Patents Examined by Mirza Israr Javed
  • Patent number: 10532441
    Abstract: A flexible membrane for a carrier head of a chemical mechanical polisher includes a main portion, an annular outer portion, and three annular flaps. The main portion has a substrate mounting surface with a radius R. The annular outer portion extends upwardly from an outer edge of the main portion and has a lower edge connected to the main portion and an upper edge. The three annular flaps include a first annular flap joined to an inner surface of the main portion at a radial position between 75% and 95% of R, a second inwardly-extending annular flap joined to the annular outer portion at a position between the lower edge and the upper edge, and a third inwardly-extending annular flap joined to the upper edge of the annular outer portion.
    Type: Grant
    Filed: November 12, 2013
    Date of Patent: January 14, 2020
    Assignee: Applied Materials, Inc.
    Inventors: Jeonghoon Oh, Jamie Leighton
  • Patent number: 10537013
    Abstract: Embodiments of the invention include an apparatus, system, and method for cooling a pedestal for supporting a workpiece during plasma processing. An embodiment of a pedestal includes: a base over which the workpiece is to be disposed, a plurality of nozzles to supply a fluid from a supply plenum to impinge on a surface of the base, and a plurality of return conduits to return the supplied fluid to a return plenum. The fluid to be supplied by the plurality of nozzles can be projected as one or more jets submerged in surrounding fluid or as a spray that emerges from a surrounding fluid within a volume between the plurality of nozzles and the base to impinge on the surface of the base.
    Type: Grant
    Filed: April 15, 2013
    Date of Patent: January 14, 2020
    Assignee: Applied Materials, Inc.
    Inventors: Fernando Silveira, Richard Fovell, Hamid Tavassoli
  • Patent number: 10535501
    Abstract: A film forming apparatus includes a first supply unit configured to supply a first reaction gas into the reaction vessel under an environment of a first pressure, a second supply unit configured to supply a second reaction gas into the reaction vessel under an environment of a second pressure lower than the first pressure, a first vacuum exhaust mechanism connected to the reaction vessel through a first exhaust path in order to create the environment of the first pressure within the reaction vessel, a second vacuum exhaust mechanism connected to the reaction vessel through a second exhaust path in order to create the environment of the second pressure, the second vacuum exhaust mechanism being lower in an operation pressure zone than the first vacuum exhaust mechanism, and a switching unit configured to switch exhaust destinations of the reaction vessel between the first path and the second path.
    Type: Grant
    Filed: May 29, 2014
    Date of Patent: January 14, 2020
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Yamato Tonegawa, Katsutoshi Ishii
  • Patent number: 10525430
    Abstract: A granular fluidized bed reactor (FBR) for production of high purity silicon is described. The FBR uses a draft tube to promote internal circulation while minimizing voids in the fluidized bed, one significant cause of dust formation. The FBR design has geometries to minimize reactive gas concentration within the draft tube and imposes a desirable circulation pattern in operation. A portion of the FBR wall above a reactive zone provides heat input to maximize deposition on silicon beads while minimizing wall deposition. The FBR is made of carbon composite, ceramic, and graphite materials in a design to minimize contamination and enable silicon deposits to be melted out.
    Type: Grant
    Filed: December 29, 2014
    Date of Patent: January 7, 2020
    Inventor: Bruce Hazeltine
  • Patent number: 10529542
    Abstract: Gas-phase reactors and systems are disclosed. Exemplary reactors include a reaction chamber having a tapered height. Tapering the height of the reactor is thought to reduce a pressure drop along the flow of gasses through the reactor. Exemplary reactors can also include a spacer within a gap to control a flow of gas between a region and a reaction chamber.
    Type: Grant
    Filed: March 11, 2015
    Date of Patent: January 7, 2020
    Assignee: ASM IP Holdings B.V.
    Inventors: Carl Louis White, Eric James Shero, Mohith Verghese
  • Patent number: 10513777
    Abstract: A processing chamber accommodating a mounting table includes a first region and a second region. As the mounting table rotates, a substrate mounting region of the mounting table moves in a circumferential direction around the axis to pass through the first region and the second region. A first gas supply unit supplies a precursor gas to the first region from an injection unit disposed to face the mounting table. An exhaust outlet exhausts an exhaust port formed to extend along a closed path surrounding the exhaust outlet. A second gas supply unit supplies purge gas from an injection port formed to extend along a closed path surrounding the exhaust port. A plasma generation unit generates plasma from a reaction gas in the second region. An angular range of the second region is larger than an angular range of the first region.
    Type: Grant
    Filed: February 12, 2013
    Date of Patent: December 24, 2019
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Masahide Iwasaki, Satoshi Yonekura, Toshihiko Iwao
  • Patent number: 10515783
    Abstract: A charge volume configuration for use in delivery of gas to a reactor for processing semiconductor wafers is provided. A charge volume includes a chamber that extends between a proximal end and a distal end. A base connected to the proximal end of the chamber, and the base includes an inlet port and an outlet port. A tube is disposed within the chamber. The tube has a tube diameter that is less than a chamber diameter. The tube has a connection end coupled to the inlet port at the proximal end of the chamber and an output end disposed at the distal end of the chamber.
