Abstract: The present disclosure includes apparatuses and methods to determine timing of operations. An example method includes performing a first operation type that uses a shared resource in a memory device. The method includes applying a scheduling policy for timing of continued performance of the first operation type based upon receipt of a request to the memory device for performance of a second operation type that uses the shared resource.

Abstract: According to one embodiment, a semiconductor storage device includes a first wiring, a first resistance change element which is connected to the first wiring, a first nonlinear element which is connected to the first resistance change element, and a second wiring which is connected to the first nonlinear element. In a read operation for the first resistance change element, a voltage between the first wiring and the second wiring increases to a first voltage, and after the voltage between the first wiring and the second wiring increases to the first voltage, the voltage between the first wiring and the second wiring increases to a second voltage which is larger than the first voltage.

Abstract: A semiconductor system including a semiconductor device configured to operate in various modes to generate output data having different patterns.

Abstract: A memory system is provided that includes a first memory array including a first memory cell, a second memory array including a second memory cell, and a memory controller configured to determine a threshold voltage of the second memory cell to compensate a drift of a threshold voltage of the first memory cell and/or determine an offset voltage of the second memory cell to compensate an offset voltage of the first memory cell.

Abstract: An integrated circuit memory contains a memory cell connected to a bit line that does not float during a portion or all of the read sensing part of the read cycle. The memory cell includes a data storage device. The data storage device may be a ferroelectric capacitor, a linear capacitor, a floating gate transistor, a magnetic device, a resistive device or other type of data storage device capable of placing a charge on the bit line corresponding to a specific data state of the memory cell. The bit line and a reference bit line are connected to a differential amplifier and precharged to specified voltages. Preferably, a self-nulling sense amplifier circuit is connected to the bit lines that compensates for sense amplifier offset by applying additional charges on the bit lines. Alternatively, charge sources may be connected to the bit lines to provide additional charges on the bit lines during the read cycle.

Abstract: A method and apparatus for performing memory calibration with endpoint replay is disclosed. A first calibration of a data strobe signal in a memory subsystem is performed. The first calibration includes determining initial values of first and second endpoints indicative of first and second delay values, respectively, applied to the data strobe signal. A second calibration of the data strobe signal is performed around these endpoints, within a range thereof that is less than a full range there between. Based on the second calibration, the endpoints are adjusted.

Abstract: A semiconductor storage device includes: a voltage generation circuit configured to generate a read voltage to be supplied to a selected word line to which a read-target memory cell transistor is connected and a read-pass voltage to be supplied to an adjacent word line; a word line driver configured to, when the read voltage transitions, apply the read voltage to the selected word line with a first kick voltage amount and apply the read-pass voltage to the adjacent word line with a second kick voltage amount; and a control circuit configured to set each of the first kick voltage amount and the second kick voltage amount to a voltage corresponding to an amount of the transition.

Abstract: The present disclosure includes apparatuses and methods to change data category values. An example is a memory device that includes an array having a plurality of sequences of memory cells, where each of the respective sequences of memory cells includes a plurality of designated subsets of memory cells, and the array includes a counter corresponding to one of the plurality of designated subsets of memory cells. The memory device is configured to receive input corresponding to a data batch, where the input includes a designation that corresponds to the one of the plurality of designated subsets of memory cells to be conditionally updated, and to change a numerical value stored by the counter corresponding to the one of the plurality of designated subsets of memory cells.

Abstract: Some embodiments relate to an SRAM cell layout including upper and lower cell edges and left and right cell edges. A first power rail extends generally in parallel with and lies along the left cell edge or the right cell edge. The first power rail is coupled to a first power supply. A second power rail extends generally in parallel with the first power rail and is arranged equidistantly between the left and right cell edges. A first bitline extends in parallel with the first power rail and the second power rail and is arranged to a first side of the second power rail. A second bitline, which is complementary to the first bitline, extends in parallel with the first power rail and the second power rail and is arranged to a second side of the second power rail.

Abstract: A method includes replacing an address of a first normal memory cell in a first column of a first memory block with a destination address that is an address of a second normal memory cell in a second column of the first memory block, and reassigning the address of the second normal memory cell in the second column of the first memory block to an address of a first redundancy memory cell in a redundancy block of the memory device.

Abstract: Methods for reducing read disturb using NAND strings with poly-silicon channels and p-type doped source lines are described. During a boosted read operation for a selected memory cell transistor in a NAND string, a back-gate bias or bit line voltage may be applied to a bit line connected to the NAND string and a source line voltage greater than the bit line voltage may be applied to a source line connected to the NAND string; with these bias conditions, electrons may be injected from the bit line and annihilated in the source line during the read operation. To avoid leakage currents through NAND strings in non-selected memory blocks, the threshold voltages of source-side select gate transistors of the NAND strings may be set to a negative threshold voltage that has an absolute voltage value greater than the source line voltage applied during the read operation.

