Abstract: A point of sale device includes a base defining an opening in a top thereof and a through hole in a bottom thereof, a motherboard mounted in the base and comprising a plurality of sockets exposed in the opening to engage with a plurality of cables, and a top cover pivotably attached to the base to shield the opening. The cables extend through the through hole.

Abstract: An electronic control device, comprising: a circuit board on which an electronic component having a heat generating characteristic is mounted; a resin made cabinet housing the circuit board; and a ventilation passage whose one end is opened to an inside of the cabinet and whose other end is opened to an outside of the cabinet to communicate between the inside of the cabinet and the outside of the cabinet, wherein the one end of the ventilation passage is opened to the electronic component having the heat generating characteristic and a standing wall is formed along an outer peripheral edge of the one end opening.

Abstract: Apparatuses, methods and storage media associated with cooling one or more heat-generating components of an electronic device are disclosed herein. In embodiments, an electronic device may include a tank that may include a dielectric fluid and one or more heat-generating components. The electronic device may further include one or more transducers coupled with the tank. The transducers may be configured to generate an ultrasonic wave that controls movement of the dielectric fluid at a location within the tank. Other embodiments may be described and/or claimed.

Abstract: A power supply module for intelligent electronic apparatuses and capable of transforming the energy of the LV network and of a battery into energy that can be used by said apparatuses is produced to serve as support for said apparatuses. In particular, for a use in a telecontrol equipment item, the casing of the power supply module is flat, can be installed on wall-mounted DIN rails, and includes, on its front face, a DIN rail for fixing the apparatuses that it powers, that is to say other functional modules of the equipment. The casing also includes an apron for the connections. Preferably, the power supply is produced by series connection, and the power supply module includes a port dedicated to external communication via a module of the equipment.

Abstract: An electrical switchgear system includes a first compartment supplied with cooling air and in fluid communication with an exhaust plenum. A second compartment is in fluid communication with the exhaust plenum. A deflector is operative to deflect an amount of the cooling air from the first compartment and direct it into the second compartment. An electrical switchgear system having switchgear in an enclosure includes a first compartment disposed inside the enclosure and supplied with cooling air. A second compartment is disposed inside the enclosure. A deflector is operative to capture an amount of the cooling air from the first compartment and direct it into the second compartment.

Abstract: An Expandable Modular Information Technology (EMIT) Facility (EMITF) includes: an EMIT Building Infrastructure (EMITBI) having an initial enclosure that includes: a base pad providing a fixed usable space area on which one or more modular IT components are placed; and a plurality of exterior walls, including at least one removable expansion wall (REW) that enables expansion of the usable space area of the EMITBI; a plurality of modular IT components placed within the EMITBI on the usable space, and which dissipate heat; and at least one air handling unit (AHU) in fluid communication with the enclosure to support cooling of one or more of the IT components within the enclosure. As the EMITBI is expanded to include more IT components, additional AHUs are added to the EMITF in fluid communication with a respective area of the EMITBI to provide cooling to the added IT components.

Abstract: In some examples, a cooling system includes a silicon substrate defining a first trench, a second trench, and a plurality of channels extending between the first trench and the second trench. The silicon substrate may define a first surface and a second surface substantially opposite to and substantially parallel to the first surface, and each of the plurality of channels may extend substantially parallel to the surface of the silicon substrate. The cooling system also may include a microelectronic device comprising a heat-generating area. The microelectronic device may be attached to the first surface or the second surface of the silicon substrate. In some examples, the plurality of channels may be etched between the first trench and the second trench.

Abstract: A cooling assembly is provided which includes: one or more coolant-cooled heat sinks configured to couple to one or more electronic components to be cooled; one or more flexible coolant conduits; and one or more pivotable coolant manifolds. The flexible coolant conduit(s) couples in fluid communication the pivotable coolant manifold(s) and the coolant-cooled heat sink(s), and accommodates pivoting of the pivotable coolant manifold(s), while maintaining the coolant-cooled heat sink(s) in fluid communication with the pivotable coolant manifold(s). In one or more embodiments, the pivotable coolant manifold(s) pivots between a first position laterally offset from one or more of the coolant-cooled heat sink(s), and a second position above the one or more coolant-cooled heat sinks. First and second pivot arms may be provided at opposite ends of the pivotable coolant manifold(s) to facilitate pivotable movement of the manifold(s) between the first position and the second position.

Abstract: An electronic device having a heat generating element and a housing is provided including a heat dissipation arrangement provided between the heat generating element and the housing, the heat dissipation arrangement comprising a first layer in contact with the heat generating element and a second layer provided on top of the first layer and being in contact with the housing, the first layer having higher heat conductivity than the second layer, the second layer preventing heat from rapidly passing through such that the heat can be diffused in the first layer.

