Abstract: The present disclosure provides a bezel and a display device. The bezel includes: a first sub-bezel including a first connection sheet and a third connection sheet connected to each other to define a first angle, the first connection sheet and the third connection sheet including a first engaging region and a third engaging region respectively; and a second sub-bezel including a second connection sheet and a fourth connection sheet connected to each other to define a second angle, the second connection sheet and the fourth connection sheet including a second engaging region and a fourth engaging region respectively. The first engaging region is in engagement with the second engaging region, and the third engaging region is in engagement with the fourth engaging region, to enable the first sub-bezel to be connected to the second sub-bezel.

Abstract: A modular data center (MDC) has an MDC power distribution system (PDS) that includes a power distribution module attached to a top or bottom of the interior enclosure of a volumetric container of the MDC. The power distribution module is electrically coupled to an external power source to receive electrical power and comprising electrical sockets that distribute the received electrical power from an electrical power source external to the volumetric container. Electrical cord(s) have a respective electrical plug insertable in a respective electrical socket of the power distribution module and having another end that is electrically connectable to a rack power distribution unit (PDU). Rack information handling system(s) is positioned in an interior enclosure of a volumetric container of the MDC and has information technology (IT) component(s) mounted to the rack. The rack PDU is attached to the rack and electrically coupled to distribute electrical power to the IT component(s).

Abstract: A data center, an air handling system, and a method for installing equipment in a data center enable internal differential pressure relief within the data center. A volumetric container has mounting location(s) for heat generating information technology (IT) component(s) positioned within the volumetric container. A cold aisle on one side and a hot aisle on another side of the IT component(s) that have air passages for air cooling. A cooling unit is coupled to the volumetric container to pressurize the cold aisle with supply air and draws return air from the hot aisle. An air barrier is attached across an air passage between the cold and the hot aisles. A differential pressure relief mechanism is attached to the air barrier. The differential pressure relief mechanism is configured to open in responses to an air pressure difference across the differential pressure relief mechanism exceeding a pressure threshold.

Abstract: A dual-contact electro-permanent magnet (EPM) assembly of an information handling system may comprise a plurality of high-coercivity magnets situated on opposite ends of a low-coercivity magnet, a first EPM magnetic contact disposed between a first of the plurality of high-coercivity magnets and the low-coercivity magnet, and a second EPM magnetic contact disposed between a second of the plurality of high-coercivity magnets and the low-coercivity magnet. The low-coercivity magnet polarity may correlate to a direction of current pulse applied to an electrically conductive wire coiled around the low-coercivity magnet, and dependent upon the low-coercivity magnet polarity, the first EPM magnetic contact is capable of operating in an attractive magnetic state to attract a ferromagnetic contact of a peripheral device while the second EPM magnetic contact is magnetically neutral with respect to the ferromagnetic contact.

Abstract: A case (2) includes a tubular body (6) extending vertically and a top plate (8) disposed at a top edge of the tubular body (6), the case being capable of accommodating a heat-generating element (5). Upward ventholes (16) for discharging the heated air (P), which is heated by the heat-generating element (5), to the outside are formed in the top plate 8. A partition wall (17) that protrudes downwardly from the top plate (8) is disposed between the upward ventholes (16) and the tubular body (6). An air accumulating part (20) surrounded by the tubular body (6), the top plate (8), and the partition wall (17) is formed.

Abstract: A cooling arrangement for autonomous cooling of a rack hosting components and fans comprises a closed loop and an open loop. Liquid cooling is used in the closed loop to transfer heat from heat-generating units of the components to a primary side of a liquid-to-liquid heat exchanger. An air-to-liquid cooling unit is used in the open loop to absorb heat expelled from the rack by the fans. A liquid from a cold supply line is first heated to some degree in the air-to-liquid cooling unit before reaching a secondary side of the liquid-to-liquid heat exchanger. The primary side being hotter than the secondary side, heat is transferred from the primary side to the secondary side of the liquid-to-liquid heat exchanger. The liquid is expelled at a higher temperature from the secondary side to a hot return line.