Abstract: A memory device with internal row hammer mitigation couples to a memory controller. The memory controller or host can assist with row hammer mitigation by sending additional refresh cycles or refresh commands. In response to an extra refresh command the memory device can perform refresh for row hammer mitigation instead of refresh for standard data integrity. The memory controller can keep track of the number of activate commands sent to the memory device, and in response to a threshold number of activate commands, the memory controller sends the additional refresh command. With the extra refresh command the memory device can refresh the potential victim rows of a potential aggressor row, instead of simply refreshing a row that has not been accessed for a period of time.

Abstract: A single poly non-volatile memory device that includes: a first type lower well; first and second wells separately formed in an upper portion of the first type lower well; a source electrode, a selection transistor, a sensing transistor, and a drain electrode sequentially disposed in an upper portion of the first well. A control gate is formed in an upper portion of the second well with separated on an opposite side of the source electrode from the first well and connected to the gate of the sensing transistor.

Abstract: Methods for reducing read disturb using NAND strings with poly-silicon channels and p-type doped source lines are described. During a boosted read operation for a selected memory cell transistor in a NAND string, a back-gate bias or bit line voltage may be applied to a bit line connected to the NAND string and a source line voltage greater than the bit line voltage may be applied to a source line connected to the NAND string; with these bias conditions, electrons may be injected from the bit line and annihilated in the source line during the read operation. To avoid leakage currents through NAND strings in non-selected memory blocks, the threshold voltages of source-side select gate transistors of the NAND strings may be set to a negative threshold voltage that has an absolute voltage value greater than the source line voltage applied during the read operation.

Abstract: A method for identifying cell coupling in a memory system includes generating a two-dimensional pseudorandom binary sequence array. The method also includes performing an erase operation on a plurality of cells of a memory block of the memory system. The method also includes performing a write operation on the plurality of cells using the two-dimensional pseudorandom binary sequence array. The method also includes performing a read operation on the plurality of cells to identify a voltage value for each cell of the plurality of cells. The method also includes identifying cell coupling between respective cells of the plurality of cells using the voltage value for each of the cells of the plurality of cells.

Abstract: A method of managing programming errors in a multilevel NAND flash memory is provided. The multilevel NAND flash memory uses a two-pass programming algorithm—e.g., a first programming pass and a second programming pass—for programming a memory block being organized in pages, sharing a word line. The method comprises performing the first programming pass for at least one memory page, reading the at least one memory page between the first programming pass and the second programming pass, determining an error count value for the at least one programmed memory page, and responsive to determining that the error count value is below a threshold value, performing the second programming pass with active data.

Abstract: Briefly, the disclosure relates to circuits utilized to perform writing operations to a memory array, in which elements of the array comprise resistive memory cells coupled in series with an access device. In one embodiment, a circuit may comprise a supply voltage coupled to a first side of the array and a current source coupled to a second side of the array. The access devices of the elements of the array may be body-biased, which may operate to reduce the turn-on voltage (VTH) of the access devices. Particular voltages may be applied to gate regions of the access devices to control leakage current to the resistive memory cells of the array.

Abstract: According to one embodiment, a memory device includes a memory cell including a resistance change memory element and a selector element, a word line, a bit line connected to one end of the memory cell, an operational amplifier including a non-inverting input connected to the bit line, an output circuit including a first terminal connected to an output of the operational amplifier, a second terminal connected to the bit line, and a charge/discharge circuit including a capacitor, a charge circuit and a discharge circuit, each including one end connected to an inverting input of the operational amplifier. At the time of falling of a write voltage for the memory cell, a potential of the other end of the memory cell is set higher than a potential of the other end of the discharge circuit.

Abstract: The semiconductor memory device including a data strobe signal input buffer configured to receive a data strobe signal and generate an input data strobe signal, a data input buffer configured to receive data delayed by a first delay time compared to the data strobe signal and generate input data, a latency control signal generator configured to generate and activate a first on-die termination control signal during a first period in which the data strobe signal is applied in response to receiving a write command, a first on-die termination control circuit configured to vary a first variable resistance code in response to the first on-die termination control signal, and a data strobe signal termination circuit configured to terminate the data strobe signal and including a first on-die termination resistor, a resistance value of which varies in response to the first variable resistance code may be provided.

Abstract: Various implementations described herein are directed to an integrated circuit. The integrated circuit may include a bitcell and multiple straps including a first strap, a second strap, and a third strap. The first strap may couple the bitcell to ground. The second strap may couple the bitcell to a bitline. The third strap may couple the bitcell to a wordline within a boundary of the bitcell.