Abstract: A housing is disclosed, including an accommodating cavity, where a surface of the housing is provided with a groove, a thickness of an area provided with the groove in the housing is less than a thickness of an area provided with no groove in the housing, the housing further includes a protective layer, and the protective layer is disposed on the surface of the housing and covers an opening end of the groove. The groove helps discharge a pressure from the housing, and the protective layer can prevent the housing from being accidentally broken. This application further provides a battery to which the housing is applied, and an electronic apparatus to which the battery is applied.

Abstract: This application relates to a flexible display screen supporting structure for supporting a flexible display screen. The flexible display screen includes a bendable region and a non-bendable region spaced apart in a first direction. The flexible display screen supporting structure includes a flexible support layer, the flexible support layer includes a first surface and a second surface arranged opposite to each other, the first surface is used for connecting to a non-light-emitting side of the flexible display screen, and the second surface is divided into a first region and a second region that are spaced apart in the first direction. A rigid support plate is arranged on the first region, a plurality of rigid support strips that are parallel to each other are arranged at intervals on the second region, and each of the plurality of the rigid support strips extends along a direction perpendicular to the first direction.

Abstract: Compact electronic devices, such as Access Points (APs), having airflow and cooling features are provided. According to one implementation, a compact electronic device includes an outer plastic housing and an inner casing arranged inside the outer plastic housing. The inner casing has a high-voltage section configured to support one or more high-voltage electrical components and a low-voltage section configured to support one or more low-voltage electrical components. The compact electronic device further includes a single fan that is configured to draw air from outside the outer plastic housing, move the air through the high-voltage and low-voltage sections, and exhaust the air through one or more exhaust vents in the outer plastic housing. Also, the inner casing is configured to isolate the one or more high-voltage electrical components from metal portions of the low-voltage section by at least a certain separation to meet clearance and creepage safety standards.

Abstract: A module is provided with a substrate including a principal surface, a plurality of electronic components arranged on the principal surface, a sealing resin covering the principal surface and the plurality of electronic components, a ground electrode arranged on the principal surface or inside the substrate, a conductive layer covering the sealing resin and electrically connected to the ground electrode, and a magnetic member. The magnetic member includes a magnetic plate member arranged so as to cover at least a part of the sealing resin and a magnetic wall member arranged in a wall shape between any of the plurality of electronic components. The module is further provided with a metal pin or a metal wire provided along the magnetic wall member and connected to the ground electrode.

Abstract: Example implementations relate to a computing system having a flexible filter assembly. The computing system includes a chassis having an internal volume, a pair of guide rails, a flexible filter assembly, and a plurality of first electronic components. The pair of guide rails is disposed spaced apart from each other and coupled to the chassis. The flexible filter assembly is disposed within and connected to the chassis via the pair of guide rails. The flexible filter assembly splits the internal volume into first and second volume portions. The first volume portion is located downstream relative to flow of supply air. The flexible filter assembly slides into the chassis along the pair of guide rails to detachably connect to the chassis. The flexible filter assembly cleans the supply air and directs clean air towards the plurality of first electronic components disposed in the first volume portion and coupled to the chassis.

Abstract: A power converter includes: a semiconductor module that includes a semiconductor element for power conversion, the semiconductor module having a module surface on which an input terminal electrically connected to the semiconductor element is disposed; a capacitor in which a capacitor terminal is disposed, the capacitor having a capacitor surface facing the module surface; a cooler that is disposed between the semiconductor module and the capacitor; and a connecting member that electrically connects the input terminal and the capacitor terminal.

Abstract: A foldable electronic device is provided. The electronic device includes a flexible display, a first window including a first surface facing the flexible display and a second surface facing the opposite direction to the first surface, the first surface adhered to at least partial region of the flexible display via a first adhesive, and a second window adhered to at least partial region of the second surface of the first window via a second adhesive, in which the first adhesive has a greater thickness than the second adhesive.

Abstract: Systems and methods for facilitating temperature regulation of an electronic module. The methods comprise: coupling first heat exchanger modules of a plurality of heat exchanger modules together to form a first set of heat exchanger modules and second heat exchanger modules of the plurality of heat exchanger modules together to form a second set of heat exchanger modules; using frame members to structurally support and maintain the first and second sets of heat exchanger modules in a spaced apart arrangement; and providing at least one slot between corresponding spaced apart modules of the first and second heat exchanger modules, the at least one slot being sized and shaped to receive the electronic module to facilitate the temperature regulation via the plurality of heat exchanger modules.

Abstract: An electronic device includes an electronic component, a thermal ground, and a thermal interface material having a first side coupled to the electronic component and a second side coupled to the thermal ground, such that the thermal interface material draws thermal energy from the electronic component and transfers thermal energy to the thermal ground. The thermal interface material includes a body comprising thermally conductive silicone, the body disposed in thermal contact with the electrical component, and the thermally conductive silicone having a first thermal conductivity, and a plurality of thermally conductive fibers disposed within the body of the thermal interface material, the thermally conductive fibers having a second thermal conductivity greater than the first thermal conductivity.

