Patents Examined by Nasir U Ahmed
  • Patent number: 11460348
    Abstract: An induction cooker includes a microcrystal panel and at least three temperature sensors scattered on a bottom surface of the microcrystal panel, and the induction cooker is configured to heat a container to be measured. The method includes: obtaining temperature data collected by the at least three temperature sensors and position data of each temperature sensor relative to the microcrystal panel; obtaining an actual position of the container on the microcrystal panel according to the temperature data and the position data; obtaining a preset temperature curve matching the induction cooker according to the temperature data, and extracting a peak value of the preset temperature curve; and calculating an actual temperature of the container to be measured according to the actual position and the peak value.
    Type: Grant
    Filed: April 9, 2020
    Date of Patent: October 4, 2022
    Assignee: FOSHAN SHUNDE MIDEA ELECTRICAL HEATING APPLIANCES MANUFACTURING CO., LTD.
    Inventors: Xiaohui Li, Zhao Wang, Shuai Wang, Wei Chen, Shaohua He
  • Patent number: 11460351
    Abstract: A coaxial thermocouple includes a wire, an insulation layer surrounding the wire, a sheath surrounding the insulation layer, and an electrical junction formed between the wire and the sheath and at one longitudinal end of the coaxial thermocouple, the electrical junction including a swaged end with an outer diameter of the sheath reducing in diameter along a longitudinal length of the coaxial thermocouple until the sheath contacts the wire within the insulation layer. The wire includes a first material and the sheath includes a second material where the first material includes one of molybdenum (Mo) or niobium (Nb) and the second material includes the other of molybdenum (Mo) or niobium (Nb).
    Type: Grant
    Filed: November 21, 2019
    Date of Patent: October 4, 2022
    Assignee: Battelle Energy Alliance, LLC
    Inventors: Richard S. Skifton, Joshua Daw
  • Patent number: 11454549
    Abstract: The invention relates to heat flow measurements. In particular, the invention relates to a surface adapter (10A, 10B, 100) for a heat flow measurement device, a device comprising such adapter (10A, 10B, 100) and a method of measuring heat flow. The adapter is comprises a rim (12) positionable around a measurement head (20) of a heat flux measurement device, the rim (12) being at least partly made of resilient material capable of adapting in shape to uneven surfaces for thermally insulating the measurement head (20) from its surroundings. The invention allows for more accurate thermal flow measurements.
    Type: Grant
    Filed: March 14, 2018
    Date of Patent: September 27, 2022
    Inventors: Mikael Paronen, Stuart Buddle
  • Patent number: 11454552
    Abstract: A manufacturing method for a thermoelectric nanosensor includes the following steps. A first conductive material is prepared. A plurality of tellurium nanostructures are formed on the first conductive material. A second conductive material is prepared. The second conductive material is formed on the tellurium nanostructures.
    Type: Grant
    Filed: September 23, 2019
    Date of Patent: September 27, 2022
    Assignee: NATIONAL TSING HUA UNIVERSITY
    Inventors: Zong-Hong Lin, Yu-Hsiang Tsao
  • Patent number: 11454599
    Abstract: A thermal conductivity measuring device includes a sample container that has a plurality of storage sections; a drive unit that is configured to move the plurality of storage sections of the sample container; and a radiation thermometer that is configured to measure the temperature of a predetermined position of the sample container.
    Type: Grant
    Filed: September 4, 2019
    Date of Patent: September 27, 2022
    Assignee: SHOWA DENKO K.K.
    Inventor: Yohei Fujikawa
  • Patent number: 11435237
    Abstract: The invention provides a temperature sensing device of an integrated circuit. The integrated circuit includes a plurality of stacked metal wire layers, and the temperature sensing device includes a first metal sheet, a first via and a second via. The first metal sheet is disposed between the first metal wire layer and the second metal wire layer of the metal wire layers. The first via and the second via are used to connect the first metal sheet and the first metal wire layer, wherein a temperature sensing signal enters the first metal sheet through the first via and leaves the first metal sheet through the second via to measure the temperature of the integrated circuit.
    Type: Grant
    Filed: June 18, 2020
    Date of Patent: September 6, 2022
    Assignee: ITE Tech. Inc.
    Inventors: Yi-Chung Chou, Yu-Chin Chen, Tzu-I Huang
  • Patent number: 11435238
    Abstract: A temperature detection device includes: a detection processing unit configured to transmit a transmission radio wave, simultaneously receive a response radio wave corresponding to the transmission radio wave, and detect whether a temperature of an object to be measured is normal or abnormal based on the response radio wave; and a temperature sensing unit configured to receive the transmission radio wave and transmit the response radio wave responding to the transmission radio wave. The detection processing unit calculates, from the response radio wave received via a second antenna, an amplitude, a phase, or a quadrature phase amplitude of the response radio wave and compares the temperature of the object to be measured to a temperature determined in advance based on a result of the calculation.
