Abstract: Semiconductor device and the manufacturing method thereof are disclosed. An exemplary semiconductor device comprises a fin substrate having a first dopant concentration; an anti-punch through (APT) layer disposed over the fin substrate, wherein the APT layer has a second dopant concentration that is greater than the first dopant concentration; a nanostructure including semiconductor layers disposed over the APT layer; a gate structure disposed over the nanostructure and wrapping each of the semiconductor layers, wherein the gate structure includes a gate dielectric and a gate electrode; a first epitaxial source/drain (S/D) feature and a second epitaxial S/D feature disposed over the APT layer, wherein the gate structure is disposed between the first epitaxial S/D feature and the second epitaxial S/D feature; and an isolation layer disposed between the APT layer and the fin substrate, wherein a material of the isolation layer is the same as a material of the gate dielectric.

Abstract: A magnetic cell core includes a seed region with a plurality of magnetic regions and a plurality of nonmagnetic regions thereover. The seed region provides a template that enables formation of an overlying nonmagnetic region with a microstructure that enables formation of an overlying free region with a desired crystal structure. The free region is disposed between two nonmagnetic regions, which may both be configured to induce surface/interface magnetic anisotropy. The structure is therefore configured to have a high magnetic anisotropy strength, a high energy barrier ratio, high tunnel magnetoresistance, a low programming current, low cell-to-cell electrical resistance variation, and low cell-to-cell variation in magnetic properties. Methods of fabrication, memory arrays, memory systems, and electronic systems are also disclosed.

Abstract: A light emitting display apparatus includes a substrate, a passivation layer disposed over the substrate, a light emitting device layer including a light emitting layer disposed over the passivation layer, a non-emission pattern portion including a light emitting material pattern disposed over the passivation layer at a periphery portion of the substrate and electrically isolated from the light emitting layer, and an encapsulation layer disposed over the light emitting device layer and the non-emission pattern portion. The encapsulation layer may wholly surround the non-emission pattern portion and seals an interface between the non-emission pattern portion and the passivation layer.

Abstract: A display substrate has a display area and a peripheral area. The display substrate includes a base substrate; an insulating layer on the base substrate and in at least the peripheral area; a plurality of light emitting elements on the base substrate and in the display area; an encapsulating layer on a side of the plurality of light emitting elements distal to the base substrate to encapsulate the plurality of light emitting elements; and a dam layer on a side of the insulating layer distal to the base substrate. The encapsulating layer includes a first inorganic encapsulating sublayer extending from the display area into the peripheral area. The display substrate has a groove extending into the first insulating layer in the peripheral area, and substantially surrounding the display area. The first inorganic encapsulating sublayer extends into at least a portion of the groove.

Abstract: A semiconductor device according to an embodiment includes a first gate-all-around (GAA) transistor and a second GAA transistor. The first GAA transistor includes a first plurality of channel members, a first interfacial layer over the first plurality of channel members, a first hafnium-containing dielectric layer over the first interfacial layer, and a metal gate electrode layer over the first hafnium-containing dielectric layer. The second GAA transistor includes a second plurality of channel members, a second interfacial layer over the second plurality of channel members, a second hafnium-containing dielectric layer over the second interfacial layer, and the metal gate electrode layer over the second hafnium-containing dielectric layer. A first thickness of the first interfacial layer is greater than a second thickness of the second interfacial layer. A third thickness of the first hafnium-containing dielectric layer is smaller than a fourth thickness of the second hafnium-containing dielectric layer.

Abstract: According to one embodiment, a display device includes a base, a first insulating layer, first and second lower electrodes, a second insulating layer including a first opening, a second opening, and a first trench, an organic layer including a light-emitting layer and an upper electrode, and the first trench includes a bottom surface and first and second side surfaces, an interval between the first side surface and the second side surface in an upper portion of the first trench is smaller than that in the bottom surface, and the organic layer includes a first portion covering the first lower electrode, a second portion covering the second lower electrode and a third portion disposed on the bottom surface.