Abstract: Disclosed herein is a display device including a display panel having a display portion configured to display an image, a plate-shaped member having a first principal surface and a second principal surface, the display panel being disposed on a second principal surface side, the plate-shaped member including a screen portion disposed in a position corresponding to the display portion, an opaque frame member disposed at a peripheral edge of the screen portion, a bonding member that has transparency and is configured to bond the display panel and the plate-shaped member to each other, a holding member disposed on the second principal surface side of the plate-shaped member, and a fixing member configured to fix the frame member and the holding member to the plate-shaped member, the plate-shaped member further including a transparent peripheral edge portion disposed on an outside of the frame member.

Abstract: A thermal management system for a computing device includes a support board, a heat-generating component fixed to the support board, an enclosure, and a PCM. The heat-generating component is fixed to the support board on a first side of the support board, and the enclosure is fixed to the first side of the support board and encloses at least the heat-generating component. The PCM is positioned in the enclosure and configured to receive heat from the heat-generating component. The PCM is solid at 10° C.

Abstract: A display apparatus includes an antenna and a first bending portion. The antenna includes an antenna feed point. An end of the first bending portion is connected to a side edge of a touch film proximate to the antenna feed point, and another end of the first bending portion is provided with a first bonding pin group and a first redundant pin group. The first redundant pin group is located on a side of the first bonding pin group proximate to a first plane, such that a wiring blank area of the first bending portion is formed on a side of a connection lead group proximate to the first plane.

Abstract: A display device is disclosed. The display device of the present disclosure may comprise a display panel; a guide panel including a vertical portion supporting a rear surface of the display panel, a horizontal portion extending rearward from the vertical portion, and a groove formed on an outer surface of the horizontal portion; and, a back cover including a flat plate positioned at a rear of the guide panel, a side plate extending forward from the flat plate and covering the horizontal portion, and a latch formed on an inner surface of the side plate and caught in the groove.

Abstract: In a flexible display panel and a flexible display device provided by the present application, a bending end of a support layer is configured inwardly to be shorter than a flexible display module to reduce a bending angle of the support layer. In this way, bending stress on the support layer can be reduced, thereby increasing attachment quality of the support layer and improving attachment reliability.

Abstract: A high temperature electronic device thermal management system. Data centers contain many large racks of computer servers with electronic devices that generate heat. For the devices to function properly, they must not exceed a maximum temperature. Typical techniques for thermal management of data center electronics involve using sub-ambient temperature coolants via refrigeration cycles, requiring significant input energy to operate. The present thermal management system includes a flow management system to produce elevated coolant temperatures while sustaining safe device temperatures. This allows the coolant to reject to ambient temperatures globally and year-round, enabling reduced energy usage by no longer requiring refrigeration cycles. Further, operation at or above 55° C. would allow for implementation of additional waste heat recovery processes with increased energy efficiency.

Abstract: A replaceable frame assembly is disclosed, which comprises: a base plate, a first fixing unit, a second fixing unit, a front panel, at least one first electrical connection interface, a second electrical connection interface, a third electrical connection interface, and a fixation plate. The replaceable frame assembly is adopted for accommodating an expansion card module, and can be disposed in a case of an electronic device. After being disposed in the case, an electrical connection end of the first electrical connection interface is embedded into an electrical slot that is disposed on a main board, such that the expansion card module communicates with the main board through the second electrical connection interface, the third electrical connection interface, the first electrical connection interface, and the electrical slot, thereby making the expansion card module become a functional electronic module of the electronic device.

Abstract: According to a first aspect there is disclosed an assembly comprising a power device and a cooling plate which overlies the power device for heat transfer therebetween. The power device comprises a plurality of power switching components including at least a first power switching component and a second power switching component; wherein each of the power switching components is configured to dissipate heat to the cooling plate.

Abstract: An optical element mounting package includes a recess, a mounting portion for an optical element, and a reflector. The mounting portion is at a bottom surface of the recess. The reflector is, in the recess, positioned forward in an emission direction of light of the optical element. A first portion is a portion of an inner side surface of the recess, and is positioned in an opposite direction to the emission direction. The first portion has an inclined surface toward the bottom surface of the recess.

Abstract: Circuit board, defining a plurality of switching arms connected in parallel so as to convert a first voltage into a second voltage, at least one of which is DC voltage. The board includes a plurality of controllable electronic switches mounted pairwise in series on either side of a midpoint, so as to produce the switching arms connected in parallel. A plurality of decoupling capacitors are connected in parallel to one another, and in parallel to the DC voltage. Two electrically conductive layers are arranged parallel to one other, one of which is at the highest potential of the DC voltage and the other of which is at the lowest potential of the DC voltage. Each of the decoupling capacitors having one terminal connected to one of these electrically conductive layers and its other terminal connected to the other of these electrically conductive layers.

Abstract: A system for operating and cooling a plurality of computing devices in a container-based data center is disclosed. Shipping containers are configured with air intake openings having triangular prism or trapezoidal prism shaped vents. The vents hold filters that can remove dust, debris, and moisture droplets from the incoming air. Fans draw fresh air into the container through the filters and direct the filtered air across the computing devices to cool them. The heated air is then expelled out of the container via exhaust openings on the opposite side of the container from the air intake openings.