Patents Examined by Paul D Kim
  • Patent number: 11449784
    Abstract: In many cases after degaussing the field distribution in a magnetic material there may be regions within the magnetic material that have ordered domains that contribute a remnant field. There is the need to reduce or eliminate non-uniform fields within a volume of interest left after degaussing a magnetic shield. Degaussing coils surrounding a metal shield can be used to favorably order magnetic domains within the material to counteract the remnant fields left behind following imperfect degaussing. The remnant field value can be measured and a small current may be applied through the degaussing coils. After removing the current, the field can be measured again and a higher current may be applied again through the coils. Repeated applications of currents and field measurement will progressively order domains in the direction of the applied field, resulting in a reduction of the net field and lower field gradient across the volume of interest.
    Type: Grant
    Filed: July 16, 2020
    Date of Patent: September 20, 2022
    Assignee: D-WAVE SYSTEMS INC.
    Inventor: George E. G. Sterling
  • Patent number: 11450478
    Abstract: An assembly device for a three-dimensional triangular iron core is provided according to the present application, including iron core driving devices each for driving an iron core to be assembled with adjacent iron cores. There are three iron core driving devices, and each of the iron core driving devices includes an iron core fixing device and a driving assembly for driving the iron core fixing device to move. When the three-dimensional triangular iron core is required to be assembled, firstly, the three iron cores are mounted on the corresponding iron core fixing devices respectively, then the iron core fixing devices are driven by driving assemblies to move toward one another, thereby driving adjacent iron cores to move toward each other until the adjacent iron cores are assembled, and then each two adjacent iron cores are wound and assembled.
    Type: Grant
    Filed: December 12, 2018
    Date of Patent: September 20, 2022
    Assignee: QINGDAO YUNLU ADVANCED MATERIALS TECHNOLOGY CO., LTD.
    Inventors: Xiaoyu Li, Jing Pang, Qinghua Li, Chen Li, Fei Cheng
  • Patent number: 11452203
    Abstract: A wiring assembly board for assembling a wire harness. The wire harness comprises a plurality of wires connected between a plurality of wiring connectors, each connector comprising an array of wire terminals. The wiring assembly board comprises an assembly surface and a plurality of test connectors provided on the assembly surface. Each test connector is for connection to a respective wiring connector and comprises an array of test terminals for establishing an electrical connection with the respective array of wire terminals once the wiring and test connectors have been connected. A microcomputer is associated with each test connector and comprises an interface for individually transmitting or receiving test signals though each test terminal of the respective test connector.
    Type: Grant
    Filed: February 9, 2021
    Date of Patent: September 20, 2022
    Assignee: Aptiv Technologies Limited
    Inventors: Marcin Szelest, Pawel Skruch
  • Patent number: 11445649
    Abstract: A component mounting system that includes a unit exchange device configured to automatically exchange the component supply unit and a processing section configured to determine whether the attachment and detachment of the component supply unit is performed according to the attachment and detachment instruction based on the attachment and detachment record acquired by an acquisition section and the instruction list, and when it is determined that the attachment and detachment is performed according to the attachment and detachment instruction, to perform an update process to update the instruction list by deleting the corresponding attachment and detachment instruction.
    Type: Grant
    Filed: August 1, 2018
    Date of Patent: September 13, 2022
    Assignee: FUJI CORPORATION
    Inventor: Mitsuru Sanji
  • Patent number: 11443879
    Abstract: An integrated magnetic device has a magnetic core which includes layers of the magnetic material located in a trench in a dielectric layer. The magnetic material layers are flat and parallel to a bottom of the trench, and do not extend upward along sides of the trench. The integrated magnetic device is formed by forming layers of the magnetic material over the dielectric layer and extending into the trench. A protective layer is formed over the magnetic material layers. The magnetic material layers are removed from over the dielectric layer, leaving the magnetic material layers and a portion of the protective layer in the trench. The magnetic material layers along sides of the trench are subsequently removed. The magnetic material layers along the bottom of the trench provide the magnetic core.
    Type: Grant
    Filed: July 16, 2019
    Date of Patent: September 13, 2022
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Fuchao Wang, Yousong Zhang, Neal Thomas Murphy, Brian Zinn, Jonathan P. Davis
  • Patent number: 11443881
    Abstract: Sheet metal construction is described for achieving high strength at low weight for a power reactor and for an impedance injection module incorporating the power reactor. Clamping plates are used to retain the core and the windings of the reactor. Integrated features of a specialized frame of the impedance injection module include flanges for structural rigidity, a convenient yoke plate for lifting by crane, feet for mounting insulators, and sufficient strength to maintain mechanical integrity during normal operation and also during fault conditions. The specialized frame provides a light weight assembly suitable for mounting on power transmission lines as well as on ground assemblies. The specialized frame can reduce the cost of the total enclosure to around 25% of the cost and 50% of the weight of an equivalent conventional enclosure. An insulation topology is also described.
