Patents Examined by Megan McCulley
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Patent number: 10932398Abstract: Compositions (120), which may be in the form of flexible films, molded bodies, or printable inks, can incorporate ceramic particles (122) comprising titanium monoxide (TiO) for purposes of electromagnetic interference (EMI) shielding at megahertz through gigahertz frequencies. One or more additional ceramic particles can also be included. The compositions comprise a composite material (120) which includes the ceramic particles (122) dispersed within a matrix material (121), such as a polymer. Methods associated with such compositions are also described.Type: GrantFiled: December 11, 2014Date of Patent: February 23, 2021Assignee: 3M Innovative Properties CompanyInventor: Dipankar Ghosh
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Patent number: 10920008Abstract: A thermal-curable resin composition is provided. The thermal-curable resin composition comprises: (A) a thermal-curable resin component, which comprises: (a1) bismaleimide resin; (a2) cyanate ester resin; and (a3) epoxy resin, wherein the cyanate ester resin (a2) and the epoxy resin (a3) are respectively in an amount ranging from 50 parts by weight to 150 parts by weight and from 24 parts by weight to 51 parts by weight per 100 parts by weight of the bismaleimide resin (a1); and (B) a filler, wherein the filler (B) is in an amount ranging from 40 parts by weight to 55 parts by weight per 100 parts by weight of the dry weight of the resin composition; and wherein the resin composition has a dynamic viscosity of not higher than 800 Pa·s after being brought into a semi-cured state (B-stage), and the resin composition has a dissipation factor (Df) of not higher than 0.006 at 10 GHz after being cured completely.Type: GrantFiled: January 17, 2019Date of Patent: February 16, 2021Assignee: TAIWAN UNION TECHNOLOGY CORPORATIONInventors: Ju-Ming Huang, Chen-Hua Yu, Chang-Chien Yang, Guan-Syun Tseng, Chih-Wei Liao
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Patent number: 10907008Abstract: The invention provides highly functional epoxy resins that may be used themselves in coating formulations and applications but which may be further functionalized via ring-opening reactions of the epoxy groups yielding derivative resins with other useful functionalities. The highly functional epoxy resins are synthesized from the epoxidation of vegetable or seed oil esters of polyols having 4 or more hydroxyl groups/molecule. In one embodiment, the polyol is sucrose and the vegetable or seed oil is selected from corn oil, castor oil, soybean oil, safflower oil, sunflower oil, linseed oil, tall oil fatty acid, tung oil, vernonia oil, and mixtures thereof. Methods of making of the epoxy resin and each of its derivative resins are disclosed as are coating compositions and coated objects using each of the resins.Type: GrantFiled: April 26, 2019Date of Patent: February 2, 2021Assignee: NDSU RESEARCH FOUNDATIONInventors: Dean C. Webster, Partha Pratim Sengupta, Zhigang Chen, Xiao Pan, Adlina Paramarta
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Patent number: 10899888Abstract: A thermoplastic aromatic polysulfone is obtained by polymerizing a dihalogeno compound (A) and a dihydric phenol (B). The ratio (Mw/Mn) between a number average molecular weight (Mn) and a weight average molecular weight (Mw) is at least 1.91, and the number average molecular weight (Mn) is at least 6,000 and less than 14,000, In (A) and (B), each of X and X? independently represents a halogen atom; each of R1, R2, R3 and R4 independently represents an alkyl group having 1 to 4 carbon atoms or an alkoxy group having 1 to 4 carbon atoms; each of n1, n2, n3 and n4 independently represents an integer of 0 to 4; and when n1, n2, n3 or n4 is an integer of 2 to 4, a plurality of R1, R2, R3 or R4 groups may be the same or different from each other.Type: GrantFiled: February 2, 2017Date of Patent: January 26, 2021Assignee: SUMITOMO CHEMICAL COMPANY, LIMITEDInventors: Shinji Ohtomo, Masanobu Matsubara