Abstract: Embodiments described herein generally relate to sub-pixel circuits that may be utilized in a display such as an organic light-emitting diode (OLED) display. The device includes substrate, pixel-defining layer (PDL) structures disposed over the section of the substrate, inorganic or metal overhang structures disposed on an upper surface of the PDL structures, and a plurality of sub-pixels. The PDL structures include a trench disposed in the top surface of the PDL structure. Each sub-pixel includes an anode, an OLED material disposed over and in contact with the anode, and a cathode disposed over the OLED material. The inorganic or metal overhang structures have an overhang extension that extends laterally over the trench. An encapsulation layer is disposed over the cathode and extends under at least a portion of the inorganic or metal overhang structures and along a top surface of the PDL structures.

Abstract: Embodiments relate to a method for fabricating a semiconductor structure, a semiconductor structure, and a peripheral circuit. The method for fabricating a semiconductor structure includes: providing a substrate; forming a gate initial structure and a residue on the substrate; and removing the residue by means of a first cleaning liquid. The first cleaning liquid is capable of inhibiting the residue from undergoing a hydrolysis reaction.

Abstract: A display panel includes an emitting part including a light emitting element and a transmitting part adjacent to the emitting part and including a low adhesion part including a carbon compound. The low adhesion pattern includes fluorine (F).

Abstract: A method of patterning quantum dot layer includes: forming, on a substrate, a film layer including a photosensitive material and quantum dots with ligands on surfaces of the quantum dots; irradiating a quantum dot reserved area with light of a preset wavelength; where under irradiation with light of the preset wavelength, the photosensitive material or a product of the photosensitive material after light irradiation reacts with the ligands on the surfaces of the quantum dots, to allow the ligands to fall off from the surfaces of the quantum dots, so that solubility of the quantum dots is changed to cause the quantum dots to undergo coagulation; and removing a portion of the film layer which is not irradiated by the light of the preset wavelength, to form a patterned quantum dot portion of the quantum dot layer in the quantum dot reserved area.

Abstract: A semiconductor device includes a substrate, a plurality of bit lines, a plurality of contacts, a plurality of storage node pads, a capacitor structure and a plurality of first interface layers. The bit lines and the contacts are disposed on the substrate, and the contacts are alternately and separately disposed with the bit lines. The storage node pads are disposed on the contacts and the bit lines, and are respectively aligned with the contacts. The capacitor structure is disposed on the storage node pads. The first interface layers are disposed between the storage node pads and the capacitor structure, and the first interface layers include a metal nitride material. The first interface layers may improve the granular size of the storage node pads, and reduce the surface roughness thereof, and further improve the electrical connection between the storage nodes and transistor components below.

Abstract: A conductive plate includes a first slit formed in the space between a first chip area and a second chip area, a second slit formed in the space between the first chip area and a terminal area, and a third slit formed in the space between the second chip area and the terminal area. The first slit is a continuous line that penetrates through the conductive plate, whereas the second and third slits are continuous lines that do not penetrate through the conductive plate.

Abstract: The present disclosure provides a light-emitting module and a display apparatus thereof. The light-emitting module includes a circuit substrate which includes a first surface and a second surface opposite to the first surface. The first surface includes a plurality of conductive channels, and the second surface includes a plurality of conductive pads. A plurality of light-emitting groups is arranged in a matrix on the first surface. Each of the light-emitting groups includes a red light-emitting diode chip, a green light-emitting diode chip, and a blue light-emitting diode chip. An electric component is disposed on the first surface and located in the light-emitting groups matrix. A translucent encapsulating component covers the plurality of light-emitting groups and the electric component. Wherein, the light-emitting groups matrix comprises m columns and n rows.

