Abstract: Rinsing methodologies and components to accomplish rinsing of tool surfaces in tools that are used to process one or more microelectronic workpieces. The invention can be used to rinse structures that overlie a workpiece being treated in such a manner to function in part as a lid over the process chamber while also defining a tapering flow channel over the workpiece. Rather than spray rinsing liquid onto the surface in a manner that generates undue splashing, droplet, or mist generation, a swirling flow of rinse liquid is generated on a surface of at least one fluid passage upstream from the surface to be rinsed. The swirling flow then provides smooth, uniform wetting and sheeting action to accomplish rinsing with a significantly reduced risk of generating particle contamination.
Abstract: The present invention relates to a brush assembly for cleaning metal, the assembly comprising one or more brush heads, each brush head comprising a bundle of conductive filaments, having a working end adapted for contacting metal, and a terminal end, the brush head connectable to an electricity supply, and a housing connected to and retaining at least one sheath, each sheath at least partially surrounding at least one brush head, wherein each brush head and its respective sheath are movable in relation to each other by operating an adjustment mechanism and the working end of the brush head and the sheath are selectively fixable in relation to each other.
June 7, 2013
Date of Patent:
January 30, 2018
Ensitech IP Pty Ltd.
Clive Stuart White, Mark Robert Fischer
Abstract: Disclosed is a substrate processing method. The method includes: supplying a rinse liquid, IPA, a first fluorine-containing organic solvent, a second fluorine-containing organic solvent to a wafer within an outer chamber of a liquid processing unit; conveying the wafer to a supercritical processing unit container; and supplying a supercritical processing fluorine-containing organic solvent in a supercritical high-pressure fluid state to the wafer within the supercritical processing unit container. At least during the supply of the IPA, a low-humidity N2 gas is supplied into the outer chamber so that the inside of the outer chamber is formed as a low-humidity N2 gas atmosphere, and thus moisture absorption into the IPA is prevented.
Abstract: Disclosed is a method for removing metal contamination present on an inner wall of a fluorine-based resin used in a chemical liquid supply line that supplies a chemical liquid to a workpiece. The method includes bringing some or all of a cleaning material reactive to a metal forming the metal contamination into a gaseous state; supplying the gaseous cleaning material to the chemical liquid supply line; and removing the metal contamination by reacting the gaseous cleaning material with the metal contamination present on the inner wall of the fluorine-based resin used in the chemical liquid supply line.
Abstract: Disclosed is a substrate processing method that includes a water-repellency step, a rinse step, and a dry step. In the water-repellency step, a water-repellent agent which is heated to a first predetermined temperature and then reaches a second predetermined temperature lower than the first predetermined temperature, is supplied to a substrate. In the rinse step, a rinse liquid is supplied to the substrate after the water-repellency step. In the dry step, the rinse liquid on the substrate after the rinse step is removed.
Abstract: A system includes a dome, a wiper assembly, a position sensor and a control device. The wiper assembly includes a wiper blade configured to rotate around the dome. The position sensor may be configured to send a signal to a control device when a wiper blade passes the position sensor. The control device may include one or more processors configured to receive the signal from the position sensor and determine a location of the wiper blade relative to the dome based on the received signal.
October 31, 2014
Date of Patent:
January 2, 2018
Graham Doorley, Paul Thomas Hansen Karplus, Peter Avram
Abstract: The present invention relates to a method and apparatus for cleaning an oil and gas well riser section or assembly on location offshore that includes a larger diameter central pipe and a plurality of smaller diameter pipes that are spaced radially away from the central larger diameter pipe. Even more particularly, the present invention relates to an improved method and apparatus for cleaning oil and gas well riser sections wherein a specially configured cap or pair of caps are fitted to the ends of the riser which enable pressure washing cleaning tools (or a camera) to be inserted into and through a selected one of the pipes including either a smaller diameter of the pipes or the central larger diameter pipe and wherein the cap continuously collects spent cleaning fluid and debris, allowing the cleaning process to be done on location without transporting the riser section back onshore.
Abstract: A barbeque grill scraper and related methods of use that utilize a scraping end formed of a heat-responsive material to remove char and other debris from the grilling surface. The grill scraper includes a conformable scraping edge formed of the heat-responsive material. As the conformable scraping edge is drawn back and forth along the heated grilling surface, a combination of pressure applied by a user as well as the heat of the grill surface results in the formation of individual grooves along the conformable scraping edge, wherein each groove is formed to match an upper profile of the grilling surface. Over time, the grooves fully conform to the upper profile of the grilling surface such that an entire cooking surface can be scraped clean of char and debris.
May 23, 2014
Date of Patent:
November 21, 2017
THOMPSON BROTHERS & COMPANY, LLC
Nathan A. Thompson, Joshua J. Thompson, Jason S. Thompson
Abstract: A cleaning device for cleaning items to be cleaned is proposed. The cleaning device includes at least one nozzle system for acting on the items to be cleaned with at least one cleaning fluid. Additionally the cleaning device includes at least one pump for conveying the cleaning fluid to the nozzle system, wherein the nozzle system comprises at least one high pressure nozzle and at least one low pressure nozzle. The high pressure nozzle and the low pressure nozzle are connected fluidically to the pump, wherein at least one fluidic switching element for adjusting an inflow of the cleaning fluid to the low pressure nozzle is connected upstream of the low pressure nozzle.
