Abstract: An objective of the present invention is to provide: a novel thiol compound; a method for synthesizing the thiol compound; a curing agent containing the thiol compound; a resin composition containing the thiol compound and an epoxy compound; and a resin composition containing the thiol compound and an enic compound having an intramolecular carbon-carbon double bond. The thiol compound of the present invention, as exemplified by the compounds listed below, is a reaction product of a certain type of dialkene compound and a thiol compound, and has two or more intramolecular thioether bonds but no ester bonds.

Abstract: Disclosed and claimed herein is a composition for forming a spin-on hard-mask, having a fullerene derivative substituted with an amine and a crosslinking agent. The formulation is drain compatible with other solvents used in the semiconductor industry.

Abstract: The invention pertains to certain copolymers (PEDEK/PEEK), comprising a majority of “PEDEK”-type recurring units, which, thanks to the predominance of PEDEK-type units, their structural homogeneity and regularity, and absence of chlorinated end groups, possess a suitable molecular structure and crystallization behaviour so as to deliver improved mechanical properties and outstanding chemical resistance, and which are useful in numerous fields of endeavours, including notably in the oil&gas industry, and more specifically for the manufacture of parts used in oil and gas extraction systems.

Abstract: A process is disclosed for the production of an epoxy resin. This process includes providing lignin, one or more acids and/or esters derived from epoxidized vegetable oil(s), optionally a solvent and optionally a catalyst, to form a reactive mixture. The reactive mixture is mixed and cured in the presence of a curing agent to form the epoxy resin.

Abstract: The present teachings contemplate additive manufacturing of articles, such as articles made by layer-by-layer deposition of one or more reformable resin polymeric feed material. In particular the invention relates to a feed material system for preparing an article by additive manufacturing, comprising one or more preform elements of a feed material (i) formed of a reformable resin polymeric material including a polymer backbone having a plurality of repeat units each having ether linkages (e.g.

Abstract: A composition of epoxide-functionalized resins comprises at least a first epoxide-functionalized novolac resin, a second epoxide-functionalized novolac resin, and a curing agent selected from phenolic or amine-type curing agents, the average molar mass of the group consisting of the entirety of the epoxidized novolac resins in the said composition being between 550 and 650 g/mol, the average epoxide functionality of the said group being between 3 and 3.5 eq epoxide/mol, and the said composition having a glass transition temperature Tg of at least 160° C.

Abstract: An epoxy resin composition for fiber-reinforced composite materials which contains 70% by mass or more of a crystalline epoxy resin as component (A) and 10% by mass or more of a crystalline amine curing agent as component (B) based on 100% by mass of the epoxy resin composition. The difference between the melting points of component (A) and component (B) is in a range of 0 to 60° C.

Abstract: A curable coating composition precursor comprising: (a) a first part (A) comprising (i) at least one amine epoxy curing agent based on a phenolic lipid, and (ii) inorganic microspheres; and (b) a second part (B) comprising (i) at least one epoxy resin, (ii) optionally, at least one reactive diluent, (iii) at least one epoxy reactive flexibilizer, and (iv) inorganic microspheres. The curable coating composition precursor comprises at least one fire retardant compound in part (A) and/or part (B), and the curable coating composition obtained by combining part (A) and part (B) has a density of less than 0.7 g/cm3.

Abstract: An epoxy resin composition for fiber reinforced composite materials comprising components (A) to (E): component (A), an epoxy resin; component (B), a dicyandiamide or a derivative thereof; component (C), a polyisocyanate compound; component (D), a urea compound as represented by formula (1): (wherein R1 and R2 are each independently H, CH3, OCH3, OC2H5, NO2, halogen, or NH—CO NR3R4; and R3 and R4 are each independently a hydrocarbon group, allyl group, alkoxy group, alkenyl group, aralkyl group, or an alicyclic compound containing both R3 and R4, all containing 1 to 8 carbon atoms); and component (E), at least one compound selected from the group consisting of quaternary ammonium salts, phosphonium salts, imidazole compounds, and phosphine compounds.

Abstract: A composition including cement, filler, polymer and a compound having epoxide groups and also an amine, wherein the composition contains more than 10% by weight of cement and at room temperature is present as storage-stable free-flowing powder and/or granular material. When mixed with water, the composition makes polymer-modified mortars having good processability, excellent adhesion, strength, water impermeability, chemical resistance and quick coatability possible.

Abstract: An epoxy resin composition for encapsulation of semiconductor devices and a semiconductor device encapsulated using the epoxy resin composition, the epoxy resin composition including an epoxy resin; a curing agent; an inorganic filler; and a curing catalyst, the epoxy resin including an epoxy resin represented by Formula 1:

Abstract: This invention provides a polymer, which is preferably a polyether polymer. The polymer may be uses in coating compositions. Containers and other articles comprising the polymer and methods of making such containers and other articles are also provided. The invention further provides compositions including the polymer (e.g., powder coatings), which have utility in a variety of coating end uses, including, for example, valve and pipe coatings.

