Patents Examined by Nickolas Harm
  • Patent number: 9685579
    Abstract: A cleaving system is described. The system can include a holding apparatus to retain a photovoltaic structure at a center section of a cleaving platform. The system can further include a contact apparatus to make contact with the photovoltaic structure and separate it into a plurality of strips. During operation, the system can activate an actuator to move the contact apparatus against the photovoltaic structure, thereby separating the photovoltaic structure into strips.
    Type: Grant
    Filed: August 13, 2015
    Date of Patent: June 20, 2017
    Assignee: SolarCity Corporation
    Inventors: Pablo Gonzalez, Bobby Yang
  • Patent number: 9682544
    Abstract: A processing apparatus of a stack is provided. The stack includes two substrates attached to each other with a gap provided between their end portions. The processing apparatus includes a fixing mechanism that fixes part of the stack, a plurality of adsorption jigs that fix an outer peripheral edge of one of the substrates of the stack, and a wedge-shaped jig that is inserted into a corner of the stack. The plurality of adsorption jigs include a mechanism that allows the adsorption jigs to move separately in a vertical direction and a horizontal direction. The processing apparatus further includes a sensor sensing a position of the gap between the end portion in the stack. A tip of the wedge-shaped jig moves along a chamfer formed on an end surface of the stack. The wedge-shaped jig is inserted into the gap between the end portions in the stack.
    Type: Grant
    Filed: May 5, 2016
    Date of Patent: June 20, 2017
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Kayo Kumakura, Tomoya Aoyama, Akihiro Chida, Kohei Yokoyama, Masakatsu Ohno, Satoru Idojiri, Hisao Ikeda, Hiroki Adachi, Yoshiharu Hirakata, Shingo Eguchi, Yasuhiro Jinbo
  • Patent number: 9676918
    Abstract: A method is provided for de-bonding objects contained in an article at an interface between the objects, wherein the objects are joined at the interface through an intermediate layer, which involves applying energy from a radiation source, wherein the energy is sufficient to cause destruction of bonds within the intermediate layer; and separating the two objects from one another.
    Type: Grant
    Filed: June 15, 2016
    Date of Patent: June 13, 2017
    Assignee: IMMUNOLIGHT, LLC.
    Inventors: Zakaryae Fathi, John Pacanovsky, Frederic A. Bourke, Jr.
  • Patent number: 9670022
    Abstract: Apparatus for splicing expiring and replenishing webs of a web material includes first and second spaced platens having respective facing inner surfaces defining a passageway for transit of the expiring web, where the platens are adapted for displacement toward and away from one another in a reciprocating manner. The first platen is adapted to engage an end of the replenishing web, while the second platen is adapted to engage and position the moving expiring web. Moving the platens together with their respective inner surfaces in close proximity to one another causes a cutting die on the first platen to sever the expiring web forming outfeeding and infeeding ends of the expiring web, and to attach the expiring web's outfeeding end to the replenishing web. Attached to the second platen in facing relation to the first platen and engaging the expiring web is an ironing pad to ensure firm contact and adhesion of expiring web to the replenishing web.
    Type: Grant
    Filed: September 3, 2015
    Date of Patent: June 6, 2017
    Assignee: Tamarack Products, Inc.
    Inventor: David E. Machamer
  • Patent number: 9662831
    Abstract: A band pressing device in an edge banding machine including a glue applying roller includes first and second resilient members. The first resilient member has a first resilient section spaced apart from the glue applying roller at a first distance. The first resilient section generates a first biasing force pressing an edge band against the glue applying roller when the edge band has a thickness larger than the first distance. The second resilient member has a second resilient section spaced apart from the first resilient section at a second distance. The second resilient section generates a second biasing force pressing the first resilient section against the edge band when the first resilient section is deformed to deform the second resilient section.
