Patents Examined by Megan McCulley
  • Patent number: 10932398
    Abstract: Compositions (120), which may be in the form of flexible films, molded bodies, or printable inks, can incorporate ceramic particles (122) comprising titanium monoxide (TiO) for purposes of electromagnetic interference (EMI) shielding at megahertz through gigahertz frequencies. One or more additional ceramic particles can also be included. The compositions comprise a composite material (120) which includes the ceramic particles (122) dispersed within a matrix material (121), such as a polymer. Methods associated with such compositions are also described.
    Type: Grant
    Filed: December 11, 2014
    Date of Patent: February 23, 2021
    Assignee: 3M Innovative Properties Company
    Inventor: Dipankar Ghosh
  • Patent number: 10920008
    Abstract: A thermal-curable resin composition is provided. The thermal-curable resin composition comprises: (A) a thermal-curable resin component, which comprises: (a1) bismaleimide resin; (a2) cyanate ester resin; and (a3) epoxy resin, wherein the cyanate ester resin (a2) and the epoxy resin (a3) are respectively in an amount ranging from 50 parts by weight to 150 parts by weight and from 24 parts by weight to 51 parts by weight per 100 parts by weight of the bismaleimide resin (a1); and (B) a filler, wherein the filler (B) is in an amount ranging from 40 parts by weight to 55 parts by weight per 100 parts by weight of the dry weight of the resin composition; and wherein the resin composition has a dynamic viscosity of not higher than 800 Pa·s after being brought into a semi-cured state (B-stage), and the resin composition has a dissipation factor (Df) of not higher than 0.006 at 10 GHz after being cured completely.
    Type: Grant
    Filed: January 17, 2019
    Date of Patent: February 16, 2021
    Assignee: TAIWAN UNION TECHNOLOGY CORPORATION
    Inventors: Ju-Ming Huang, Chen-Hua Yu, Chang-Chien Yang, Guan-Syun Tseng, Chih-Wei Liao
  • Patent number: 10907008
    Abstract: The invention provides highly functional epoxy resins that may be used themselves in coating formulations and applications but which may be further functionalized via ring-opening reactions of the epoxy groups yielding derivative resins with other useful functionalities. The highly functional epoxy resins are synthesized from the epoxidation of vegetable or seed oil esters of polyols having 4 or more hydroxyl groups/molecule. In one embodiment, the polyol is sucrose and the vegetable or seed oil is selected from corn oil, castor oil, soybean oil, safflower oil, sunflower oil, linseed oil, tall oil fatty acid, tung oil, vernonia oil, and mixtures thereof. Methods of making of the epoxy resin and each of its derivative resins are disclosed as are coating compositions and coated objects using each of the resins.
    Type: Grant
    Filed: April 26, 2019
    Date of Patent: February 2, 2021
    Assignee: NDSU RESEARCH FOUNDATION
    Inventors: Dean C. Webster, Partha Pratim Sengupta, Zhigang Chen, Xiao Pan, Adlina Paramarta
  • Patent number: 10899888
    Abstract: A thermoplastic aromatic polysulfone is obtained by polymerizing a dihalogeno compound (A) and a dihydric phenol (B). The ratio (Mw/Mn) between a number average molecular weight (Mn) and a weight average molecular weight (Mw) is at least 1.91, and the number average molecular weight (Mn) is at least 6,000 and less than 14,000, In (A) and (B), each of X and X? independently represents a halogen atom; each of R1, R2, R3 and R4 independently represents an alkyl group having 1 to 4 carbon atoms or an alkoxy group having 1 to 4 carbon atoms; each of n1, n2, n3 and n4 independently represents an integer of 0 to 4; and when n1, n2, n3 or n4 is an integer of 2 to 4, a plurality of R1, R2, R3 or R4 groups may be the same or different from each other.
    Type: Grant
    Filed: February 2, 2017
    Date of Patent: January 26, 2021
    Assignee: SUMITOMO CHEMICAL COMPANY, LIMITED
    Inventors: Shinji Ohtomo, Masanobu Matsubara
  • Patent number: 10889695
    Abstract: Provided are a tow prepreg comprising a reinforcing fiber bundle impregnated with a matrix resin composition, wherein the matrix resin composition contains a component (A) (an epoxy resin), a component (B) (dicyandiamide), a component (C) (a curing accelerator), and a component (D) (a core-shell type rubber particle), and a content of the component (D) with respect to 100 parts by mass of the component (A) is from 20 to 70 parts by mass, a viscosity is from 3 Pa·s to 80 Pa·s at 30° C., and a minimum viscosity to be obtained when a viscosity is measured by raising a temperature from room temperature to 130° C. at a rate of temperature rise of 2.0° C./min is from 0.04 Pa·s to 1 Pa·s, which exhibits excellent drape property and tackiness and less stickiness and can be unwound at a high speed; and a composite material-reinforced pressure vessel having fewer voids in a reinforcing layer which is obtainable by using the tow prepreg, a high burst pressure, and an excellent appearance due to appropriate resin flow.