Abstract: An electronic equipment enclosure comprises a frame structure formed from a plurality of support posts and at least partially enclosed by a plurality of panels. The panels include at least side, top and back panels defining an enclosure having a top, a bottom and a rear thereof. The top panel includes an opening there through that is rectangular in shape. The equipment enclosure further comprises an exhaust air duct extending upward from the top panel of the enclosure. The exhaust air duct is rectangular in cross-section and is disposed in surrounding relation to, and in fluid communication with, the top panel opening. The exhaust air duct is adapted to segregate hot air being exhausted from the enclosure from cool air entering the enclosure, thereby improving thermal management of the enclosure.

Abstract: Disclosed are row cooling units and connecting units with a network of integrated fluid distribution piping that may be interconnected to construct a liquid cooling system to carry way heat generated by servers housed within the server racks used in data centers. The assembly of row cooling units and connecting units may be connected to the supply and return loops of the data center facility to distribute cooling liquid to the electronic components of the servers and to return heated liquid for heat removal. The network of fluid distribution piping integrated into the row cooling units and connecting units enables the configuration of the liquid cooling system to be independent of the fixed infrastructure of the facility, affording ease of scalability, serviceability, maintenance, while increasing efficiency, resiliency, availability and reliability of the liquid cooling system critical to the operation and performance of the data center.

Abstract: This document describes an access point device and associated systems and methods. The techniques and systems include an access point device that includes a housing with an antenna carrier, a circuit board assembly, a heat sink, and a heat shield positioned within the housing. The housing includes a top housing member connected to a bottom housing member. The top housing member includes a concave-down top-end portion connected to a generally cylindrical vertical wall via rounded corners. The antenna carrier supports multiple antennas positioned proximate to an inner surface of the vertical wall. The heat sink is positioned between the antenna carrier and the circuit board assembly. The circuit board assembly is positioned between the heat shield and the heat sink, and the heat shield is positioned between the circuit board assembly and the bottom housing member.

Abstract: An electronic device for improving heat transfer is provided. The electronic device includes a housing, a display mounted on at least one surface of the housing, a battery, a supporting member disposed adjacent to a back surface of the display and supporting the display, a printed circuit board on which electronic components are mounted, a shield can surrounding at least a portion of the electronic components, a shielding structure disposed on an outer surface of the shield can to shield the electronic components, and a first heat transfer member disposed on an outer surface of the shielding structure and including a partial area that faces at least one electronic component among the plurality of electronic components mounted on the printed circuit board and another partial area that is bent and faces another electronic component among the plurality of electronic components mounted on the printed circuit board.

Abstract: An electronic module for a transmission control unit may include a printed circuit board that has an electronic component. The electronic component may be electrically connected to a surface of the printed circuit board at least at one point. At least a portion of the electronic component that includes the at least one point may be covered with a protective coating. The protective coating may include a media-tight protective lacquer. The electronic component may be a semiconductor component contained in a housing.

Abstract: An optical transceiver according to an aspect of the present embodiment is an optical transceiver configured to be inserted to and extracted from a cage of an apparatus along a first direction. The optical transceiver includes a device generating heat, and a housing having a rectangular parallelepiped shape with long sides extending along the first direction. The housing includes an internal space housing the device, and an outside part configured to be exposed to an outside of the cage. When the housing is engaged with the cage, the outside part having an air intake part configured to bring an outside air into the internal space for cooling the device.

Abstract: A fan module includes a fan body and metal plates. The fan body has a fan seat, and the fan seat is provided with coupling holes. The metal plates enclose the fan body and expose an outlet side. The position assembly includes a position frame and position members. The position frame has an air outlet and is fixed on the outlet side. The airflow shielding structure includes shutter plates and a connection rod. One side of the shutter plates are pivoted at the position frame, and the shuttle plates are capable of turning simultaneously for opening and closing the air outlet so as to maintain the normal operation of the server fan.