Abstract: A method for manufacturing a biological field-effect transistor (BioFET) is disclosed. In some implementations, the method may include preparing a carbonaceous dispersion by adding a three-dimensional (3D) graphene into a solvent; depositing the carbonaceous dispersion onto a p-type silicon wafer; spin-coating a positive photoresist over the carbonaceous dispersion; forming source and drain terminals on the p-type silicon wafer, the source and drain terminals in contact with the 3D graphene of the carbonaceous dispersion; removing residual photoresist from the carbonaceous dispersion by placing the p-type silicon wafer in 1-methyl-2-pyrrolidone (NMP); and biofunctionalizing the carbonaceous dispersion with a molecular recognition element configured to alter one or more electrical properties of the Bio-FET in response to exposure of the molecular recognition element to the analyte.

Abstract: A display substrate having a display area is provided. The display substrate includes a base and a plurality of light-emitting devices disposed on the base and located in the display area. Each light-emitting device includes a light-emitting portion. In at least one light-emitting device, the light-emitting portion is manufactured using an ink-jet printing process. Distances from a plurality of selected points on an edge of an orthographic projection of the light-emitting portion manufactured using the ink-jet printing process on the base to a center of the orthographic projection are equal. Using the center of the orthographic projection as a center of a circle and a distance from a selected point in the plurality of selected points to the center of the orthographic projection as a radius, the plurality of selected points are distributed on the circle at equal intervals.

Abstract: Embodiments of a display device are described. A display device includes first and second sub-pixels. The first sub-pixel includes a first light source having a multi-layer stack and a first substrate configured to support the first light source. The multi-layer stack includes an organic phosphor film or a quantum dot (QD) based phosphor film configured to emit a first light having a first peak wavelength. The first substrate includes a first control circuitry configured to independently control the first light source. The second sub-pixel includes a second light source and a second substrate configured to support the second light source. The second light source has a microLED or a miniLED configured to emit a second light having a second peak wavelength that is different from the first peak wavelength. The second peak wavelength can be in the blue wavelength region of the visible spectrum. The second substrate includes a second control circuitry configured to independently control the second light source.

Abstract: [Object] It is possible to further improve reliability. [Solution] There is provided a display device including: a pixel unit which is configured with a plurality of pixel circuits arranged in a matrix, each of the pixel circuits including a light emitting element and a driving circuit for driving the light emitting element; scanning lines which are interconnections connected to the respective pixel circuits and are provided to extend in a first direction and correspond to respective rows of a plurality of the pixel circuits; and signal lines which are interconnections connected to the respective pixel circuits and are provided to extend in a second direction orthogonal to the first direction and correspond to respective columns of a plurality of the pixel circuits. One of the scanning lines and the signal lines, provided for the one pixel circuit, which is larger in number is positioned in a lower-level interconnection layer.

Abstract: This application provides a semiconductor structure and substrate thereof, a method of manufacturing the semiconductor structure and substrate thereof. The substrate includes a plurality of unit areas, each of the unit areas includes at least two subunit areas, each of the subunit areas is provided with a groove, the groove is opened from a back side of the substrate; and in one of the unit areas, preset opening ratios of the subunit areas are different. A light-emitting layer is grown on a front side of the substrate; and in one of the unit areas, light-emitting wavelengths of the light-emitting layer in the subunit areas are different.

Abstract: The present invention discloses an array substrate, a manufacturing method thereof, and a display device thereof. The array substrate includes a substrate; a plurality of first thin film transistors, the first thin film transistors including a first gate electrode layer and a second gate electrode layer; a plurality of second thin film transistors, the second thin film transistors including a third gate electrode layer; and a gate electrode insulation layer disposed between the first gate electrode layer and the second gate electrode layer, and the third gate electrode layer located near a surface of a side of the substrate. The gate electrode insulation layer is silicon nitride material.

Abstract: A semiconductor laminate film includes a silicon substrate and a semiconductor layer formed on the silicon substrate and containing silicon and germanium. The semiconductor layer having a surface roughness Rms of 1 nm or less. Further, the semiconductor layer satisfies the following relationship t?0.881×x?4.79 where t represents a thickness (nm) of the semiconductor layer, and x represents a ratio of the number of germanium atoms to a sum of the number of silicon atoms and the number of germanium atoms in the semiconductor layer. Also, the semiconductor layer being a mixed crystal semiconductor layer containing silicon and germanium.