Abstract: A description is given of the use of compounds having n 2-oxo-1,3-dioxolane-4-carboxamide units as a reactive component in 2-component adhesives, especially for preparing hydroxypolyurethanes or hydroxypolycarbonates for adhesives applications, where n is a number greater than or equal to 2. A description is also given of corresponding two-component adhesives and adhesive bonding methods. Employed preferably as a second component of the two-component adhesive is a polyfunctional curing agent compound which is preferably selected from polyamines which have two or more amine groups and polyols which have two or more alcoholic hydroxyl groups.

Abstract: A resin composition and method for installing a pipe liner that allows the liner to be fully wet out with a resin and activator and stored for a period of up to six months prior to installation and curing. A method of lining a pipe with a delayed curing resin composition is also provided that includes fully wetting out a liner with a blended two part epoxy composition such that the liner can be transported in a wet out fashion, placed in a pipe to be lined and repositioned as needed without concern for the resin composition to begin curing.

Abstract: An ionic aqueous epoxy curing agent, a preparation method therefor and the use thereof. The aqueous epoxy curing agent is prepared by reacting the following raw materials in parts by weight: a) 1 part of a polyepoxy compound, b) 1.3-6 parts of a multifunctional compound, c) 0.2 to 1.25 parts of a monoepoxy compound, and d) 0.01 to 0.23 parts of a sultone, wherein the multifunctional compound has four or more active hydrogens. The curing agent obtained has a good hydrophilic effect and very good thinning performance, the paint film prepared by mixing same with an epoxy dispersion has the following advantages: excellent salt spray resistance and water resistance, strong adhesion, high hardness, etc.; in addition, the preparation process of the curing agent is simple, the conditions are mild, and room temperature curing is carried out.

Abstract: A method for producing an aromatic polysulfone by a polycondensation reaction between an aromatic dihalogenosulfone compound and an aromatic dihydroxy compound is described. The polycondensation reaction is performed in the presence of at least one aromatic end-capping agent; and an amount, p mol, of the aromatic dihalogenosulfone compound, an amount, q mol, of the aromatic dihydroxy compound, and an amount, r mol, of the aromatic end-capping agent have a relationship satisfying formula (S1) below and formula (S2) below: r/(p?q)<2 ??(S1), and p>q ??(S2).

Abstract: The invention relates to a curable resin composition containing (A) a multifunctional benzoxazine compound having two or more benzoxazine rings, (B) an epoxy compound having at least one norbornane structure and at least two epoxy groups, (C) a naphthylene ether type epoxy compound, and (D) a curing agent, and optionally (E) an inorganic filler and (F) a curing accelerator; a cured product thereof; methods of producing the curable resin composition and the cured product and a semiconductor device in which a semiconductor element is disposed in a cured product obtained by curing a curable resin composition containing components (A) to (D), and optionally components (E) and (F).

Abstract: The invention relates to a curable resin composition containing (A) a multifunctional benzoxazine compound having two or more benzoxazine rings, (B) an epoxy compound having at least one norbornane structure and at least two epoxy groups, (C) a biphenyl type epoxy compound, and (D) a curing agent, and optionally (E) an inorganic filler and (F) a curing accelerator; a cured product thereof; methods of producing the curable resin composition and the cured product; and a semiconductor device in which a semiconductor element is disposed in a cured product obtained by curing a curable resin composition containing components (A) to (D), and optionally components (E) and (F).

Abstract: A method for producing bifunctional furan epoxy (BFFE) according to various embodiments of the present disclosure uses a bio-based monofunctional furan raw material to produce BFFE, and may include synthesizing BFFE raw material by reacting furfuryl alcohol, formaldehyde, and an acid-base mixture catalyst, and polymerizing BFFE by adding epichlorohydrin (ECH), a base catalyst, and a solvent to the BFFE raw material.

Abstract: A high-performance triple-crosslinked polymer and a preparation method thereof are provided. The polymer is obtained by curing and cross-linking a monomer having two epoxy groups, a cross-linking monomer and a functional monomer. The polymer contains a cross-linking network formed by covalent bonds and two types of multi-level hydrogen bonds with different strengths. The interaction strength between the covalent bonds and the two types of hydrogen bonds decreases in a gradient. The dilemma of the strength-ductility tradeoff in a high-performance polymer is overcome by forming a triple-crosslinked network with covalent bonds and multi-level hydrogen bonds with different strengths in the polymer. The dynamic and hierarchical hydrogen bonds are broken and recombined timely and continuously to concurrently maintain the complete structure of the polymer network and enable the polymer network to quickly respond to the transmission and dissipation of the external environment.