    Type: Grant
    Filed: December 31, 2015
    Date of Patent: May 30, 2017
    Inventor: Chin-Chi Lin
  • Patent number: 9662872
    Abstract: Methods and tools for de-bonding and cleaning substrates are disclosed. A method includes de-bonding a surface of a first substrate from a second substrate, and after de-bonding, cleaning the surface of the first substrate. The cleaning comprises physically contacting a cleaning mechanism to the surface of the first substrate. A tool includes a de-bonding module and a cleaning module. The de-bonding module comprises a first chuck, a radiation source configured to emit radiation toward the first chuck, and a first robot arm having a vacuum system. The vacuum system is configured to secure and remove a substrate from the first chuck. The cleaning module comprises a second chuck, a spray nozzle configured to spray a fluid toward the second chuck, and a second robot arm having a cleaning device configured to physically contact the cleaning device to a substrate on the second chuck.
    Type: Grant
    Filed: October 24, 2016
    Date of Patent: May 30, 2017
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ying-Ching Shih, Jing-Cheng Lin, Szu-Wei Lu
  • Patent number: 9631327
    Abstract: A method for seaming artificial turf at its edges is provided. In some embodiments, the method includes providing a tape having a lower surface resting on a support surface, an upper surface underlying the edges of the artificial turf, and a hot melt pressure sensitive adhesive provided on the upper surface of the tape. After application of heat sufficient to soften the hot melt pressure sensitive adhesive, the layer of hot melt adhesive is bonded to the lower surface of the edges of the turf to the tape while the adhesive extends into valleys of the underside of the turf. Also provided is a heating cart for heating the adhesive and a method of using the heating cart to heat the adhesive.
    Type: Grant
    Filed: December 16, 2011
    Date of Patent: April 25, 2017
    Assignee: APT ADVANCED POLYMER TECHNOLOGY CORP.
    Inventors: Lawrence Joseph O'Connor, Timothy Alan O'Connor, Frank Keith Bonnell, William Mark Bobo
  • Patent number: 9630391
    Abstract: The present disclosure relates to a method and an apparatus for separating a flexible display film from a substrate. The method of separating a flexible display film from a substrate according to the present disclosure comprises the steps of dividing the substrate attached with the flexible display film on a side thereof into a plurality of pieces, and separating part or all of the plurality of pieces from the flexible display film. The apparatus for separating a flexible display film from a substrate according to the present disclosure comprises a division component configured to divide the substrate attached with the flexible display film on a side thereof into the plurality of pieces, and a substrate-film separation component configured to separate part or all of the pieces from the flexible display film.
    Type: Grant
    Filed: May 26, 2014
    Date of Patent: April 25, 2017
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventor: Dejiang Zhao
  • Patent number: 9623648
    Abstract: A method of detaching a sub-substrate from a substrate includes providing a first sub-substrate attached to a first substrate having a rectangular shape with first and second sides extending in a first direction and third and fourth sides extending in a second direction crossing the first direction, inserting a separating member between the first sub-substrate and the first substrate to partially detach therebetween, attaching a plurality of pads arranged in a matrix pattern to the first sub-substrate, lifting first pads among the plurality of pads arranged in a third direction crossing the first and second directions, lifting second pads, at least two of the second pads being arranged in the second direction, and at least two of the second pads being arranged in the third direction, and lifting third pads arranged in the second direction.
    Type: Grant
    Filed: June 5, 2015
    Date of Patent: April 18, 2017
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Tae-Hwan Kim, Man-Hong Na, Jong-Hwan Lee
  • Patent number: 9623647
    Abstract: A film stripping apparatus is provided, belongs to a material film-stripping technical field and can solve the problem that the current film stripping technologies are easy to lead to waste contamination, high cost and limited applicability. The film stripping apparatus includes: at least one film stripping roller of adhesiveness; a feeding mechanism for loading a material from which a film is to be stripped into a feeding side of the film stripping roller; and a driving mechanism for driving the film stripping roller to rotate. The film stripping apparatus is used for stripping off film layers, such as single-sided or double-sided protective films, release films or the like on materials of any raw material, size, thickness and shape, and the film stripping apparatus can be used for optical film materials, printing plates, display panels etc, and is suitable for ultra-thin materials, high precision printing plates and the like precision materials.