    Type: Grant
    Filed: February 23, 2016
    Date of Patent: December 24, 2019
    Assignee: Lam Research Corporation
    Inventor: Karl Leeser
  • Patent number: 10508343
    Abstract: An etching method includes: applying a radiation to an etching aqueous solution; and etching a material to be etched by using the etching aqueous solution irradiated with the radiation.
    Type: Grant
    Filed: December 5, 2013
    Date of Patent: December 17, 2019
    Assignee: FUJITSU LIMITED
    Inventor: Shirou Ozaki
  • Patent number: 10512125
    Abstract: Provided is a mounting table according to one aspect of the present disclosure includes: a ceramic body; a heater provided in the ceramic body; a base including a support surface that supports the ceramic body and provides a space for accommodating a temperature sensor as a space that is opened at least at the support surface side; and a heat transfer body extending between a first end provided in the ceramic body and a second end that is positioned above the space and provided closer to the space than the first end, the heat transfer body having a heat conductivity that is higher than that of the ceramic body around the heat transfer body.
    Type: Grant
    Filed: December 21, 2015
    Date of Patent: December 17, 2019
    Assignee: TOKYO ELECTRON LIMITED
    Inventor: Dai Kitagawa
  • Patent number: 10504753
    Abstract: A brush cleaning apparatus includes a wafer support configured to support a wafer, and at least one cleaning brush moveable relative to the wafer support. The at least one cleaning brush has opposite first and second sides, and, on the first side, a planar cleaning surface configured to come into contact with the wafer supported by the wafer support to remove contaminants from the wafer.
    Type: Grant
    Filed: December 13, 2013
    Date of Patent: December 10, 2019
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chang-Sheng Lin, Hsin-Hsien Lu
  • Patent number: 10497606
    Abstract: A method and apparatus for a pedestal is provided. In one embodiment, the pedestal includes a body comprising a ceramic material having a flange, one or more heating elements embedded in the body, a first shaft coupled to the flange, and a second shaft coupled to the first shaft; wherein the second shaft includes a plurality of fluid channels formed therein that terminate in the second shaft.
    Type: Grant
    Filed: January 28, 2016
    Date of Patent: December 3, 2019
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Xing Lin, Jianhua Zhou, Juan Carlos Rocha-Alvarez, Ramprakash Sankarakrishnan
  • Patent number: 10486183
    Abstract: Methods and apparatus for delivering process gases to a substrate are provided herein. In some embodiments, an apparatus for processing a substrate may include a gas distribution conduit disposed in a processing volume of a process chamber above a substrate support to distribute a process gas to a processing surface of the substrate when disposed on the substrate support; and an actuator coupled to the gas distribution conduit to move the gas distribution conduit with respect to the substrate support. In some embodiments, a method of processing a substrate may include introducing a process gas to a process chamber through a gas distribution conduit disposed above a substrate having a processing surface; and moving the gas distribution conduit within the process chamber and with respect to the substrate to distribute the process gas across the processing surface of the substrate.
    Type: Grant
    Filed: July 11, 2013
    Date of Patent: November 26, 2019
    Assignee: APPLIED MATERIALS, INC.
    Inventor: Joseph M. Ranish
  • Patent number: 10487401
    Abstract: A PECVD chamber is disclosed with a temperature controlled gas distribution showerhead. The gas distribution showerhead is temperature controlled heated by circulating a g fluid through conduit formed within or coupled to the gas distribution showerhead. The PECVD chamber comprises a gas distribution showerhead, a backing plate coupled to the gas distribution showerhead, the backing plate having a bottom surface facing and substantially parallel with and spaced from an upper surface of the gas distribution showerhead; and a temperature controlling device coupled to the gas distribution showerhead and disposed between the backing plate and the gas distribution showerhead.
    Type: Grant
    Filed: September 27, 2016
    Date of Patent: November 26, 2019
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Shinichi Kurita, Robin L. Tiner
  • Patent number: 10480077
    Abstract: Methods and apparatus for forming thin films are described. A semiconductor processing chamber includes a substrate support, an electrode opposite the substrate support, the electrode having a gas inlet in a peripheral region thereof, and an edge ring disposed around a peripheral region of the substrate support, the edge ring having a first barrier and a second barrier, wherein each of the first barrier and the second barrier mates with a recess in the electrode. The edge ring provides a gas flow path through a processing zone between the substrate support and the electrode that is substantially parallel to the upper surface of the substrate support. The electrode may be powered to enhance formation of a film on a substrate.
    Type: Grant
    Filed: February 21, 2014
    Date of Patent: November 19, 2019
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Dale R. Du Bois, Jianhua Zhou, Juan Carlos Rocha-Alvarez
  • Patent number: 10443117
    Abstract: A plasma nitriding apparatus includes: a surface treatment unit which includes a treatment tank to house part of a treatment object inclusive of a surface treatment region, and performs a nitriding treatment on the surface treatment region inside of the treatment tank by using plasma of a treatment gas; and an outer container which receives supply of the treatment gas, and houses the treatment object and the treatment tank so that a region of the treatment object other than the part is exposed from the treatment tank.