    Type: Grant
    Filed: November 24, 2017
    Date of Patent: September 6, 2022
    Assignee: Mitsubishi Electric Cornoration
    Inventors: Kenzo Makino, Hideaki Arita, Masaya Inoue, Junji Hori, Hiroshi Araki, Yoshitsugu Sawa, Wataru Tsujita
  • Patent number: 11428583
    Abstract: A temperature sensor is disclosed that determines whether the temperature of an integrated circuit (IC) is within a normal temperature range. A low threshold monitor circuit senses whether the temperature of the IC is above or below a minimum temperature threshold. A high threshold monitor circuit configured senses whether the temperature of an integrated circuit (IC) is above or below a maximum temperature threshold. The minimum temperature threshold is determined by an intersection of a first temperature coefficient of resistance (TCR) and a second TCR that are associated with a first pair of conductive lines. The maximum temperature threshold is determined by an intersection of a third TCR and a fourth TCR associated that are with the second pair of conductive lines.
    Type: Grant
    Filed: August 23, 2019
    Date of Patent: August 30, 2022
    Inventors: Lorraine Wang, Shih-Lien Linus Lu
  • Patent number: 11428655
    Abstract: A gas sensor (1) including a first gas detection element (2) and a second gas detection element (3), a first storage portion (4) having a first internal space (4A), and a first opening (4B) establishing communication between the first internal space (4A) and the outside space thereof exposed to a detection subject atmosphere, a second storage portion (5) having a second internal space (5A) and a second opening (5B) establishing communication between the second internal space (5A) and the outside space, a first membrane (4C) allowing permeation of water vapor and substantially not allowing permeation of a detection target gas, and covering the first opening (4B), and a calculation unit (12) for calculating the concentration of a detection target gas contained in the detection subject atmosphere, based on outputs from the first and second gas detection elements (2, 3), respectively.
    Type: Grant
    Filed: January 22, 2020
    Date of Patent: August 30, 2022
    Assignee: NGK SPARK PLUG CO., LTD.
    Inventors: Yusuke Matsukura, Shoji Kitanoya, Masaya Watanabe, Daisuke Ichikawa
  • Patent number: 11408841
    Abstract: A thermal conductivity measuring device includes a sample container that has a plurality of storage sections; a drive unit that is configured to move the plurality of storage sections of the sample container; and a radiation thermometer that is configured to measure the temperature of a predetermined position of the sample container.
    Type: Grant
    Filed: September 4, 2019
    Date of Patent: August 9, 2022
    Assignee: SHOWA DENKO K.K.
    Inventor: Yohei Fujikawa
  • Patent number: 11408780
    Abstract: A thermal sensor and a method of making a thermal sensor is disclosed. The thermal sensor includes a first electrode, a second electrode, and a composition between the first and second electrodes. The composition includes solid particles of a state-changing material that transitions at a threshold temperature between solid and liquid states having different electrical conductivities.
    Type: Grant
    Filed: August 16, 2019
    Date of Patent: August 9, 2022
    Assignee: KIDDE TECHNOLOGIES, INC.
    Inventors: Terry Simpson, Daniel James Galway
  • Patent number: 11402277
    Abstract: The invention discloses a temperature measuring device adopting a plurality of infrared sensors and its method. The temperature measuring device consists of a housing, a main control circuit board unit set in the housing, a power supply unit and an infrared sensor set at the head of the housing, wherein the main control circuit board unit is a main control circuit board, and a main control Microcontroller Unit, a signal acquisition circuit, a display screen, a power supply and a control key integrated in the main control circuit board. The method is to calculate and output the accurate target temperature through infrared sensors combined with Microcontroller Unit, at the same time, it can effectively identify such as abnormality of measurement area, abnormality of user measurement method and so as to improve the effectiveness of measurement results.
    Type: Grant
    Filed: January 8, 2019
    Date of Patent: August 2, 2022
    Inventor: Cao Liang
  • Patent number: 11391632
    Abstract: A temperature sensor circuit (1) for measuring a temperature, comprising a measuring resistor (2) and a controllable voltage source (3) or current source (3) which is connected to the measuring resistor (2) and by means of which an input voltage can be applied to the measuring resistor (2). The input voltage can be adjusted continuously by the controllable voltage source (3).
    Type: Grant
    Filed: August 9, 2018
    Date of Patent: July 19, 2022
    Assignee: Robert Bosch GmbH
    Inventor: Martin Trunk
  • Patent number: 11388845
    Abstract: The present invention concerns a method for controlling the temperature of a multi-die power module, a multi-die temperature control device. The multi-die temperature control: obtains a signal that is representative of the temperature of one die among the dies of the multi-die power module when the die is not conducting, obtains signals that are representative of a reference temperature that is dependent of the temperature of all the dies of the multi-die power module when the dies are not conducting, compares the signal that is representative of the temperature of one die to the signal that is representative of the reference temperature, reduces the duration of the conducting time of the die or reducing the duration of the conducting time of the other dies of the multi-die power module according to the comparison result.