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Patent number: 10889695Abstract: Provided are a tow prepreg comprising a reinforcing fiber bundle impregnated with a matrix resin composition, wherein the matrix resin composition contains a component (A) (an epoxy resin), a component (B) (dicyandiamide), a component (C) (a curing accelerator), and a component (D) (a core-shell type rubber particle), and a content of the component (D) with respect to 100 parts by mass of the component (A) is from 20 to 70 parts by mass, a viscosity is from 3 Pa·s to 80 Pa·s at 30° C., and a minimum viscosity to be obtained when a viscosity is measured by raising a temperature from room temperature to 130° C. at a rate of temperature rise of 2.0° C./min is from 0.04 Pa·s to 1 Pa·s, which exhibits excellent drape property and tackiness and less stickiness and can be unwound at a high speed; and a composite material-reinforced pressure vessel having fewer voids in a reinforcing layer which is obtainable by using the tow prepreg, a high burst pressure, and an excellent appearance due to appropriate resin flow.Type: GrantFiled: May 23, 2018Date of Patent: January 12, 2021Assignee: Mitsubishi Chemical CorporationInventors: Satoshi Okamoto, Yukihiro Harada
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Patent number: 10889683Abstract: The present invention relates to the polyamines N,N?-diaminopropyl-2-methyl-cyclohexane-1,3-diamine and N,N?-diaminopropyl-4-methyl-cyclohexane-1,3-diamine and mixtures thereof, to the use thereof as curing agents for epoxy resin and to a curable composition comprising epoxy resin and these polyamines. Even at low temperatures this curing agent/the corresponding curable composition cures rapidly and is early-stage water resistant and is thus especially suitable for floor coatings. The invention further relates to the curing of this composition and the cured epoxy resin obtained by curing of this composition.Type: GrantFiled: December 4, 2017Date of Patent: January 12, 2021Assignee: BASF SEInventors: Christian Gruenanger, Alexander Panchenko, Irene Gorman, Veit Stegmann, Johann-Peter Melder, Norbert Gutfrucht, Martin Ernst, Marc Hofmann
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Patent number: 10882947Abstract: The present disclosure is directed to a curable composition comprising: a) an epoxy resin; b) an epoxy curing agent comprising at least one cycloaliphatic amine; c) at least 3 wt % of a metal triflate catalyst; d) optionally, a fatty acid polyamide; and e) optionally, a filler material. The compositions of the present disclosure are particularly suitable for use in structural assembly, in particular for potting and filling operations in sandwich structures. The present disclosure also relates to a composite assembly and to methods of using such epoxy resin based curable compositions.Type: GrantFiled: June 17, 2015Date of Patent: January 5, 2021Assignee: 3M Innovative Properties CompanyInventor: Sohaib Elgimiabi
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Patent number: 10875283Abstract: A laminate having an adhesive layer, which exhibits excellent adhesion to base films made from polyimide resins and the like or copper foils, as well as superior electrical properties, and also providing a laminate having an adhesive layer, which is low in warpage when the adhesive layer is in B stage, and which is excellent in storage stability of the laminate. The laminate having an adhesive layer includes a base film and an adhesive layer formed on at least one of the surfaces of the base film, in which the adhesive layer is formed of an adhesive composition comprising a carboxyl group-containing styrene based elastomer and an epoxy resin, wherein the content of the carboxyl group-containing styrene based elastomer is 50 parts by mass or more relative to 100 parts by mass of the solid content of the adhesive composition; the content of the epoxy resin is from 1 to 20 parts by mass relative to 100 parts by mass of the carboxyl group-containing styrene based elastomer; and the adhesive layer is in B-stage.Type: GrantFiled: July 21, 2015Date of Patent: December 29, 2020Assignee: TOAGOSEI CO., LTD.Inventors: Yuya Okimura, Masashi Yamada
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Patent number: 10870724Abstract: High purity epoxide compounds methods for preparing the high purity epoxide compounds, and compositions derived from the epoxide compounds are provided. Also provided are materials and articles derived from the epoxide compounds.Type: GrantFiled: September 16, 2019Date of Patent: December 22, 2020Assignee: SABIC GLOBAL TECHNOLOGIES B.V.Inventors: Edward Norman Peters, Scott Michael Fisher, Jaykisor Pal
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Patent number: 10865305Abstract: Disclosed is a curable composition with enhanced curing time at ambient temperatures, the curable composition including (a) a resin, e.g., 4,4?-isopropylidenediphenol-epichlorohydrin copolymer and (b) one or more curing agents, wherein a ratio of a weight percentage of the resin to a weight percentage of the curing agent or curing agents is from about 12:1 to about 15:1. Also disclosed is a method of curing a cured-in-place liner, wherein the cured-in-place liner contains the above curable composition.Type: GrantFiled: May 28, 2020Date of Patent: December 15, 2020Assignee: PipeFusion CIPP CorporationInventors: Richard E. Nawracaj, Gabriel Urbieta, Radames Dejesus