    Type: Grant
    Filed: May 23, 2018
    Date of Patent: January 12, 2021
    Assignee: Mitsubishi Chemical Corporation
    Inventors: Satoshi Okamoto, Yukihiro Harada
  • Patent number: 10889683
    Abstract: The present invention relates to the polyamines N,N?-diaminopropyl-2-methyl-cyclohexane-1,3-diamine and N,N?-diaminopropyl-4-methyl-cyclohexane-1,3-diamine and mixtures thereof, to the use thereof as curing agents for epoxy resin and to a curable composition comprising epoxy resin and these polyamines. Even at low temperatures this curing agent/the corresponding curable composition cures rapidly and is early-stage water resistant and is thus especially suitable for floor coatings. The invention further relates to the curing of this composition and the cured epoxy resin obtained by curing of this composition.
    Type: Grant
    Filed: December 4, 2017
    Date of Patent: January 12, 2021
    Assignee: BASF SE
    Inventors: Christian Gruenanger, Alexander Panchenko, Irene Gorman, Veit Stegmann, Johann-Peter Melder, Norbert Gutfrucht, Martin Ernst, Marc Hofmann
  • Patent number: 10882947
    Abstract: The present disclosure is directed to a curable composition comprising: a) an epoxy resin; b) an epoxy curing agent comprising at least one cycloaliphatic amine; c) at least 3 wt % of a metal triflate catalyst; d) optionally, a fatty acid polyamide; and e) optionally, a filler material. The compositions of the present disclosure are particularly suitable for use in structural assembly, in particular for potting and filling operations in sandwich structures. The present disclosure also relates to a composite assembly and to methods of using such epoxy resin based curable compositions.
    Type: Grant
    Filed: June 17, 2015
    Date of Patent: January 5, 2021
    Assignee: 3M Innovative Properties Company
    Inventor: Sohaib Elgimiabi
  • Patent number: 10875283
    Abstract: A laminate having an adhesive layer, which exhibits excellent adhesion to base films made from polyimide resins and the like or copper foils, as well as superior electrical properties, and also providing a laminate having an adhesive layer, which is low in warpage when the adhesive layer is in B stage, and which is excellent in storage stability of the laminate. The laminate having an adhesive layer includes a base film and an adhesive layer formed on at least one of the surfaces of the base film, in which the adhesive layer is formed of an adhesive composition comprising a carboxyl group-containing styrene based elastomer and an epoxy resin, wherein the content of the carboxyl group-containing styrene based elastomer is 50 parts by mass or more relative to 100 parts by mass of the solid content of the adhesive composition; the content of the epoxy resin is from 1 to 20 parts by mass relative to 100 parts by mass of the carboxyl group-containing styrene based elastomer; and the adhesive layer is in B-stage.
    Type: Grant
    Filed: July 21, 2015
    Date of Patent: December 29, 2020
    Assignee: TOAGOSEI CO., LTD.
    Inventors: Yuya Okimura, Masashi Yamada
  • Patent number: 10870724
    Abstract: High purity epoxide compounds methods for preparing the high purity epoxide compounds, and compositions derived from the epoxide compounds are provided. Also provided are materials and articles derived from the epoxide compounds.
    Type: Grant
    Filed: September 16, 2019
    Date of Patent: December 22, 2020
    Assignee: SABIC GLOBAL TECHNOLOGIES B.V.
    Inventors: Edward Norman Peters, Scott Michael Fisher, Jaykisor Pal
  • Patent number: 10865305
    Abstract: Disclosed is a curable composition with enhanced curing time at ambient temperatures, the curable composition including (a) a resin, e.g., 4,4?-isopropylidenediphenol-epichlorohydrin copolymer and (b) one or more curing agents, wherein a ratio of a weight percentage of the resin to a weight percentage of the curing agent or curing agents is from about 12:1 to about 15:1. Also disclosed is a method of curing a cured-in-place liner, wherein the cured-in-place liner contains the above curable composition.