    Type: Grant
    Filed: March 1, 2018
    Date of Patent: July 12, 2022
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Jeffrey Ewanchuk, Julio Brandelero
  • Patent number: 11376765
    Abstract: A method and system for sensing and controlling temperature with magnetic fields are provided. The method comprises placing a compound in thermal communication with a number of temperature or heat sources and placing a number of magnets in thermal communication with the compound. A number of magnetic sensors are placed in electromagnetic communication with the number of magnets. Changes in the magnetic field of the magnets are detected by the sensors and used to determine the temperature of the compound according to a model that maps magnetic field characteristics to temperature. The amount of cure of the compound can then be estimated from the temperature. The temperature or heat sources are controlled in response to the temperature measurement and the estimated amount of cure of the compound.
    Type: Grant
    Filed: August 6, 2019
    Date of Patent: July 5, 2022
    Assignee: National Technology & Engineering Solutions of Sandia, LLC
    Inventors: Yi Chen Mazumdar, Martin Nemer, Anirban Mazumdar
  • Patent number: 11378464
    Abstract: The embodiments described herein include sensor mounting clamps configured to lock a sensor, such as a temperature sensor, in place relative to a structure, such as a pipe or tube, of a heating, ventilating, and/or air conditioning (HVAC) unit. More specifically, the sensor mounting clamps described herein include sensor mounting portions configured to receive a sensor, and to hold the sensor in place relative to a structure of an HVAC unit. In addition, the sensor mounting clamps described herein include locking mechanisms having interlocking pockets configured to lock the sensor mounting clamps in place around a structure of an HVAC unit. For example, the sensor mounting clamps described herein may include interlocking pockets having interior passages configured to receive a retention piece, such as a cotter pin, cylindrical pin, or screw, to lock the interlocking pockets in place relative to each other, or may include interlocking pockets configured to directly engage with each other.
    Type: Grant
    Filed: April 16, 2019
    Date of Patent: July 5, 2022
    Assignee: Johnson Controls Technology Company
    Inventors: Swapnil V. Mohite, Ravindra B. Salunkhe, Ritesh D. Rokade, Bhushan D. Vichare
  • Patent number: 11366075
    Abstract: A household appliance and method for determining if an amount of deposition of scale exceeds a reference amount of deposition of scale may include obtaining a start temperature of a heating element, turning on the heating element at first point in time to heat the liquid from the liquid start temperature and simultaneously starting measuring a time interval from the first point in time, monitoring, at a second point in time, a behavior of the measured temperature of the heating element during heating of the liquid in the heating space in order to determine if a boiling temperature of the liquid has been reached, comparing the measured time interval with a reference heating duration and determining if the amount of deposition of scale on the heating element exceeds the reference amount of deposition of scale.
    Type: Grant
    Filed: April 28, 2017
    Date of Patent: June 21, 2022
    Inventors: Vendela Törnquist, Johan Waldebäck
  • Patent number: 11359975
    Abstract: Method, apparatus, and computer program product are provided for determining a maximum temperature to which a perishable good or other temperature sensitive item was exposed. In some embodiments, a capacitance of a circuit provided on a substrate is measured. The circuit includes capacitor(s) each having first and second plates separated from each other by an ionic liquid (IL) in a solid state. The IL melts at a predetermined temperature and flows away from the first and second plates into a void. In some embodiments, the predetermined temperature at which the IL melts is different for each capacitor. For example, each capacitor in the circuit may employ a different N-alkyl bezothiazolium salt. A maximum temperature of exposure is determined based on the measured capacitance. In some embodiments, a decision of whether to discard the perishable good or other temperature sensitive item may be based on the determined maximum temperature.
    Type: Grant
    Filed: February 8, 2019
    Date of Patent: June 14, 2022
    Assignee: International Business Machines Corporation
    Inventors: Sarah K. Czaplewski-Campbell, Joseph Kuczynski, Eric J. Campbell, Timothy J. Tofil
  • Patent number: 11346725
    Abstract: A temperature sensor for a cold reference junction of a thermocouple is provided that may be incorporated permanently or removeably in a releasable connector having a first connector part arranged to engage releasably with a second connector part in which the thermocouple conductors terminate, so forming a cold reference junction for the thermocouple. When the two parts of the connector are engaged, the temperature sensor of the present invention is able to sense the temperature in the vicinity of a cold reference junction in the connector. The temperature sensor may be provided by embedding one or more thermistors into a flexible disk or plate-like seal able to fit around the conductors of the first connector part such that the thermistors make electrical contact with selected conductors of the first connector part and thermal contact with the cold reference junction.
    Type: Grant
    Filed: February 22, 2018
    Date of Patent: May 31, 2022
    Assignee: BAE SYSTEMS plc
    Inventor: Stuart John Kitching
  • Patent number: 11333560
    Abstract: A heat-sensitive resistor with a negative or positive temperature coefficient comprises respectively an antimony-doped tin oxide-based resistive element or a carbon black-based resistive element, containing a polymer having a dielectric constant between 2 and 3, a molar mass between 50000 and 150000 g/mol, and a glass transition temperature Tg between 40 and 100° C.
    Type: Grant
    Filed: June 3, 2014
    Date of Patent: May 17, 2022
    Assignee: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
    Inventors: Abdelkader Aliane, Romain Coppard