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Patent number: 10858475Abstract: Disclosed is a photosensitive resin composition for an optical waveguide containing a resin component and a photoacid generator. In the photosensitive resin composition, the resin component is constituted of an epoxy resin component containing both an aromatic epoxy resin and an aliphatic epoxy resin, and the content of the aromatic epoxy resin is 55 wt. % or more and less than 80 wt. % of the entirety of the epoxy resin component and the content of the aliphatic epoxy resin is more than 20 wt. % and 45 wt. % or less of the entirety of the epoxy resin component. Accordingly, for example, when a core layer of an optical waveguide is formed using the disclosed photosensitive resin composition for an optical waveguide, a core layer of an optical waveguide having satisfactorily low tackiness and high transparency while maintaining satisfactory roll-to-roll compatibility and a high resolution patterning property can be formed.Type: GrantFiled: October 23, 2015Date of Patent: December 8, 2020Assignee: NITTO DENKO CORPORATIONInventor: Tomoyuki Hirayama
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Patent number: 10851201Abstract: The invention relates to a curing agent for thermosetting epoxy resins comprising (a) at least one aromatic amine containing at least two amino groups, and (b) at least one clathrate compound obtained by reacting a tetrakisphenol of the formula (1), or a 9,9-Bis(4-hydroxyphenyl)fluorene of formula (2), as the host molecule, and an imidazole or an imidazolium derivative as the guest molecule, wherein the substituents are as defined in the description, and n is the number 0, 1, 2 or 3, which can advantageously be used for the curing of epoxy resins. In addition, the invention also relates to a process for the preparation of a cured article, a process for the preparation of insulation systems for electrical engineering and a cured article obtained by the processes.Type: GrantFiled: May 11, 2016Date of Patent: December 1, 2020Assignee: HUNTSMAN INTERNATIONAL LLCInventors: Christian Beisele, Sophie Colliard, Catherine Schoenenberger
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Patent number: 10851611Abstract: A hybrid article comprises a disintegrable metal comprising one or more of the following: Mg; Al; Zn; Mn; an alloy thereof; or a composite thereof; and a disintegrable polymer comprising one or more of the following: an epoxy polymer derived from an epoxy base and a curing agent having cleavable bonds; a cured cyanate ester; or a poly(hexahydrotriazine).Type: GrantFiled: March 23, 2017Date of Patent: December 1, 2020Assignee: BAKER HUGHES, A GE COMPANY, LLCInventors: Suman Khatiwada, John C. Welch, Anil K. Sadana, Sayantan Roy
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Patent number: 10851269Abstract: A pressure-sensitive adhesive composition, which may have excellent durability under high temperature or humidity conditions and exhibit high close adhesion to optical films, thereby forming a pressure-sensitive adhesive having superior cuttability and re-workability, is provided. Also, a pressure-sensitive adhesive composition capable of forming a pressure-sensitive adhesive capable of effectively inhibiting bending when applied to a thin substrate such as a very thin glass substrate, minimizing a time required to stabilize physical properties, and preventing a degradation of the secured physical properties in time, a pressure-sensitive adhesive optical member formed using such a pressure-sensitive adhesive composition, an optical laminate, and a display device are provided.Type: GrantFiled: December 16, 2015Date of Patent: December 1, 2020Inventors: Kee Young Kim, Il Jin Kim, Jeong Ae Yoon, Sung Soo Yoon, Su Jeong Kim, Sang Hyun Hong
