Patents Examined by Michael A Matey
  • Patent number: 11665852
    Abstract: In one or more embodiments, an information handling system fan may include: a hub; multiple fan blades radially attached to the hub and configured to rotate perpendicularly to a longitudinal axis of the information handling system fan; an electric motor; a drive shaft parallel to the longitudinal axis of the information handling system fan that attaches the electric motor to the hub; and a housing that houses the hub, the multiple fan blades, and the electric motor. In one or more embodiments, the housing may have a concave portion perpendicular to the longitudinal axis of the information handling system fan, in which the housing may include a first vent in the concave portion of the housing to intake air as the multiple fan blades rotate and in which the housing may include a second vent configured to exhaust the air as the multiple fan blades rotate.
    Type: Grant
    Filed: September 10, 2021
    Date of Patent: May 30, 2023
    Assignee: Dell Products L.P.
    Inventor: Qinghong He
  • Patent number: 11665860
    Abstract: A fan carrier system, including a fan carrier, including: a fan apparatus having i) a first end positioned opposite to a second end, and ii) a first side positioned opposite to a second side, the first and the second side extending between the first end and the second end; a first piston coupled to the fan apparatus, the first piston positioned along the first side, the first piston translatable between the first end and the second end; a connection assembly coupled to a first end of the first piston, the connection assembly including a first connector; a handle assembly, including: a first arm coupled to the first piston via a first handle pin, the first arm further including a first carrier pin; a handle coupled to the first arm; a chassis, including: a first wall and a second wall each including a respective slot.
    Type: Grant
    Filed: October 20, 2021
    Date of Patent: May 30, 2023
    Assignee: Dell Products L.P.
    Inventors: Jeffrey Michael Lewis, Stephen Edward Strickland
  • Patent number: 11665869
    Abstract: This application relates to display devices and the layout/architecture of various internal components to enhance thermal energy management. A display device described herein may include one or more fan assemblies that drive ambient air into the display device to cool heat-generating components of the display device, and also to drive the ambient air, once heated through convectively cooling the heat-generating components, out of the display device. Further, the location of the heat-generating components is such that the heat-generating components upstream relative to the one or more fan assemblies. In this manner, the ambient air can pass over or through the heat-generating components prior to reaching the one or more fan assemblies. Additionally, heat-generating components, such as a backlit device and a power supply unit, are positioned relatively close to vent inlets in the display device. As a result, these heat-generating devices are immediately cooled with the ambient air.
    Type: Grant
    Filed: August 10, 2021
    Date of Patent: May 30, 2023
    Assignee: APPLE INC.
    Inventors: Michael E. Leclerc, Kevin J. Ryan, Brett W. Degner
  • Patent number: 11665862
    Abstract: An information handling system, including a plurality of computing modules; a rack-mountable tray including: a plurality of bays, each bay including a thermal pad, wherein i) each computing module is engaged with one or more of the bays of the plurality of bays and ii) one or more of the thermal pads are in thermal communication with a respective computing module of the plurality of computing modules; and a fluid circulation system positioned within the tray and coupled to each of the thermal pads, the fluid circulation system circulating fluid proximate to the thermal pads to transfer heat from the computing modules through the thermal pads.
    Type: Grant
    Filed: April 20, 2021
    Date of Patent: May 30, 2023
    Assignee: Dell Products L.P.
    Inventors: Richard A. Crisp, Matthew B. Gilbert, Corey D. Hartman
  • Patent number: 11656656
    Abstract: A display device includes a display panel including a rear surface and a front surface, where the front surface is provided with a display surface and including a folding axis extending in a first direction, a first barrier member disposed on the rear surface of the display panel and having a modulus of about 1 GPa to about 300 GPa, a first coupling member disposed on a rear surface of the first barrier member, and a metal plate disposed on a rear surface of the first coupling member and including a first plate portion and a second plate portion which are arranged in a second direction crossing the first direction and a connection portion connecting the first plate portion and the second plate portion, where the first coupling member does not overlap the connection portion in a plan view.