    Type: Grant
    Filed: May 23, 2013
    Date of Patent: April 18, 2017
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., BOE OPTICAL SCIENCE AND TECHNOLOGY CO., LTD.
    Inventor: David Yan
  • Patent number: 9616652
    Abstract: The present disclosure provides a system for removing a touch panel from a display panel. The system includes: a carrying device on which the display panel adhered with the touch panel is placed; a heating device configured to heat an adhesive between the touch panel and the display panel; and a cutting device arranged on the carrying device and configured to cut the adhesive so as to remove the touch panel from the display panel.
    Type: Grant
    Filed: May 21, 2014
    Date of Patent: April 11, 2017
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., HEFEI BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Fangfang Wu, Long Xia
  • Patent number: 9604443
    Abstract: A stripping device and method for stripping a plastic film from a glass substrate are provided. The stripping device includes a roller and a support member. The support member is disposed at a position where the plastic film is separated from the glass substrate. The support member supports and/or stretches the stripped plastic film. The roller is used to roll up the plastic film supported and/or stretched by the support member. Because the support member stretches and/or supports the plastic film as it is removed from the glass substrate, the plastic film is bent at a rounded angle. This reduces the stress generated in the plastic film during bending, thereby decreasing cracks in the plastic film and improving the overall useable yield of the plastic film.
    Type: Grant
    Filed: August 8, 2014
    Date of Patent: March 28, 2017
    Assignee: Boe Technology Group Co., Ltd.
    Inventor: Tao Sun
  • Patent number: 9601365
    Abstract: A peeling device separates a superposed substrate, in which a target substrate and a support substrate are joined to each other with an adhesive, into the target substrate and the support substrate. The peeling device includes a holding unit configured to hold the superposed substrate, and a plurality of position adjustment units movable forward and backward with respect to a side surface of the superposed substrate held in the holding unit, and the position adjustment unit configured to perform a position adjustment of the superposed substrate by contacting the side surface of the superposed substrate.
    Type: Grant
    Filed: April 28, 2014
    Date of Patent: March 21, 2017
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Masaru Honda, Ryoichi Sakamoto
  • Patent number: 9592659
    Abstract: A device body comprises: a winding roller that is provided so as to contact with a flooring material sheet bonded to a floor and on which is wound the sheet that is stripped from the floor starting from a contact portion with the sheet; a driving means that, by rotationally driving the winding roller, winds the sheet onto the winding roller and strips the same from the floor, and that advances the device body by the winding roller being pushed toward the floor by the reactive force of the removal and rolling on the sheet; and a guiding means that discharges the sheet being stripped from the floor in front of or to the side of the direction of advancement of the device body.
    Type: Grant
    Filed: August 1, 2013
    Date of Patent: March 14, 2017
    Assignee: INTERIOR ITOH LTD.
    Inventor: Katsunori Itoh
  • Patent number: 9586313
    Abstract: The present teachings provide for a weeding table including a table portion, a clamp device, and a heating mechanism. The table portion can include a table member and a work-surface. The clamp device can include a clamp and a cylinder. The clamp can include a base fixedly coupled to the table member and an arm coupled to the base. The arm can be movable relative to the base between a first position and a second position. The cylinder can be coupled to the arm to be translated thereby such that the cylinder is a greater distance from the work-surface when the arm is in the first position than when the arm is in the second position. The cylinder can be rotatable relative to the arm about a longitudinal axis of the cylinder. The heating mechanism can be coupled to the table member and can be configured to heat the work-surface.