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Patent number: 10843423Abstract: Provided is a molded article that has such a shape as to offer a light condensing or light diffusing effect, has excellent mechanical strengths and heat resistance, and has a high thickness deviation ratio. This molded article includes a cured product of a curable composition containing an epoxy compound (A). The cured product has a flexural modulus of 2.5 GPa or more as measured in conformity with JIS K 7171:2008, except for performing measurement on a test specimen having a length of 20 mm, a width of 2.5 mm, and a thickness of 0.5 mm and at a span between specimen supports of 16 mm. The molded article has a thickness deviation ratio (thickest portion thickness to thinnest portion thickness ratio) of 5 or more and offers a light condensing or light diffusing effect. The molded article preferably has a thinnest portion thickness of 0.2 mm or less. The curable composition is preferably a photocurable composition.Type: GrantFiled: August 4, 2015Date of Patent: November 24, 2020Assignee: DAICEL CORPORATIONInventors: Takeshi Fujikawa, Sadayuki Fukui
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Patent number: 10829587Abstract: An epoxy resin composition produces a cured product having improved elastic modulus and improved nominal strain at compressive fracture. The epoxy resin composition is a fiber-reinforced composite material having excellent compression strength and interlayer toughness. The epoxy resin composition contains at least the following constituent components [A], [B] and [C]. [A] A specific ortho type epoxy resin. [B] At least one component selected from the group consisting of: thermoplastic resins that are compatible with the epoxy resin [A]; and core-shell type polymers. [C] An amine curing agent.Type: GrantFiled: July 21, 2016Date of Patent: November 10, 2020Assignee: Toray Industries, Inc.Inventors: Maki Nagano, Ayako Fuse, Nobuyuki Tomioka
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Patent number: 10821777Abstract: This invention relates to a tire with a tread of a rubber composition for promoting a combination of beneficial wet traction and reduced rolling resistance, while limiting any loss of winter traction at low temperatures. The tread rubber composition contains a combination of high and lower glass transition temperature (Tg) elastomers. Its reinforcing filler is primarily precipitated silica. The high Tg elastomer is comprised of synthetic high vinyl polybutadiene rubber and the lower Tg elastomer is comprised of at least one of natural and synthetic cis 1,4-polyisoprene rubber. The tread rubber composition may contain at least one of vegetable oil based rubber processing aid and traction promoting resin. The tread rubber composition is intended to be exclusive of styrene-containing elastomers.Type: GrantFiled: December 19, 2017Date of Patent: November 3, 2020Assignee: The Goodyear Tire & Rubber CompanyInventors: Nihat Ali Isitman, Paul Harry Sandstrom, Luisa Fernanda Munoz Mejia
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Patent number: 10822517Abstract: A resin composition is provided, which includes an oligomer formed by reacting bisphenol epoxy resin monomer, aliphatic diglycidyl ether, anhydride compound, and catalyst, wherein the molar ratio of epoxy groups of the bisphenol epoxy resin monomer and aliphatic diglycidyl ether to anhydride groups of the anhydride compound is between 3.5:1 and 8.8:1. The bisphenol epoxy resin monomer and aliphatic diglycidyl ether have a molar ratio of 0.3:1 to 1.3:1, and the viscosity of the resin composition is 20 Pa·s to 80 Pa·s at 25° C.Type: GrantFiled: March 8, 2019Date of Patent: November 3, 2020Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Tien-Shou Shieh, Pei-Hsin Chien
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Patent number: 10815574Abstract: A coated article comprises an article comprising a surface and a galvanic barrier coating disposed on the surface. The galvanic barrier coating is formed from a galvanic barrier coating composition comprising (a) a thermoplastic resin, (b) an epoxy-based resin, (c) a curing agent, and (d) non-compressible, non-marring microsphere particles. Methods of preparing and using the coated article are also disclosed.Type: GrantFiled: January 5, 2018Date of Patent: October 27, 2020Inventors: Gerald F. Snow, Christopher T. Hable, Scot Wickham
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Patent number: 10808118Abstract: The present invention disclosed novel epoxy novolac composite comprising environmentally friendly toughening agents based on bio-derived chemicals namely, Difunctional glycidyl ether epoxy resin (Cardolite NC-514) and Polyglycidyl ether of an alkenyl phenol formaldehyde novolac resin (Cardolite NC-547) used for the toughening of epoxy novolac resin namely Poly[(phenyl glycidyl ether)-co-formaldehyde] [PPGEF].Type: GrantFiled: December 16, 2015Date of Patent: October 20, 2020Assignee: COUNCIL OF SCIENTIFIC & INDUSTRIAL RESEARCHInventors: Manohar Virupax Badiger, Rajeshwari Shyamji Gour, Prakash Purushottam Wadgaonkar