Patents Examined by Paul D Kim
  • Patent number: 11819127
    Abstract: A panel television support and mounting kit allows the consumer to employ any of the three modes of support, namely stand mount, elevated console mount and wall mount. The elevated console mount incorporates a vertical spine to elevate the panel television above the console and an offset arm to support the television over an upper shelf of the console. A mounting structure is provided that can be attached to the spine or to a wall. Pivoting and tilting is accommodated by the mounting structure.
    Type: Grant
    Filed: April 18, 2022
    Date of Patent: November 21, 2023
    Assignee: Whalen LLC
    Inventors: Kenneth Whalen, Paul Jones
  • Patent number: 11818845
    Abstract: A component mounter includes a pickup member configured to pick up a component, and a control device. When a predetermined error occurs after a pickup operation that picks up the component is performed by the pickup member, the control device stops production in a state where the component, which is a target of an error, is held by the pickup member, in a case where a number of boards produced from a start of production is within a predetermined number of the boards, performs a retry operation that discards the component picked up by the pickup member and picks up a new component, in a case where the number of the boards produced from the start of production exceeds the predetermined number of the boards, and stops production when the error is not resolved even if the retry operation is performed.
    Type: Grant
    Filed: June 17, 2019
    Date of Patent: November 14, 2023
    Inventor: Tomohiro Yamazaki
  • Patent number: 11817244
    Abstract: An electronic component includes a body made of an insulator, a coating film covering the body, a conductor located in the body, and outer electrodes each of which is connected to the conductor. The insulator contains a magnetic metal powder. The coating film is composed of resin and cations of a metal which is a cationic element contained in the insulator and which has a standard electrode potential E0 of less than about 0 V.
    Type: Grant
    Filed: November 23, 2020
    Date of Patent: November 14, 2023
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Mitsunori Inoue, Hironobu Kubota
  • Patent number: 11811278
    Abstract: A method for producing an electromagnetic component for an electric machine is provided. The method includes providing a metal sheet as a starting material; punching out a number of lamellae from the metal sheet; heat-treating the lamellae; and joining the heat-treated lamellae to form the component or a portion of the component. The electromagnetic component to be produced can be a laminated core, for example a stator core or a rotor core, and can be provided for use with the electric machine such as an electric motor.
    Type: Grant
    Filed: January 17, 2020
    Date of Patent: November 7, 2023
    Assignee: ThyssenKrupp Steel Europe AG
    Inventors: Tobias Lewe, Karsten Machalitza, Volker Kamen, Marco Tietz
  • Patent number: 11805574
    Abstract: A method for obtaining a heating element for an electronic vapor provision system, the method including providing a sheet of electrically conductive porous material, directing light onto at least a portion of the sheet, detecting an amount of the light transmitted through the portion of the sheet, comparing the amount of light detected to a range of light transmission values known to correspond to a predetermined range of electrical resistance values required for the portion, and selecting the portion of the sheet for use as a heating element if the amount of detected light lies within the range of light transmission values, and otherwise rejecting the portion of the sheet.
    Type: Grant
    Filed: January 30, 2018
    Date of Patent: October 31, 2023
    Assignee: Nicoventures Trading Limited
    Inventor: Howard Rothwell
  • Patent number: 11804760
    Abstract: A method is presented for producing an arrangement for a plug-in coil of an electric machine, having the following steps: providing an arrangement of coil elements, which each are embodied as a rod-shaped coil element and are pre-aligned with one another; gripping the arrangement of coil elements by way of a grip apparatus, wherein the grip apparatus grips the arrangement of coil element by way of a first grip device in a first grip plane and by way of a second grip device in a second grip plane which is arranged beneath the first grip plane and at a distance therefrom; holding the arrangement of coil elements by way of the grip apparatus and inserting legs of the coil element into allocated grooves of a core; and releasing the grip apparatus from the arrangement of coil elements.
    Type: Grant
    Filed: October 11, 2018
    Date of Patent: October 31, 2023
    Assignee: Aumann AG
    Inventors: Georg Feidieker, Bernd Radtke, Gerold Specht, Jan Felix Woerdehoff
  • Patent number: 11796568
    Abstract: Cantilever probes are produced for use in a test apparatus of integrated electronic circuits. The probes are configured to contact corresponding terminals of the electronic circuits to be tested during a test operation. The probe bodies are formed of electrically conductive materials. On a lower portion of each probe body that, in use, is directed to the respective terminal to be contacted, an electrically conductive contact region is formed having a first hardness value equal to or greater than 300 HV; each contact region and the respective probe body form the corresponding probe.