Abstract: A throughput in processing a substrate can be improved and a running cost thereof can be reduced. A substrate processing apparatus 1 that processes a substrate 3 with a processing liquid and dries the substrate 3 includes a substrate rotating device 22 configured to rotate the substrate 3; a processing liquid discharging unit 13 configured to discharge the processing liquid toward the substrate 3; a substitution liquid discharging unit 14 configured to discharge a substitution liquid, which is substituted with the processing liquid on the substrate 3, toward the substrate 3 while relatively moving with respect to the substrate 3; and an inert gas discharging unit 15 configured to discharge an inert gas toward a peripheral portion of the substrate 3 in an inclined direction from above the substrate 3 while moving in a direction different from a direction in which the substitution liquid discharging unit 14 is moved.
Abstract: A dishwasher (100) for pot washing, comprising a detector (160) for automatically detecting what type of washing basket (140) has been placed in the dishwasher (100). This enables automatic selection of water pressure and granule control, such that more sensitive crockery and plates are not damaged. The detector can be an inductive sensor (160) that detects an indicating member (141) of the washing basket. The washing basket can comprise one or several indicating members, for enabling a more reliable detection. A method of operating such a dishwasher (100) comprises the steps of automatically detecting what type of washing basket (140) is placed in the dishwasher, and then controlling the water pressure and granule addition according to what washing basket was detected. A system comprises an above dishwasher and an above washing basket.
Abstract: A breakdown voltage measuring method includes the steps of measuring a breakdown voltage of a semiconductor element in a state where a surface of the semiconductor element formed in a semiconductor substrate is covered with a high boiling point fluorine fluid having a boiling point of 90° C. or higher, and cleaning the semiconductor substrate, including the semiconductor element for which the breakdown voltage is measured, with a low boiling point fluorine inert fluid having a boiling point of 80° C. or lower. Accordingly, a breakdown voltage measuring method capable of suppressing generation of an electric discharge during the measurement of the breakdown voltage and suppressing a residue of a foreign object on the cleaned semiconductor substrate, and a semiconductor device to which the breakdown voltage measuring method is implemented are provided.
Abstract: An apparatus for cleaning flat objects such as semiconductor wafers with a pulsed liquid jet emitted from a group of nozzles that may be installed on one or on both sides of the wafer installed in a vertically arranged rotating chuck. The apparatus is comprised of a series of individual processing units, such as a loading unit, cleaning units, drying unit, and an unloading unit arranged circumferentially around a universal industrial robot capable of reaching any of the units and transferring the wafers between the units. Drying is carried out in a horizontal position of the wafer and may combine spin-dry with chemical treatment for accelerating the drying process and for improving quality of the drying process. All units are located in a sealed enclosure with a controlled purity of the atmosphere inside the enclosure. Method of cleaning is also disclosed.
Abstract: Clearing of apertures by plasma jets is described herein. One disclosed method includes applying a pulsed voltage to electrodes proximate an aperture of a surface to substantially clear the aperture of debris.
Abstract: An apparatus for clearing around an associated stationary object includes a housing having a top wall, a side wall, and at least one opening extending through the side wall. At least one paddle member is mounted to and extends radially outward from an exterior surface of the housing. The paddle member is adapted to clear around the associated stationary object. The apparatus further includes a plurality of elongated cables mounted to a support that is selectively secured to an interior surface of the housing. The elongated cables are adapted to clean around the associated stationary object.
Abstract: A conveyor dishwasher has at least one wash zone, at least one final rinse zone, and conveyor apparatus. In order to reduce the consumption of disinfection chemical and energy, but to nevertheless maintain a desired final rinse result, the final rinse liquid which is sprayed in the final rinse zone has a metered disinfection chemical, and at least one additional final rinse zone arranged downstream of the final rinse zone provided for spraying fresh water without a disinfection chemical onto the washware to be treated. The at least one additional final rinse zone has an associated collection device for collecting liquid which is sprayed in the additional final rinse zone. Furthermore, a liquid transfer system is provided, it being possible to supply the liquid which is collected in the collection device directly to the wash zone by means of said liquid transfer system.
Abstract: An apparatus and method for cleaning containers using water within the container and a submersible pump exhibiting a nozzle. Air may be injected into the pumped water to increase its pressure as it exists the nozzle.
Abstract: A method and apparatus capable of eliminating occurrence of a development failure when a DI water discharge nozzle 20 is scanned to dry a substrate by spinning. A substrate is held in a horizontal posture by a spin chuck and rotated about a vertical axis by a rotation motor, and when an outlet of the nozzle is scanned from a position opposed to a center of the substrate W to a position opposed to a circumferential edge while a cleaning solution being discharged, immediately after the nozzle has started to move, only one dried core is produced in the vicinity of the center of the substrate, and thus production of not less than two dried cores in the vicinity of the center of the substrate is prevented. The dried region is spread all over the surface of the substrate.
Abstract: In a process for cleaning contaminating silicon dioxide SiO2 off of turbine blades, silicon dioxide that is on the turbine blades is reduced selectively in a vacuum process that takes place in dry conditions and at elevated temperature inside a high vacuum furnace, by feeding gas having a reducing action, consisting of hydrogen gas or carbon monoxide, is introduced into the high vacuum furnace. The temperature inside the high vacuum furnace is at least about 1000 degrees Celsius, and the residence time of the turbine blades in the high vacuum furnace is determined with reference to the diminishment of the SiO concentration, as analyzed with a mass spectrometer. The electrically heatable high vacuum furnace is evacuable by means of a vacuum system that consists of a backing pump and a turbomolecular pump with an adjustable throttle valve and a water-cooled baffle.
Abstract: A dishwasher includes a rack provided with interior and exterior corner nozzles to direct washing fluid onto interior and exterior surface portions of an object placed in a corner of the rack.