    Type: Grant
    Filed: March 5, 2021
    Date of Patent: May 23, 2023
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Jai Ku Shin, Dong Jin Park, Dong Woo Seo, Sung Chul Choi
  • Patent number: 11653469
    Abstract: A modular mounting for a computer motherboard. An outer cabinet is designed to provide a protective enclosure for electrical components, and designed to permit throughhole drilling to facilitate mounting on a wall while avoiding disturbance of contents to be mounted within the outer cabinet. A subpanel plate is designed to detachably and securely attach a computer motherboard and cage assembly, and designed to removably mount the motherboard and cage assembly within the outer cabinet as a modular component, mounting of the motherboard and cage assembly being independent of power supply and nonvolatile storage. An inner cage is designed to protectably mount and enclose a computer motherboard and heat sink, and mount to the subpanel plate. A multipole switch may have a set of contacts for each conductor of a network cable entering the outer cabinet, one throw of the switch connecting all conductors of the cable, another throw of the switch disconnecting all contacts of the cable.
    Type: Grant
    Filed: August 29, 2022
    Date of Patent: May 16, 2023
    Assignee: Aertight Systems, Inc.
    Inventors: Gordon Triplett, Julia Triplett, Matthew Findley, Edward Triplett
  • Patent number: 11641725
    Abstract: Embodiments of this application relate to a heat dissipator including a cover plate, an orifice plate, and a base plate that are stacked in sequence. A distribution cavity is disposed between the orifice plate and the cover plate, a heat exchange cavity is disposed between the orifice plate and the base plate, and the distribution cavity communicates with the heat exchange cavity by using through holes disposed on the orifice plate. A plurality of pin fins facing the orifice plate are disposed on a surface of the base plate in the heat exchange cavity, gaps between the plurality of pin fins constitute a fluid passage, and the pin fins include a combination pin fin in contact with the orifice plate, and a flow guiding pin fin that corresponds to the through hole and that has a gap with the through hole.
    Type: Grant
    Filed: March 30, 2022
    Date of Patent: May 2, 2023
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventor: Hui Jia
  • Patent number: 11630192
    Abstract: An ultrasound imaging system includes a thermally conductive frame and a number of electronic components and a display that are sealed within the frame. The frame further includes a plenum extending through the frame with surfaces that are thermally coupled to the electronic components and the display. An active cooling mechanism, such as one or more fans, moves air through the plenum to remove heat generated by the electronic components and display. The plenum is environmentally sealed so that moisture, dust, air or other contaminants drawn into the plenum do not contact the sealed electronic components and display in the frame.
    Type: Grant
    Filed: April 22, 2022
    Date of Patent: April 18, 2023
    Assignee: FUJIFILM SONOSITE, INC.
    Inventor: Rahul Gupta
  • Patent number: 11632880
    Abstract: The present disclosure provides a cooling system. The cooling system includes: a first set of fans mounted on an inward-facing side of an air inlet on an outer shell of a case; a second set of fans mounted on an inward-facing side of an air outlet on the outer shell of the case, for generating, in cooperation with the first set of fans, a high-pressure airflow from the air inlet to the air outlet; a first heat sink connected to heat generating component in the case, for absorbing heat from the heat generating component and transferring the absorbed heat to a second heat sink; and the second heat sink mounted on an inward-facing side of the second set of fans and cooled by the high-pressure airflow.
    Type: Grant
    Filed: March 30, 2021
    Date of Patent: April 18, 2023
    Assignee: BEIJING TUSEN ZHITU TECHNOLOGY CO., LTD.
    Inventor: Zhihua Ma
  • Patent number: 11632876
    Abstract: An electronic device is provided. The electronic device includes a rear cover including an air inlet and an air outlet; a middle frame which is assembled with the rear cover to define a containing cavity in communication with the air inlet and the air outlet; a heat source arranged in the containing cavity; a heat transfer assembly arranged on a side of the middle frame facing towards the rear cover, and including first and a second ends; and a fan arranged opposite to the second end in the containing cavity. The first end and the heat source are stacked in a thickness direction of the electronic device. The heat transfer assembly is configured to transfer heat of the heat source to the second end. The fan draws air flow through the air inlet and discharges the air flow through the air outlet.