    Type: Grant
    Filed: October 7, 2021
    Date of Patent: October 24, 2023
    Assignee: STMicroelectronics S.r.l.
    Inventor: Alberto Pagani
  • Patent number: 11791089
    Abstract: A coil component includes a cup, a magnetic core, an electric conductor wound around the core, a cover, which closes the cup, and electric terminal contacts, which are in electric contact with ends of the electric conductor. The core and the electric conductor are arranged in the cup and the cup is filled with potting compound.
    Type: Grant
    Filed: April 20, 2018
    Date of Patent: October 17, 2023
    Assignee: Schmidhauser AG
    Inventors: Christof Schneggenburger, Dirk Schekulin, Bernhard Laeng, Silvia Gross-Kaeufler, Tobias Diefenbacher
  • Patent number: 11792968
    Abstract: An automatic conveyance apparatus includes a first loading surface, an adjustment device, a movement device, and a control section. The control section drives the movement device to move the member between the first loading surface and the second loading surface when the automatic conveyance apparatus is positioned at a member delivery position and/or a member pickup position where the automatic conveyance apparatus delivers and/or picks up the member and when the height and the inclination of the first loading surface are adjusted in accordance with the height position and the inclination position of the second loading surface by the adjustment device. The automatic conveyance apparatus is configured to travel between multiple predetermined positions including the member delivery position and/or the member pickup position.
    Type: Grant
    Filed: August 1, 2019
    Date of Patent: October 17, 2023
    Inventor: Masaki Murai
  • Patent number: 11791094
    Abstract: A method of forming a magnetic core on a substrate having a stacked inductor coil includes etching a plurality of polymer layers to form at least one feature through the plurality of polymer layers, wherein the at least one feature is disposed within a central region of a stacked inductor coil formed on the substrate; and depositing a magnetic material within the at least one feature.
    Type: Grant
    Filed: April 11, 2021
    Date of Patent: October 17, 2023
    Inventors: Peng Suo, Yu Gu, Guan Huei See, Arvind Sundarrajan
  • Patent number: 11791079
    Abstract: A coating layer is formed on a coil made of an insulated conductive wire comprising a metal wire and an insulating layer encapsulating the metal layer, wherein the coating layer encapsulates at least one portion of the insulating layer of the insulated conductive wire so that a terminal part of the metal wire exposed from the insulating layer can be positioned firmly while going through an automatic soldering process for electrically connecting with an external circuit.
    Type: Grant
    Filed: March 17, 2020
    Date of Patent: October 17, 2023
    Assignee: CYNTEC CO., LTD.
    Inventors: Min-Feng Chung, Ching Hsiang Yu, Kuan Yu Chiu, Yu-Hsin Lin
  • Patent number: 11785754
    Abstract: Support blocks for printed circuit boards (PCB's) and printed circuit board assemblies (PCBA's), wherein the support blocks are produced from a 3D printing process. The support block including a bottom surface having a vacuum connection; a top surface having at least one vacuum hole; at least one recessed surface that is offset from the top surface; and at least one vacuum channel extending from the vacuum connection to the at least one vacuum hole.
    Type: Grant
    Filed: June 21, 2022
    Date of Patent: October 10, 2023
    Assignee: JABIL INC.
    Inventors: Darin Burgess, Randy Crockett, Timothy DeRosett, Charles Santhakumar, Scott Klimczak, Anwar A. Mohammed, Luke Rodgers, Harpuneet Singh, Daniel Torres, Felipe Torres
  • Patent number: 11784211
    Abstract: The present disclosure relates to, in part, an inductor structure that includes an etch stop layer arranged over an interconnect structure overlying a substrate. A magnetic structure includes a plurality of stacked layers is arranged over the etch stop layer. The magnetic structure includes a bottommost layer that is wider than a topmost layer. A first conductive wire and a second conductive wire extend in parallel over the magnetic structure. The magnetic structure is configured to modify magnetic fields generated by the first and second conductive wires. A pattern enhancement layer is arranged between the bottommost layer of the magnetic structure and the etch stop layer. The pattern enhancement layer has a first thickness, and the bottommost layer of the magnetic structure has a second thickness that is less than the first thickness.
    Type: Grant
    Filed: May 27, 2020
    Date of Patent: October 10, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hung-Wen Hsu, Po-Han Huang, Wei-Li Huang
  • Patent number: 11784451
    Abstract: A clamping jaw of a connecting terminal includes a rotary cylinder assembly configured for achieving different swing angles for clamping different types of connecting terminals. The rotary cylinder assembly includes a rotating shaft for providing a driving force through rotating cylinder and an initial state limit part. A first state limit part is configured to position the rotating cylinder in a first rotation angle and a second state limit part has a working and non-working position. When the second state limit part is in the working position, it is configured to position the rotating cylinder in a second rotation angle. When the second state limit part is in the non-working position, it is configured to position the rotating cylinder in the first rotation angle. The second rotation angle is smaller than the first rotation angle.
