Abstract: An air purifying data processing system includes a chassis, a planar, a microprocessor and an air purifier. The air purifier produces purified air that is exhausted exterior to the chassis to improve the air quality in the vicinity of the chassis. The air purifier produces an air flow that is preferably in proximity to the microprocessor to facilitate dissipation of heat generated by the microprocessor. The air purifier may be oriented to direct the air flow through an opening in a first face of the chassis. The air purifier may include a high voltage unit to create an electrical discharge within the air purifier. The high voltage unit preferably produces a voltage greater of 8000 V or at an output point of the high voltage unit. The air purifier includes a grounded and electrically conductive grid in the vicinity of the high voltage unit output point.

Abstract: A field-replaceable active pumped liquid heat sink module includes a liquid pump, a radiator, an optional receiver, and a gasketed cold heat exchanger box, all of which are connected together in a liquid pump loop through which a coolant such as water is circulated. The liquid pump, radiator, optional receiver and gasketed cold heat exchanger box are in a liquid pump loop and are self-contained in a field-replaceable active pumped liquid heat sink module. The heat sink module provides direct contact between the liquid coolant and the top portion of the targeted electronic component, which can be a CPU.

Abstract: Provided is a computer with a case and a plurality of parts, including heat generating components that generate heat when operated, installed in the case, wherein the case includes a plurality of plates, and heat generated by at least one of the heat generating components when operated is transmitted to at least one of the plates via a heat conduction unit, which connects the at least one of the heat generating parts and the plate, and externally dissipated from the case. The heat generating components mounted in the case can be noiselessly and efficiently cooled without a noise-generating cooling fan.

Abstract: This power switching device comprises semiconductor members (60) having drain, gate and source connections. Said members (60) are soldered by their drain soles to protuberances of an electrically conductive cooling plate (20), while the gates and the sources (62, 63) of the semiconductor members (60) are connected to a control circuit and to power connectors via a routing circuit (40) placed generally parallel to and in the vicinity of said plate (20) but separated therefrom by a spacer (30) and having openings (42) corresponding to the flat protuberances of the subjacent plate (20), which protuberances lie in a plane close to the routing circuit (40), by means of which the semiconductor devices (60) may be connected to the plate (20) and to the routing circuit (40) substantially in the same plane.

Abstract: An offset assembly for a circuit breaker includes at least one two plane member having a first plate and a second plate. The first and second plates are joined at an edge and extend generally perpendicular to each other. The second plate is structured to be coupled to the quick disconnect and the first plate is structured to be coupled to the circuit breaker terminal so that the second plate is not aligned with the centerline of the circuit breaker terminal.

Abstract: According to the invention, the busbar system comprises at least one first (2) and one second busbar block (3) with busbars (6), whereby the busbars (6) of the first busbar block (2) are electrically connected to a number of supply terminals (5) mounted in a fixed manner thereon and to the busbars (6) of the second busbar block (3) by means of a multiphase connecting plug (4).

Abstract: An electronic equipment case structure aims to provide bracing and cooling for an electronic element. The electronic equipment is housed in the case which has a plurality of protrusive sections on the outer side that are spaced from one another at a selected distance to serve as a bracing structure. By means of using material of a high thermal conductive coefficient and increasing the radiation area, cooling efficiency increases. The electronic equipment case structure can provide a bracing and cooling function.

Abstract: A circuit board module includes a circuit board having surface mount pads, a circuit board component mounted to the circuit board, and a heat sink assembly. The heat sink assembly includes a heat sink, a first clip holder and a second clip holder. Each clip holder is mounted to respective surface mount pads of the circuit board using a surface mount technology soldering process. The heat sink assembly further includes a clip having a first portion configured to fasten to the first clip holder, a second portion configured to fasten to the second clip holder, and a third portion coupled to the first and second portions. The third portion is configured to position the heat sink adjacent the circuit board component when the first and second portions are respectively fastened to the first and second clip holders.

Abstract: Provided is a water cooling type cooling jacket for an electronic device including a pouch body formed of a soft, loose elastic material that is deformable to closely contact heat-generating elements having various shapes due to a contact pressure and accommodating and a coolant, and a coolant inlet tube and a coolant outlet tube formed at one side of the pouch body to allow the coolant to circulate inside the pouch body and connected to coolant circulation lines for circulating the coolant. Therefore, the water cooling type jacket for an electronic device can be adapted to various shapes of heat-generating elements having uneven surfaces and various shapes of installation spaces beyond electrical and mechanical limitation to increase a heat transfer area and maximize a heat transfer efficiency and can be installed at various electronic devices such as hard disk drives, video cards or memory cards and a PCB without spatial limitation.