    Type: Grant
    Filed: May 28, 2020
    Date of Patent: December 15, 2020
    Assignee: PipeFusion CIPP Corporation
    Inventors: Richard E. Nawracaj, Gabriel Urbieta, Radames Dejesus
  • Patent number: 10858475
    Abstract: Disclosed is a photosensitive resin composition for an optical waveguide containing a resin component and a photoacid generator. In the photosensitive resin composition, the resin component is constituted of an epoxy resin component containing both an aromatic epoxy resin and an aliphatic epoxy resin, and the content of the aromatic epoxy resin is 55 wt. % or more and less than 80 wt. % of the entirety of the epoxy resin component and the content of the aliphatic epoxy resin is more than 20 wt. % and 45 wt. % or less of the entirety of the epoxy resin component. Accordingly, for example, when a core layer of an optical waveguide is formed using the disclosed photosensitive resin composition for an optical waveguide, a core layer of an optical waveguide having satisfactorily low tackiness and high transparency while maintaining satisfactory roll-to-roll compatibility and a high resolution patterning property can be formed.
    Type: Grant
    Filed: October 23, 2015
    Date of Patent: December 8, 2020
    Assignee: NITTO DENKO CORPORATION
    Inventor: Tomoyuki Hirayama
  • Patent number: 10851201
    Abstract: The invention relates to a curing agent for thermosetting epoxy resins comprising (a) at least one aromatic amine containing at least two amino groups, and (b) at least one clathrate compound obtained by reacting a tetrakisphenol of the formula (1), or a 9,9-Bis(4-hydroxyphenyl)fluorene of formula (2), as the host molecule, and an imidazole or an imidazolium derivative as the guest molecule, wherein the substituents are as defined in the description, and n is the number 0, 1, 2 or 3, which can advantageously be used for the curing of epoxy resins. In addition, the invention also relates to a process for the preparation of a cured article, a process for the preparation of insulation systems for electrical engineering and a cured article obtained by the processes.
    Type: Grant
    Filed: May 11, 2016
    Date of Patent: December 1, 2020
    Assignee: HUNTSMAN INTERNATIONAL LLC
    Inventors: Christian Beisele, Sophie Colliard, Catherine Schoenenberger
  • Patent number: 10851611
    Abstract: A hybrid article comprises a disintegrable metal comprising one or more of the following: Mg; Al; Zn; Mn; an alloy thereof; or a composite thereof; and a disintegrable polymer comprising one or more of the following: an epoxy polymer derived from an epoxy base and a curing agent having cleavable bonds; a cured cyanate ester; or a poly(hexahydrotriazine).
    Type: Grant
    Filed: March 23, 2017
    Date of Patent: December 1, 2020
    Assignee: BAKER HUGHES, A GE COMPANY, LLC
    Inventors: Suman Khatiwada, John C. Welch, Anil K. Sadana, Sayantan Roy
  • Patent number: 10851269
    Abstract: A pressure-sensitive adhesive composition, which may have excellent durability under high temperature or humidity conditions and exhibit high close adhesion to optical films, thereby forming a pressure-sensitive adhesive having superior cuttability and re-workability, is provided. Also, a pressure-sensitive adhesive composition capable of forming a pressure-sensitive adhesive capable of effectively inhibiting bending when applied to a thin substrate such as a very thin glass substrate, minimizing a time required to stabilize physical properties, and preventing a degradation of the secured physical properties in time, a pressure-sensitive adhesive optical member formed using such a pressure-sensitive adhesive composition, an optical laminate, and a display device are provided.
    Type: Grant
    Filed: December 16, 2015
    Date of Patent: December 1, 2020
    Inventors: Kee Young Kim, Il Jin Kim, Jeong Ae Yoon, Sung Soo Yoon, Su Jeong Kim, Sang Hyun Hong
  • Patent number: 10843423
    Abstract: Provided is a molded article that has such a shape as to offer a light condensing or light diffusing effect, has excellent mechanical strengths and heat resistance, and has a high thickness deviation ratio. This molded article includes a cured product of a curable composition containing an epoxy compound (A). The cured product has a flexural modulus of 2.5 GPa or more as measured in conformity with JIS K 7171:2008, except for performing measurement on a test specimen having a length of 20 mm, a width of 2.5 mm, and a thickness of 0.5 mm and at a span between specimen supports of 16 mm. The molded article has a thickness deviation ratio (thickest portion thickness to thinnest portion thickness ratio) of 5 or more and offers a light condensing or light diffusing effect. The molded article preferably has a thinnest portion thickness of 0.2 mm or less. The curable composition is preferably a photocurable composition.