    Type: Grant
    Filed: June 24, 2020
    Date of Patent: October 10, 2023
    Inventor: Yunchang Ma
  • Patent number: 11776422
    Abstract: There is described a method for assembling or repairing an electrical cable in an environment. The method comprises obtaining a unique identifier of an origin connector of the electrical cable to be assembled or repaired. A computing device receives a reading of the unique identifier of the origin connector of the electrical cable to be assembled or repaired and identifies a connection between the origin connector of the electrical cable to be assembled or repaired and a destination electrical component. At the computing device, there is made a determination of the connection that was identified with a connectivity list required for the electrical cable, from a database, to determine a next step of the assembling or the repairing which depends on the connection identified by the computing device.
    Type: Grant
    Filed: November 29, 2021
    Date of Patent: October 3, 2023
    Inventor: Alain Lussier
  • Patent number: 11771872
    Abstract: Guidewires having conductive elements are described where in one variation, the guidewire may be formed by disposing an insulative layer upon a surface of the guidewire core, and printing one or more conductive traces directly upon a surface of the insulative layer.
    Type: Grant
    Filed: December 28, 2021
    Date of Patent: October 3, 2023
    Inventors: Nitin Patil, Philip R. Houle
  • Patent number: 11766696
    Abstract: A method of forming an ultrasonic transducer device includes forming a patterned metal electrode layer over a substrate, the patterned metal electrode layer comprising a lower layer and an upper layer formed on the lower layer; forming an insulation layer over the patterned metal electrode layer; and planarizing the insulation layer to the upper layer of the patterned metal electrode layer, wherein the upper layer comprises a electrically conductive material that serves as a chemical mechanical polishing (CMP) stop layer that has CMP selectivity with respect to the insulation layer and the lower layer, and wherein the upper layer has a CMP removal rate slower than that of the insulation layer.
    Type: Grant
    Filed: February 6, 2020
    Date of Patent: September 26, 2023
    Inventors: Lingyun Miao, Jianwei Liu, Jonathan M. Rothberg
  • Patent number: 11769978
    Abstract: An assembly system includes a robot, a first gripper mounted on the robot, the first gripper gripping a first housing, and a first clamping device clamping a cable and a contact connected to an end of the cable. The robot moves the first gripper and assembles the first housing gripped by the first gripper onto the contact held by the first clamping device.
    Type: Grant
    Filed: December 3, 2019
    Date of Patent: September 26, 2023
    Assignees: TE Connectivity Solutions GmbH Tyco, Electronics (Shanghai) Co., Ltd., Kunshan League Automechanism Co., Ltd.
    Inventors: Yingcong Deng, Dandan Zhang, Lvhai Hu, An Yang, Jian Cao, Yun Liu, Roberto Franciso-Yi Lu, Yuting He, Haidong Wu, Hui Xiao
  • Patent number: 11765876
    Abstract: An exchange device to exchange an exchangeable element includes an arrangement directional moving section to move with respect to the component mounting device in the arrangement direction; multiple attachment/detachment directional moving sections provided in the arrangement directional moving section to move independently of each other in the attachment/detachment direction of the exchangeable element; at least one holding section provided in each of the multiple attachment/detachment directional moving sections to hold the exchangeable element; an arrangement direction driving device to move the arrangement directional moving section in the arrangement direction; and an attachment/detachment direction driving device to move multiple attachment/detachment directional moving sections, independently of each other, in the attachment/detachment direction.
    Type: Grant
    Filed: June 12, 2018
    Date of Patent: September 19, 2023
    Inventor: Masahiro Kondo
  • Patent number: 11763985
    Abstract: A method of manufacturing a coil component includes arranging a plurality of coil conductors that is a wound body of a conductive wire, and each has opposing first and second surfaces, in a winding axis direction on a surface of an adhesive layer in contact with the first surface, manufacturing a processed body by placing a first magnetic sheet including a first metal magnetic particle and a first resin on a side of the second surface of each of the coil conductors and performing press processing on the first magnetic sheet, manufacturing an aggregate base body by peeling the processed body from the adhesive layer, placing a second magnetic sheet including a second metal magnetic particle and a second resin on a side of the first surface of each coil conductor, and press processing the second magnetic sheet, and manufacturing a body by individualizing the aggregate base body.
    Type: Grant
    Filed: September 28, 2020
    Date of Patent: September 19, 2023
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Keisuke Takatsu