Abstract: An in-contact temperature measurement probe, which can measure temperature accurately on the surface of a current carrying wire, rod, heater, or other device, while maintaining the safety of the user via employing non-electrically conductive but thermally conductive materials.

Abstract: An electronic device housing encloses a temperature sensing system including a temperature sensor and a differential temperature probe. The differential temperature probe includes a flexible substrate defining two ends. A first end is thermally coupled to the temperature sensor and a second end is thermally coupled to a surface, volume, or component of the electronic device. The temperature probe is an in-plane thermopile including a series-coupled set of thermocouples extending from the first end to the second end. A temperature measured at the temperature sensor can be a first measured temperature and a voltage difference across leads of the differential temperature probe can be correlated to a differential temperature relative to the first measured temperature. A sum of the differential temperature and the first measured temperature is a second measured temperature, quantifying a temperature of the second end of the differential temperature probe.

Abstract: A contactless inspection apparatus of a heat pipe and a method thereof are provided. The disclosure controls an infrared heating module to heat a heat pipe to be inspected based on a heating parameter, and controls an infrared temperature measurement module to collect a measurement temperature data of the heat pipe. The disclosure monitors a temperature slope of the measurement temperature data during a heating procedure, calculates a score based on the temperature slope when the temperature slope is converged to a stop slope, and determines a quality of the heat pipe based on the score. The disclosure may inspect a conductive quality of the heat pipe.

Abstract: Embodiments include a temperature sensing device that includes a temperature sensor stack that includes a flexible substrate and an array of temperature sensors coupled to the flexible substrate. Each temperature sensor in the array of temperature sensors can include a conductive material defining a continuous pattern extending from a first node to a second node, a first set of conductive traces coupled to the flexible substrate, and a second set of conductive traces coupled to the flexible substrate. The temperature sensing device can include a processing circuit configured to apply an electrical signal across the conductive material of each temperature sensor using the first set of conductive traces, detect an effect of the conductive material of each temperature sensor on the electrical signal using the second set of conductive traces, and determine a temperature for the temperature sensors in the array using the detected effects of the conductive material on the electrical signal.

Abstract: Methods, systems and devices of the present disclosure involve techniques for cancelling base resistance error otherwise present in remote temperature sensors such as remote diode temperature sensors. In one or more embodiments, measurement logic configured to determine a temperature of or near a remote temperature sensor may be configured to determine an error cancelling coefficient and to calculate a temperature value, at least in part, responsive to the error cancelling coefficient. In some cases, error cancelling coefficients may be determined using one or more calibration techniques.

Abstract: A temperature sensor detects temperatures of at least two distribution lines and includes a temperature detection unit and a protection member that covers the temperature detection unit. The protection member is provided with a first abutting surface that has a concave shape corresponding to an outer shape of a first distribution line and is in contact with the first distribution line and a second abutting surface that has a concave shape corresponding to an outer shape of a second distribution line and is in contact with the second distribution line.

Abstract: In order to enable the measurement of thermal property information about a subject, this thermal diffusion coefficient measuring device, which is used by contacting the surface of a living body, is provided with: a biological information sensor comprising a temperature sensor and a heat flux sensor; and a heating/cooling control means. The temperature sensor is provided at a position contacting the surface of the living body, and operates so as to detect skin temperature. The heat flux sensor is provided at a position contacting the surface of the living body, while being adjacent to the temperature sensor, and operates so as to detect heat flux on the surface of the living body. The heating/cooling control means enables the measurement of the temperature diffusion coefficient of a thermal resistance component that is present between the biological information sensor and a deep inner portion of the living body.

Abstract: A temperature sensor for accurately measuring a temperature, such as that of a fluid where the temperature is changing, can include a housing with an exterior surface extending between a first end and a second end. The temperature sensor housing can include a set of exterior grooves, which provides for coupling a set of temperature sensor probes along the exterior of the housing with a probe extending at the first end. Additionally, a set of recesses can be formed in the first end for positioning the probes within the recesses. Furthermore, the interior of the housing can be hollow, with a second type of probe extending through the interior between the first end and the second end.

Abstract: A temperature sensing assembly includes a sheath defining an interior space, a first temperature sensor and a second temperature sensor. The first temperature sensor has first and second conductors extending within the interior space of the sheath and joined at a first junction point. The first conductor is constructed of a first material and the second conductor is constructed of a second material that is different than the second material. The second temperature sensor has third and fourth conductors extending within the interior space of the sheath and joined at a second junction point. The third conductor is constructed of a third material and the fourth conductor is constructed of a fourth material that is different than the fourth material. The first material is different than each of the third and fourth materials. The first junction point is adjacent to the second junction point.

Abstract: A measurement mechanism having a body, a vacuum chamber that is located on the body and in which a measurement process is performed is disclosed. A first sample and a second sample between which a heat transfer occurs are placed in the vacuum chamber and contact each other. A piston that provides the first sample and the second sample to continuously contact each other, a main heater that is located above the first sample and the second sample, and a cooler located below the first sample and the second sample is also disclosed.

Abstract: A thermistor sensor arrangement for measuring chipset temperature is provided. According to various aspects of the present disclosure, a sensor assembly is placed between a heat sink of a chipset and a PCB on which the chipset is mounted. The sensor assembly includes a thermistor sensor, an electrical connector, and a resilient pad. The thermistor sensor includes a first end having a sensing element and a second end having sensor contacts. The electrical connector has a first interface to receive the sensor contacts, a second interface through which the signals are outputted, and a bottom surface to mount to the PCB. The resilient pad has an upper surface to which the sensing element is attached and a lower surface to engage with the PCB such that when the resilient pad is compressed, spring force of the resilient pad facilitates temperature measurement by pressing the sensing element against the heat sink.

