also, the problems encountered when NH.sub.3 gas and N.sub.2 O gas are used separately for the oxidation process can be solved by using of the mixed gas of NH.sub.3 gas and N.sub.2 O gas.

Abstract: A chemical-mechanical-polishing process in which energy is imparted to a polishing pad (18) dislodging particles (46), which are removed by vacuum withdrawal to continuously clean the surface of the polishing pad (14). Energy is imparted to polishing pad (18) by either sonic energy from acoustic waves, or by physical impaction. The acoustic waves are generated by submerging a transducer (28) in the polishing slurry (18). The transducer (28) is powered by a voltage amplifier (30) coupled to a computer controlled-frequency generator (32). The acoustic wave frequency is adjusted by the frequency generator (32) to induce sonic vibration in the polishing pad (14) such that particles (46) are continuously dislodged from polishing pad (14). Physical impaction is performed by an impaction tool (48) coupled to a vacuum head (33).

Abstract: A method for forming a field oxide layer in a semiconductor device comprising the steps of: forming a pad oxide layer and a first resistant layer of oxidation, in turn, on a substrate; opening a field region by etching a portion of the said resistant layer of oxidation, whereby a part of the said pad oxide layer remains; forming the pad oxide layer into a nitric oxide layer; forming a second and a third resistant layer of oxidation, in turn, on a resultant structure; forming a spacer layer by applying anisotropic etching to the third resistant layer of oxidation; exposing a portion of the substrate by etching the second resistant layer of oxidation and the pad layer which is formed into the nitride layer; and forming the field oxide layer by oxidizing the substrate.

Abstract: This invention provides a process for making a semiconductor device with reduced capacitance between adjacent conductors. This process can include applying and gelling one or more solutions between and over conductors 24 and drying the wet gel to create at least porous dielectric sublayers 28 and 29. By varying the composition of the solutions, gelling conditions, drying temperature, composition of the solvents in the wet gel, or a combination of these approaches, the porosity of the sublayers may be tailored individually. A non-porous dielectric layer 30 may be formed over porous layer 28, which may complete an interlayer dielectric. A novel process for creating the porous dielectric layer is disclosed, which can be completed at vacuum or ambient pressures, yet results in porosity, pore size, and shrinkage of the dielectric during drying comparable to that previously attainable only by drying gels at supercritical pressure.

Abstract: A method and structure for forming a capacitive transducer having a deformable single crystal diaphragm. A first well region is formed within a semiconductor substrate in an SOI wafer having a sacrificial layer of known thickness and a top single-crystal silicon layer thereon. Next, a silicon, epitaxial layer is deposited on the top silicon layer for forming a flexible single crystal membrane. The epitaxial layer and the sacrificial layer are masked and etched to define the flexible diaphragm. An electrical insulating conformal support layer is deposited on the substrate and attached to the diaphragm so as to seal the sacrificial layer therebetween. An access opening is etched through the diaphragm, and then a wet etchant is inserted through the access opening for removing the sacrificial layer, thereby defining a diaphragm cavity between the remaining epitaxial layer and the substrate.