Abstract: An apparatus for enclosing a medium and/or high voltage unit connectable to an electric power system. The unit includes one or a plurality of electrical components and generates heat as a by-product during operation. The apparatus includes a housing including a main chamber housing a seat for holding the unit. The main chamber is arranged to house the unit. The housing includes at least one gas exit opening at an upper part of the housing and at least one gas entry opening. The housing includes a sound-absorptive gas exit chamber provided with the at least one gas exit opening. The housing includes a sound-absorptive gas entry chamber provided with the at least one gas entry opening. A first heat convection path is provided inside the housing between the at least one gas entry opening and the at least one gas exit opening, via the gas entry chamber, via the main chamber and via the gas exit chamber, in order to provide cooling.

Abstract: A modular power control system is provided and includes an enclosure having an enclosure top, an enclosure bottom, an enclosure front, an enclosure rear, a first enclosure side and a second enclosure side, wherein the enclosure includes an input power connector. The MPCS further includes a module internal support, wherein the module internal support includes a first and module support connected to the enclosure sides, wherein the first module support includes a first module channel and the second module support includes a second module channel. The MPCS further includes at least one module, wherein the at least one module having module sides which define a module cavity, wherein the module sides include a side channel guide for interacting with the first and second module channels, wherein the module includes at least one module power connector configured to conductively associate with the input power connector.

Abstract: Electrical machine (12) having a shielding plate (10), wherein the electrical machine (12) comprises a housing part (32) in which is arranged an electronic unit (14), and said electrical machine also comprises a metal heat sink (34) that is arranged on the housing part (32), wherein the electronic unit (14) is arranged between the shielding plate (10) and the heat sink (34).

Abstract: A hold down for an electronic device is provided that includes a bottom frame, a circuit board mounted above the bottom frame, a thermal pad mounted on the circuit board, and a heat sink associated with the thermal pad. The hold down includes a frame that defines a perimeter having a plurality of retainers that are configured to engage with a plurality of mating locations defined on at least a bottom frame to provide a biasing force that retains the heat sink against a circuit board that is positioned between the bottom frame and the hold down.

Abstract: A rack in which a single or plurality of blade servers are installed includes: a fixing portion that detachably fixes the blade server; and a pipe with which cooling fluid supplied from outside the rack is passed through inside the rack and then introduced outside the rack, the pipe being thermally connected, in a state where the blade server is fixed by the fixing portion, to a heat transfer block thermally connected to at least one heat source included in the blade server.

Abstract: An embodiment of an electronic system includes a printed circuit board (PCB) including fluid flow channel extending through the PCB. In addition, the electronic system includes an electronic component including a bottom surface and positioned on the PCB over the fluid flow channel to thereby expose the bottom surface of the electronic component to fluid flow through the fluid flow channel.

Abstract: Methods and systems for controlling and limiting the damage caused by arcs in electrical distribution equipment provide a cooling assembly that uses a filter or other porous substrate to absorb the energy from the arc byproducts. The filter-based cooling assembly may be used with a passive arc management device having a chamber sized and shaped to control and/or extinguish arcs and ventilation ports for expelling the arc byproducts into the cooling filter assembly. The filter-based cooling assembly may be installed in line with, at the end of, or as a substitute for, any ventilation conduits or tubes in the arc management device, or in the backplane of the arc management device, or the like, to absorb energy from the arc byproducts, cool them to a safe temperature, and vent them inside the equipment cabinet.

Abstract: An enclosure is presented. The enclosure includes an outer casing having one or more walls. Further, the enclosure includes a synthetic jet assembly configured to dissipate heat from the one or more walls, where the synthetic jet assembly includes a bracket operatively coupled to the one or more walls of the outer casing and two or more synthetic jets operatively coupled to the bracket, where the two or more synthetic jets are arranged in a multi-dimensional array.

Abstract: A gas-insulated switchgear bay includes at least three circuit breakers, which define a longitudinal direction, for interrupting conductor phases at different electrical potentials. The circuit breakers each have a first and second power connection, which define a first and second axis extending orthogonally to the longitudinal direction. A first busbar section is attachable to the first power connection, and the first busbar conductors thereof, each define a third axis, which extends orthogonally to the longitudinal direction and the first axis. A second busbar section is attachable to the second power connection, and the second busbar conductors thereof, each define a fourth axis, which extends orthogonally to the longitudinal direction and the first axis. A first distance between the first and second axes is such that the fourth axis is arranged with respect to position and orientation on a common straight line with the third axis in the second mounting state.

Abstract: Example implementations relate to rack mountable power distribution units (PDUs). For example, a PDU includes a plurality of receptacles to couple to power cords of a plurality of computing devices, where each receptacle includes a retention mechanism to hold the power cords in the receptacles. The PDU includes a first set of mounting holes and a second set of mounting holes on either side of the PDU, where the first and second set of mounting holes are to receive a plurality of mounting buttons to mount the PDU to a rack.

Abstract: An LC module for installation in a housing of a motor vehicle control device, a method for producing an LC module and a corresponding motor vehicle control device having an LC module. The LC module has a support plate, at least one electrolytic capacitor and a coil. The electrolytic capacitor and the coil are disposed in chambers of the LC module and are at least partially surrounded by casting compound. Furthermore, the support plate has a connecting part between the two chambers, the support plate being form-fittingly or frictionally connectable to the housing of the control device at least in the region of the connecting part.