Abstract: Two-phase cooling systems for autonomous driving super computers (ADSC) are described herein. In some examples, a two-phase cooling system can include a flow channel configured to circulate a flow; an evaporative heat exchanger comprising an inlet for receiving fluid from the flow channel and an outlet for releasing vapor generated from the fluid, the evaporative heat exchanger being configured to collect heat from components of the ADSC and transfer the heat away via the vapor released from the first outlet; a condensing heat exchanger configured to condense the vapor and remove latent heat associated with the vapor, the condensing heat exchanger comprising an inlet to the flow channel for receiving the vapor and an outlet to the flow channel for discharging fluid generated by condensing the vapor; and a pump configured to receive the fluid from the condensing heat exchanger and circulate the fluid to the evaporative heat exchanger.

Abstract: A stand device includes a first cover and a second cover. The first cover and the second cover are pivotably connected to each other at their opposing side portions thereof. The first cover includes a first plate portion which support a rear surface of an electronic apparatus, a second plate portion coupled to the first plate portion, a third plate portion coupled to the second plate portion and a fourth plate portion 14 coupled to the third plate portion and the first plate portion, and the first to fourth plate portions are connected with each other to form an endless annular shape. The stand device is switchable between a stand mode and a cover mode.

Abstract: A platform includes a housing with a front side, a rear side opposite the front side, a right side adjacent to both the front side and the rear side, and a left side opposite the right side and adjacent to both the front side and the rear side, wherein airflow in the platform is between the front side and the rear side or between the front side and the front side; one or more modules in the housing each including a plurality of cages supporting removable interface cards, wherein the airflow includes an air path that is over the one or more modules between a bottom portion of the one or more modules and a top portion of the one or more modules; and at least one dust cap in one of the plurality of cages, wherein the dust cap includes an air filter medium enabling airflow at an intermediate point of the air path.

Abstract: A first supporting element, e.g. a PCB, may have opposed sides. A heat sink body is mounted on one side of the first supporting element, and having peripheral surface(s) for heat dissipating electrical device. A first circuit includes the heat dissipating electrical device(s) mounted and operates at a first voltage level. At least one circuit board assembly is mounted on the other side of the first supporting element, and extends from a first end to a second end. It has a first end connector at the first end, for connecting the first end of the circuit board assembly to the first circuit, and providing a signal interface between the first circuit operating at the first voltage level and a second circuit operating at a second voltage level different or equal to the first voltage level.

Abstract: A tuner includes a housing including an upper housing part and a lower housing part, a printed circuit board arranged in the housing, and an electronics component arranged on the printed circuit board. A region of at least one of the upper housing part and the lower housing part is a heat-conductive material and the electronics component is connected to the region in a heat-transmitting manner.

Abstract: An optical module includes at least one optical sub-assembly; at least one control circuit configured to control the at least one optical sub-assembly; and a housing including a first case and a second case, wherein the optical module is configured to be plugged in and unplugged from an optical transmission equipment including a heat sink provided at a joining portion with the first case, wherein, through fitting of the first case and the second case, the housing accommodates the at least one optical sub-assembly and the at least one control circuit inside the housing, and wherein a material of the first case has a thermal conductivity higher than a material of the second case.

Abstract: A power conversion device includes: a casing including a housing portion; a circuit board housed in the housing portion, the circuit board including an inverter circuit or an inverter control circuit configured to control the inverter circuit; a cooling fan configured to generate air flowing through the housing portion to cool the circuit board; a temperature sensor configured to sense a temperature inside or outside the casing; and a cooling fan control circuit configured to drive the cooling fan. The cooling fan control circuit is configured to, if the temperature sensed by the temperature sensor is higher than a predetermined temperature, turn on the cooling fan, and if the sensed temperature is equal to or below the predetermined temperature, control the cooling fan to turn off the cooling fan or make a speed of the flowing air lower than a speed when the cooling fan is in the on state.