    Type: Grant
    Filed: June 30, 2021
    Date of Patent: April 18, 2023
    Assignee: Beijing Xiaomi Mobile Software Co., Ltd.
    Inventors: Bo Zhang, Duzi Huang, Mingyan Liu, Kailiang Zhao
  • Patent number: 11617283
    Abstract: A heat dissipating plate includes a casing, a capillary structure layer, a support structure, and heat dissipating liquid. The casing includes a first substrate and a second substrate, which is disposed opposite to the first substrate to form a non-vacuum sealed cavity. The capillary structure layer is disposed in a first region of the non-vacuum sealed cavity and defines a first flow space. The support structure is disposed in a second region of the non-vacuum sealed cavity and defines a second flow space. The heat dissipating liquid is disposed in the non-vacuum sealed cavity, the liquid amount of which is more than 50% of the total capacity of the first flow space and the second flow space, and flows between the first flow space and the second flow space. The invention also provides a method for manufacturing the heat dissipation plate and an electronic device having the heat dissipation plate.
    Type: Grant
    Filed: October 29, 2019
    Date of Patent: March 28, 2023
    Assignee: THERLECT CO., LTD.
    Inventor: Chien-Yu Chen
  • Patent number: 11617287
    Abstract: Systems and methods for thermally managing display assemblies are provided. An airflow pathway extends within a housing for an electronic display and includes a storage area at least partially defined by a partition. A loopback channel forms a pathway about an equipment storage device for accepting electronic equipment located within the storage area. The loopback channel accepts a flow of air in the airflow pathway when a fan unit for moving the air through the airflow pathway is activated.
    Type: Grant
    Filed: July 12, 2021
    Date of Patent: March 28, 2023
    Assignee: Manufacturing Resources International, Inc.
    Inventor: William Dunn
  • Patent number: 11604498
    Abstract: A fan cage is at least adapted to a first fan and a second fan smaller than the first fan. The fan cage includes a cage body and an adjustment member. The cage body defines a first accommodation portion in a size fitting the first fan. The adjustment member is movably disposed on the cage body and switchable between a laid down status and an upright status within the first accommodation portion. When the adjustment member is in the upright status, the adjustment member is upright in the first accommodation portion so that the adjustment member and the cage body together define part of the first accommodation portion as a second accommodation portion in a size fitting the second fan.
    Type: Grant
    Filed: October 28, 2021
    Date of Patent: March 14, 2023
    Assignee: WISTRON CORP.
    Inventors: Yong-Qing Zhong, Zhao-Ping Fu, Yisheng Chen
  • Patent number: 11599168
    Abstract: A cooling system for cooling components in an information handling system contained in a portable chassis comprises a die plate for receiving heat from a component, a heat pipe for transferring heat from the die plate to a single heat exchanger, a fan for generating an airflow across the heat exchanger and a thermal battery. The heat pipe comprises at least one curvature and the thermal battery is coupled to the die plate and has a length and a width such that the thermal battery is in contact with the heat pipe from the die plate to a point past the at least one curvature. The thermal battery may be formed from a thermally conductive material, be a vapor chamber or otherwise facilitate heat transfer to a heat pipe from the die plate to a point past the curvature for improved cooling.
    Type: Grant
    Filed: July 27, 2021
    Date of Patent: March 7, 2023
    Assignee: Dell Products L.P.
    Inventors: Allen B. McKittrick, Pomin Shih, Travis North
  • Patent number: 11596052
    Abstract: The present disclosure generally relates to a computer circuit board having an integrated voltage regulator assembly that may include a heat sink and at least one voltage regulator module board. The heat sink may have a metal plate with at least one recess in which the voltage regulator module board may be attached. The voltage regulator module board is electrically coupled to a semiconductor package and the heat sink is thermally coupled to the semiconductor package. The computer circuit board is used in high-performance computing devices including computer workstations and computer servers.