Abstract: A heat sink assembly may be plugged into a receiving element in a printed circuit board. A retention element includes upper and lower portions. The lower portion may be plug locked onto a printed circuit board. The upper portion then telescopes into and releaseably locks in the lower portion. The upper portion may include a rod which may be rotated to free the upper portion from the lower portion for disassembly.

Abstract: A cooling system for an electronic display may include a heat collector plate with internal gas and liquid phase lines. The cooling plate may be thermally isolated together with electronic components of the display within an enclosure of the display, while external lines carry liquid and gas phase refrigerant outside the enclosure to and from the heat collector plate. The external lines may be similar in size to each other and may be connected to the heat collector outside the heat collector plate by a manifold. The heat collector plate contacts a base plate of the electronic display in a thermally conductive relation to transfer heat from electronic components within the display to the gas phase refrigerant. Fans may be included for additional convective heat transfer. A single compressor may be fluidly connected to multiple heat collector plates in respective electronic displays.

Abstract: A heat removal device includes a shroud on a top side of a printed circuit board that contains a power connector. An air intake vent is located underneath the printed circuit board and directs air up through printed circuit board vias into the shroud. Openings are located in a power connector housings that allow air to flow over conductors in the connector and out an air outtake vent. The conductors include heat sink fins that extend out of the openings in the connector housing.

Abstract: A circuit board module has a circuit board, a component mounted to the circuit board, and a heat sink assembly. The heat sink assembly includes a base member having a first edge and a second edge. The base member is configured to operate as a thermal conduit between a first location proximate to the component and a second location distal to the component. The heat sink assembly further includes a first rail member coupled to the base member along the first edge of the base member, a second rail member coupled to the base member along the second edge of the base member, and an actuation mechanism coupled to the base member. The actuation mechanism is configured to move portions of the members toward each other when the base member resides at the first location to fasten the base member to the component.

Abstract: A burn-in testing cooling system includes a heat pipe having a tubular body. A capillary wick is disposed on an evaporator portion of the tubular body, and a base seals off the evaporator portion. The base is sized and shaped so as to be releasably thermally engaged with a semiconductor device during burn-in testing. A working fluid is disposed within the heat pipe in sufficient quantity to at least saturate the wick. A hollow tube is coiled around the exterior surface of the heat pipe such that a first set of interior coils are formed adjacent to the exterior surface. These interior coils are brazed to the exterior surface so as to enhance their thermal interface with the heat pipe. A second set of coils are wrapped around the first set of coils, in overlying relation to them.

Abstract: A modular platform is provided. The modular platform includes a modular platform shelf configured to receive modular platform boards, and a dual plenum coupled to the modular platform shelf, the modular platform configured to couple to a plenum portion of a dual plenum of another modular platform or a stand-alone plenum.

Abstract: An evaporator having an enhanced flow channel design for use in a computer system is described. Specifically, micro-channels of the evaporator comprise nucleation sites and different channel widths. The enhanced flow channel design improves heat transfer from a computer component to a working fluid.

Abstract: A temperature sensor for radiant heating units with a heating coil disposed in a cup includes a tube with a first end connected to a housing of a switch with a movable contact cooperating with stationery contacts in the housing. A two-section rod, which extends into the housing of the switch and operates the movable contact, is supported inside the tube. The tube and the rod have different thermal expansion coefficients. To prevent a shift in the switching point, the section of the rod that operates the contact terminates outside the hollow space of the cup, and the temperature-induced length changes of this section and of the housing are matched to each other.

Abstract: A mother board includes a CPU, a suction fan mounted on the CPU for dissipating heat resulting from operation of the CPU, a north bridge chip disposed downstream to the suction fan, a power-consumption component disposed at one side of the CPU, and a ventilation-enhancing member disposed above the chip and capable of diverting an air flow of the suction fan toward the power-consumption component.

Abstract: An integrated power module includes a longitudinally extending mounting member defining a cooling passageway on a first side thereof. A heat sink is positioned in the cooling passageway. A printed circuit board is positioned proximate a second side of the mounting member opposite the first side. A heat generating power circuit is electrically coupled to the printed circuit board and positioned between the printed circuit board and the mounting member. The power circuit is thermally coupled to the heat sink. An inductor is mounted in the cooling passageway. Methods of forming an integrated power module are also provided.

Abstract: The present invention includes a heat sink assembly within a potted housing and a method for transferring heat within a potted housing. The heat sink assembly includes a bracket, a heat-containing element, and a self-tapping screw operatively arranged to engage the bracket and the heat-containing element. The screw presses the heat-containing element against the bracket. In some cases, the bracket is brass. In some cases, the housing is for a fuel pump and the heat-containing element includes a printed circuit board with an oscillating circuit and a heat sink.