    Type: Grant
    Filed: June 22, 2015
    Date of Patent: March 7, 2017
    Assignee: GROUPESTAHL
    Inventors: Benjamin Robinson, Rich Antoszewski
  • Patent number: 9583374
    Abstract: Described methods and apparatus provide a controlled perturbation to an adhesive bond between a device wafer and a carrier wafer. The controlled perturbation, which can be mechanical, chemical, thermal, or radiative, facilitates the separation of the two wafers without damaging the device wafer. The controlled perturbation initiates a crack either within the adhesive joining the two wafers, at an interface within the adhesive layer (such as between a release layer and the adhesive), or at a wafer/adhesive interface. The crack can then be propagated using any of the foregoing methods, or combinations thereof, used to initiate the crack.
    Type: Grant
    Filed: June 21, 2016
    Date of Patent: February 28, 2017
    Assignee: SUSS MicroTec Lithography GmbH
    Inventors: Gregory George, Christopher Rosenthal
  • Patent number: 9573330
    Abstract: The subject invention includes methods and apparatus for joining treads. Such methods include the step of providing a first tread portion and a second tread portion for forming a joined tread, each tread portion comprising a section of tire tread extending lengthwise from a terminal end. Additional steps include providing a first fixture configured to retain the first tread portion and a second fixture configured to retain the second tread portion and securing the first tread portion into the first fixture and securing the second tread portion into the second fixture, each of the first and second fixtures being arranged within the first and second fixtures such that the terminal end of each tread portion is in communication with a joining side of each fixture. The methods further include directing the terminal ends towards each other and into forceful engagement with an elastomeric joining material arranged between the terminal ends.
    Type: Grant
    Filed: March 9, 2016
    Date of Patent: February 21, 2017
    Assignees: Compagnie Generale des Etablissements Michelin, Michelin Recherche et Technique S.A.
    Inventors: Chinglin Pan, David Chan Wah Lung, Michael D. Petrovich
  • Patent number: 9576854
    Abstract: Provided is a peeling apparatus configured to suppress damage to a substrate, by forming a peeling start point. The peeling apparatus separates a superimposed substrate made by joining first and second substrates into the first and second substrates, and includes a blade configured to form a notch as a peeling start point between the first and second substrates, and an inspection unit configured to inspect a state of a cutting edge of the blade. The inspection unit includes an imaging unit configured to image the cutting edge of the blade, and an image processing unit configured to process an image of the imaging unit.
    Type: Grant
    Filed: January 27, 2016
    Date of Patent: February 21, 2017
    Assignee: Tokyo Electron Limited
    Inventors: Masanori Itou, Ryoichi Sakamoto
  • Patent number: 9578793
    Abstract: A component supplying apparatus comprises an inclined straight path P2 which is for the carrier tape and which extends obliquely upward, a horizontal straight path P3 which is for the carrier tape and which extends in the horizontal direction from a front end of the inclined path P2 and runs through the component supply position Q, a first sprocket wheel engaging with the feed holes of the carrier tape within the inclined path P2, a guide member locating the carrier tape in the width direction within the horizontal path, a top tape removing device disposed above the inclined path P2 between the first sprocket wheel and the horizontal path P3 and partially removing the top tape from the base tape so as to expose the components, and a sprocket wheel drive device rotating the first sprocket wheel.
    Type: Grant
    Filed: February 15, 2013
    Date of Patent: February 21, 2017
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Minoru Kitani, Motohiro Higuchi, Shigeru Matsukawa, Kazuo Kido
  • Patent number: 9578795
    Abstract: A method for extracting components includes the steps of heating an electronic device having one or more components to a predetermined temperature so as to substantially weaken a bonding substance arranged to bond the one or more components to the electronic device, and thereafter manipulating the electronic device to extract the one or more components from the electronic device.
    Type: Grant
    Filed: February 13, 2015
    Date of Patent: February 21, 2017
    Assignee: Li Tong (H.K.) Telecom Company Limited
    Inventors: Lei Zhang, Ming-Tong Wang