    Type: Grant
    Filed: June 3, 2016
    Date of Patent: October 15, 2019
    Assignee: IHI Corporation
    Inventors: Norimitsu Kameya, Kenji Fuchigami
  • Patent number: 10446710
    Abstract: An ion implanter and method for facilitating expeditious performance of maintenance on a component of the ion implanter in a manner that reduces downtime while increasing throughput of the ion implanter. The ion implanter includes a process chamber, a transfer chamber connected to the process chamber, a first isolation gate configured to controllably seal the transfer chamber from the process chamber, and a second isolation gate configured to controllably seal the transfer chamber from an atmospheric environment, wherein a component of the ion implanter can be transferred between the process chamber and the transfer chamber for performing maintenance on the component outside of the process chamber. Performing maintenance on a component of the ion implanter includes the steps of transferring the component from the process chamber to the transfer chamber, sealing the transfer chamber, venting the transfer chamber to atmospheric pressure, an opening the transfer chamber to an atmospheric environment.
    Type: Grant
    Filed: December 10, 2013
    Date of Patent: October 15, 2019
    Assignee: Varian Semiconductor Equipment Associates, Inc.
    Inventors: Aaron P. Webb, Charles T. Carlson, Paul Forderhase, William T. Weaver, Robert Brent Vopat
  • Patent number: 10435786
    Abstract: Alignment systems employing actuators provide relative displacement between lid assemblies of process chambers and substrates, and related methods are disclosed. A process chamber includes chamber walls defining a process volume in which a substrate may be placed and the walls support a lid assembly of the process chamber. The lid assembly contains at least one of an energy source and a process gas dispenser. Moreover, an alignment system may include at least one each of a bracket, an interface member, and an actuator. By attaching the bracket to the chamber wall and securing the interface member to the lid assembly, the actuator may communicate with the bracket and the interface member to provide relative displacement between the chamber wall and the lid assembly. In this manner, the lid assembly may be positioned relative to the substrate to improve process uniformity across the substrate within the process chamber.
    Type: Grant
    Filed: October 23, 2014
    Date of Patent: October 8, 2019
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Danny D. Wang, Jun Tae Choi, Rupankar Choudhury, Zhong Qiang Hua, Juan Carlos Rocha-Alvarez, Jason Michael Lamb
  • Patent number: 10418258
    Abstract: A temperature of only a part in a surface of a mounting table can be set to be higher than or lower than a set temperature of an entire surface of the mounting table. A main flow path 320 formed within the mounting table 200 to be arranged over the entire surface thereof; an auxiliary flow path 330 formed within the mounting table to be arranged in a part of the surface thereof; and a temperature control medium circulating unit that supplies and circulates a temperature control medium adjusted to have a set temperature into and through the main flow path, allows the temperature control medium to be branched, and supplies and circulates the branched temperature control medium into and through the auxiliary flow path after adjusting a temperature of the branched temperature control medium to be a temperature higher than or lower than the set temperature are provided.
    Type: Grant
    Filed: July 19, 2012
    Date of Patent: September 17, 2019
    Assignee: TOKYO ELECTRON LIMITED
    Inventor: Ryo Nonaka
  • Patent number: 10401285
    Abstract: The present invention relates to an apparatus for measuring surface properties of a polishing pad which measures surface properties such as surface topography or surface condition of a polishing pad used for polishing a substrate such as a semiconductor wafer. The apparatus for measuring surface properties of a polishing pad includes a laser beam source configured to emit a laser beam, and a photodetector configured to detect scattered light that is reflected and scattered by the polishing pad, an optical Fourier transform being performed on the detected scattered light to produce an intensity distribution corresponding to a spatial wavelength spectrum based on surface topography of the polishing pad. The laser beam is applied to the polishing pad at such an incident angle that the laser beam does not reach a bottom portion of a pore formed in the surface of the polishing pad.
    Type: Grant
    Filed: September 11, 2013
    Date of Patent: September 3, 2019
    Assignees: EBARA CORPORATION, Kyushu Institute of Technology
    Inventors: Hisanori Matsuo, Keiichi Kimura, Keisuke Suzuki, Panart Khajornrungruang, Takashi Kushida
  • Patent number: 10388493
    Abstract: A component of a substrate support assembly such as a substrate support or edge ring includes a plurality of current loops incorporated in the substrate support and/or the edge ring. The current loops are laterally spaced apart and extend less than halfway around the substrate support or edge ring with each of the current loops being operable to induce a localized DC magnetic field of field strength less than 20 Gauss above a substrate supported on the substrate support during plasma processing of the substrate. When supplied with DC power, the current loops generate localized DC magnetic fields over the semiconductor substrate so as to locally affect the plasma and compensate for non-uniformity in plasma processing across the substrate.
    Type: Grant
    Filed: September 16, 2011
    Date of Patent: August 20, 2019
    Assignee: Lam Research Corporation
    Inventors: Harmeet Singh, Keith Gaff, Brett Richardson, Sung Lee