    Type: Grant
    Filed: August 4, 2015
    Date of Patent: November 24, 2020
    Assignee: DAICEL CORPORATION
    Inventors: Takeshi Fujikawa, Sadayuki Fukui
  • Patent number: 10829587
    Abstract: An epoxy resin composition produces a cured product having improved elastic modulus and improved nominal strain at compressive fracture. The epoxy resin composition is a fiber-reinforced composite material having excellent compression strength and interlayer toughness. The epoxy resin composition contains at least the following constituent components [A], [B] and [C]. [A] A specific ortho type epoxy resin. [B] At least one component selected from the group consisting of: thermoplastic resins that are compatible with the epoxy resin [A]; and core-shell type polymers. [C] An amine curing agent.
    Type: Grant
    Filed: July 21, 2016
    Date of Patent: November 10, 2020
    Assignee: Toray Industries, Inc.
    Inventors: Maki Nagano, Ayako Fuse, Nobuyuki Tomioka
  • Patent number: 10821777
    Abstract: This invention relates to a tire with a tread of a rubber composition for promoting a combination of beneficial wet traction and reduced rolling resistance, while limiting any loss of winter traction at low temperatures. The tread rubber composition contains a combination of high and lower glass transition temperature (Tg) elastomers. Its reinforcing filler is primarily precipitated silica. The high Tg elastomer is comprised of synthetic high vinyl polybutadiene rubber and the lower Tg elastomer is comprised of at least one of natural and synthetic cis 1,4-polyisoprene rubber. The tread rubber composition may contain at least one of vegetable oil based rubber processing aid and traction promoting resin. The tread rubber composition is intended to be exclusive of styrene-containing elastomers.
    Type: Grant
    Filed: December 19, 2017
    Date of Patent: November 3, 2020
    Assignee: The Goodyear Tire & Rubber Company
    Inventors: Nihat Ali Isitman, Paul Harry Sandstrom, Luisa Fernanda Munoz Mejia
  • Patent number: 10822517
    Abstract: A resin composition is provided, which includes an oligomer formed by reacting bisphenol epoxy resin monomer, aliphatic diglycidyl ether, anhydride compound, and catalyst, wherein the molar ratio of epoxy groups of the bisphenol epoxy resin monomer and aliphatic diglycidyl ether to anhydride groups of the anhydride compound is between 3.5:1 and 8.8:1. The bisphenol epoxy resin monomer and aliphatic diglycidyl ether have a molar ratio of 0.3:1 to 1.3:1, and the viscosity of the resin composition is 20 Pa·s to 80 Pa·s at 25° C.
    Type: Grant
    Filed: March 8, 2019
    Date of Patent: November 3, 2020
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Tien-Shou Shieh, Pei-Hsin Chien
  • Patent number: 10815574
    Abstract: A coated article comprises an article comprising a surface and a galvanic barrier coating disposed on the surface. The galvanic barrier coating is formed from a galvanic barrier coating composition comprising (a) a thermoplastic resin, (b) an epoxy-based resin, (c) a curing agent, and (d) non-compressible, non-marring microsphere particles. Methods of preparing and using the coated article are also disclosed.
    Type: Grant
    Filed: January 5, 2018
    Date of Patent: October 27, 2020
    Inventors: Gerald F. Snow, Christopher T. Hable, Scot Wickham
  • Patent number: 10808118
    Abstract: The present invention disclosed novel epoxy novolac composite comprising environmentally friendly toughening agents based on bio-derived chemicals namely, Difunctional glycidyl ether epoxy resin (Cardolite NC-514) and Polyglycidyl ether of an alkenyl phenol formaldehyde novolac resin (Cardolite NC-547) used for the toughening of epoxy novolac resin namely Poly[(phenyl glycidyl ether)-co-formaldehyde] [PPGEF].
    Type: Grant
    Filed: December 16, 2015
    Date of Patent: October 20, 2020
    Assignee: COUNCIL OF SCIENTIFIC & INDUSTRIAL RESEARCH
    Inventors: Manohar Virupax Badiger, Rajeshwari Shyamji Gour, Prakash Purushottam Wadgaonkar