Abstract: An improvement to bimetallic pipe thermometers utilizing insulating tubular seats. The present invention improves the insulating tubular seat by closing off the tail slot along a proximal end thereof with a bridge or stop. Going forward, users of such bimetallic pipe thermometers no longer need worry about the tail of the bimetallic coil sensor unintentionally slipping out of what is currently an opened-ended tail slot.

Abstract: A phosphor thermometry device includes a laser that generates a laser pulse onto a thermal barrier coating (TBC) applied onto a substrate. A metallic bond coat layer is on the substrate. A ceramic top coat layer is on the bond coat layer and includes an undoped layer and a doped sensing layer having co-doped first and second rare-earth luminescent dopants that emit respective first and second different emission wavelengths upon excitation by the laser pulse. A detector receives reflected, convoluted luminescence signals from the TBC. First and second photomultiplier devices detect respective first and second different emission wavelengths of the convoluted luminescence signals. A controller receives and processes signals generated from respective first and second photomultiplier devices and determines luminescence lifetime decay and intensity variations for each of the respective first and second rare-earth luminescent dopants for temperature monitoring of the TBC.

Abstract: An apparatus and a method for determining the thermal conductivity of a fluid specimen are provided. The apparatus and the method include determining thermal conductivity using a quasi-steady state variable gap axial flow technique. The fluid specimen is heated on one side by a heat source with a known power output and cooled on the other side. After reaching steady state, a resulting temperature drop through the fluid specimen exists. This temperature drop, the known fluid specimen thickness (or gap distance), and the known power output are used to calculate the thermal resistance of the fluid specimen. The thermal conductivity of the fluid specimen is then determined using a curve fit of thermal resistance with respect to gap distance.

Abstract: A mechanism for thermal testing is described. A test vehicle includes a heating element, a thermal sensor and a processor. The processor is configured to control the heating element to output an amount of the energy per unit time. Temperature readings are received using the thermal sensor. A thermal property associated with a thermal mass is determined based at least in part the amount of the energy output and the received temperature readings.

Abstract: A reactor temperature measurement system includes a Fiber Bragg Grating sensor array arranged in a body of the reactor for monitoring temperatures at multiple positions in an axial direction of the body to obtain temperature sensing optical signals; and a fiber grating demodulator, connected to the Fiber Bragg Grating sensor array, and used to demodulate the temperature sensing optical signals. A method for preparing a Fiber Bragg Grating includes preparing a Fiber Bragg Grating by using a single-mode fiber and annealing the Fiber Bragg Grating, which includes heating the Fiber Bragg Grating to a temperature above 400° C. and maintaining for 100 to 200 hours.

Abstract: A deep body thermometer that includes a body temperature measurement unit having a thermal resistor layer formed of a thermal resistor having a predetermined thermal resistance value, four temperature sensors arranged in a thickness direction of the thermal resistor layer, and a wiring substrate on which a processing circuit for processing an output signal of each of the four temperature sensors is mounted. Moreover, the thermometer includes an upper exterior body made of a foamed material of a closed cell or a semi-closed cell having a waterproof property to accommodate the body temperature measurement unit, and a lower exterior body formed of a non-foamed resin film having a waterproof property, in which peripheral edge portions of the upper exterior body and the lower exterior body are fixed in a close contact manner.

Abstract: A method for measuring thermal resistance between a thermal component of an instrument and a consumable includes contacting a known consumable with a thermal component to be tested; driving the thermal component using a periodic sine wave input based on a predetermined interrogation frequency; measuring temperature outputs from a thermal sensor responsive to the periodic sine wave input; multiplying the temperature outputs by a reference signal in phase with the periodic sine wave input and calculating the resultant DC signal component to determine an in-phase component X; multiplying the plurality of temperature outputs by a 90° phase-shifted reference signal and calculating the resultant DC signal component to determine a quadrature, out-of-phase component Y; calculating a phase offset responsive to the periodic sine wave input based on tan?1 (Y/X) or atan2(X, Y); and determining a resistance value for the thermal interface using a calibrated resistance-phase offset equation and the calculated phase offset.

Abstract: A sensor device for determining at least one heat transfer parameter of a gas comprises a sensor unit (10) comprising at least one heater element and at least one temperature sensor. A first (inner) housing (20) receives the sensor unit. The first housing comprises a first membrane (22) allowing a diffusive gas exchange between the exterior and the interior of the first housing. The first housing is received in a second (outer) housing (30). The second housing comprises a second membrane (32) allowing a diffusive gas exchange between the exterior of the second housing and the exterior of the first housing. Thereby temperature gradients inside the first housing are reduced. The second housing can be made of metal and can be disposed on a support plate (40), taking the form of a cap. An auxiliary sensor (50) can be arranged in the space between the first and second housings.

Abstract: A system includes a measurement instrument including a first connector, a control module, and a display. A temperature probe includes a shaft and a tip. A second connector is coupled to a first end of the shaft. The tip is coupled to a second end of the shaft and measures a change in temperature of a sample. The second connector is received by the first connector when the temperature probe is attached to the measurement instrument. A storage module is housed within the second connector and stores parameters of the temperature probe. The control module receives the parameters, prompts a user to select the sample on the display, and determines a thermal conductivity and a stable time of the sample. When the stable time has elapsed, the control module determines a temperature measurement based on a change in voltage and displays the temperature measurement on the display.