    Type: Grant
    Filed: August 10, 2020
    Date of Patent: February 28, 2023
    Assignee: Intel Corporation
    Inventors: Wei Cheang Lau, Yew San Lim, Min Suet Lim
  • Patent number: 11596081
    Abstract: A display assembly includes a housing which at least partially encloses an image assembly. A cover positioned forward of, and spaced apart from, the image assembly forms at least a portion of a forward surface of the housing and permits viewing of images displayed at the image assembly therethrough. A fan assembly moves air through an airflow pathway within the housing which includes a front channel between the cover and the image assembly and a rear chamber behind the image assembly. One or more solar energy reduction layers are associated with the cover and prevent at least some ambient sunlight striking the cover from traveling therebeyond.
    Type: Grant
    Filed: April 19, 2021
    Date of Patent: February 28, 2023
    Assignee: Manufacturing Resources International, Inc.
    Inventors: William Dunn, Tim Hubbard
  • Patent number: 11592883
    Abstract: Thermal management within an information handling system housing is provided by applying graphene paint to a support structure disposed within the housing, such as a battery casing that supports battery cells, a keyboard lattice that supports keyboard coupling to the housing and screws that attach components to the housing. The graphene paint may have different concentrations of graphene and/or different thicknesses so that the thermal characteristics of the support structure adapt to thermal generation within the housing, such as to keep an even distribution of temperatures within the housing.
    Type: Grant
    Filed: July 30, 2021
    Date of Patent: February 28, 2023
    Assignee: Dell Products L.P.
    Inventors: Pomin Shih, Travis C. North, Geroncio Tan, Deeder M. Aurongzeb, Salvador D. Jimenez, III
  • Patent number: 11589479
    Abstract: Heat-rejecting media configured to thermally couple to a heat-generating component of an information handling resource may include a source, a sink, and a thermally-conductive strip coupled between the source and the sink. The source may include a first flexible and thermally-conductive skin surrounding a first cavity comprising a first solid foam, such that mechanical compression by components of the information handling resource provides mechanical pressure for thermally coupling the source to the heat-generating component. The sink may include a second flexible and thermally-conductive skin surrounding a second cavity comprising a second solid foam, such that mechanical compression by components of the information handling resource provides mechanical pressure for thermally coupling the sink to a component of the information handling resource exposed externally to the information handling resource.
    Type: Grant
    Filed: September 28, 2021
    Date of Patent: February 21, 2023
    Assignee: Dell Products L.P.
    Inventors: Mingming Zhang, Zhaobo Li, Zhaowei Shang
  • Patent number: 11586261
    Abstract: A portable information handling system glass ceramic housing integrates a heat sink of thermally conductive wire disposed in a coil or mesh pattern that is difficult to discern from the housing exterior. A thermal transfer device communicates thermal energy from internal processing components to the heat sink in aesthetically pleasing manner. For example, a plastic logo is coated with graphene to transfer thermal energy by pressing against the thermally conductive wire so that that logo is visible from the housing exterior. Through glass via opening provide air passages between the housing interior and exterior to promote rejection of the thermal energy from the housing.
    Type: Grant
    Filed: July 12, 2021
    Date of Patent: February 21, 2023
    Assignee: Dell Products L.P.
    Inventors: Duck-Soo Choi, Peng Lip Goh, Deeder M. Aurongzeb
  • Patent number: 11582882
    Abstract: An information processing apparatus includes: a first chassis having a first surface provided with at least an air intake port; a second chassis which is connected to the first chassis in a relatively rotatable manner and has a second surface that overlaps the first surface of the first chassis by the rotation; a heat dissipation unit having a fan for replacing air in the first chassis with outside air through at least the air intake port; a state detection unit that detects whether a state is a first state in which the first surface and the second surface overlap; and a control unit which changes control of the fan according to whether the state is the first state.
    Type: Grant
    Filed: September 13, 2021
    Date of Patent: February 14, 2023
    Assignee: LENOVO (SINGAPORE) PTE. LTD.
    Inventors: Masahiro Kitamura, Shogo Akiyama, Takuroh Kamimura, Atsunobu Nakamura