    Type: Grant
    Filed: July 24, 2019
    Date of Patent: September 13, 2022
    Assignee: Smart Wires Inc.
    Inventor: Ali Farahani
  • Patent number: 11437765
    Abstract: A connector assembly including a connector body with a spring clip including a first free end for engaging a side wall of an electrical box upon installation. During insertion of the connector body the first free end engages the knock-out hole perimeter and deforms so as to permit further insertion. An alignment rib also engages the perimeter to improve continuity between the connector assembly and the electrical box.
    Type: Grant
    Filed: February 7, 2020
    Date of Patent: September 6, 2022
    Assignee: Bridgeport Fittings, LLC
    Inventor: Lawrence J. Smith
  • Patent number: 11439051
    Abstract: A grounding includes a photoelectric sensor that emits light to a detection region in which the detection target portion moves in conjunction with the grounding of the electronic component to a board and receives light from the detection region, and a grounding discrimination section that discriminates between the presence or absence of the grounding based on a signal from the photoelectric sensor. The detection target portion is disposed in the detection region in the ungrounded state.
    Type: Grant
    Filed: January 10, 2018
    Date of Patent: September 6, 2022
    Assignee: FUJI CORPORATION
    Inventor: Kenzo Ishikawa
  • Patent number: 11429088
    Abstract: A method and apparatus for efficiently dismantling hard disk drives, including a holder assembly to clamp a hard disk drive, a scanner that reads identification information of the hard disk drive. A chain conveyor belt indexes the hard disk drive to a position at which a logic board of the hard disk drive is peeled off and dropped into a bin, and to a position at which a lid of the hard disk drive is separated from a housing by way of a wedge, and indexes to a punch position at which magnets are punched in a direction from the logic board side of the hard disk drive. By separating and disposing the logic board and the lid, each hard disk drive is efficiently and securely dismantled.
    Type: Grant
    Filed: December 8, 2020
    Date of Patent: August 30, 2022
    Inventor: Jack Harper
  • Patent number: 11422162
    Abstract: Current transducer including a housing comprising a coil support, a magnetic core extending between a first end and a second end, and a coil comprising a plurality of windings formed around the coil support. The coil support comprises a core receiving channel within which the magnetic core is inserted, the coil support comprising a radially inner support portion and a radially outer support portion between which the core receiving channel is disposed. The radially inner support portion is slidably movable with respect to the radially outer support portion.
    Type: Grant
    Filed: March 18, 2020
    Date of Patent: August 23, 2022
    Assignee: LEM International SA
    Inventors: Félix Buhlmann, Pascal Morel
  • Patent number: 11424562
    Abstract: A press-fit insertion method is provided. The press-fit insertion method includes loading press-fit pins into a connector, heating a printed circuit board (PCB) defining plated through holes (PTHs) into which the press-fit pins are insertable and pressing the connector onto the PCB to insert the press-fit pins into the PTHs with the PCB remaining heated.
    Type: Grant
    Filed: February 28, 2020
    Date of Patent: August 23, 2022
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: John R. Dangler, David J. Braun, Theron Lee Lewis
  • Patent number: 11417463
    Abstract: Disclosed are a method for manufacturing a coil, a coil, and an electronic device. The method includes: bonding a first side of a metal sheet onto a laser-transmitting substrate by an adhesive layer; cutting a coil pattern on a second side of the metal sheet by the laser to form a coil running through the two sides of the metal sheet on the metal sheet; bonding the second side of the metal sheet onto an adhesive tape; transmitting the laser through the laser-transmitting substrate to act on the adhesive layer to detach the laser-transmitting substrate and the adhesive layer from the first side of the metal sheet; exposing the coil pattern on the first side of the metal sheet; and forming an encapsulation layer on the coil to encapsulate the first side of the coil.
    Type: Grant
    Filed: September 5, 2017
    Date of Patent: August 16, 2022
    Assignee: Goertek Inc.
    Inventors: Quanbo Zou, Zhe Wang, Qinglin Song, Debo Sun
  • Patent number: 11412650
    Abstract: A pick and place machine includes a feeder system configured to feed components to a picking location, a dispensing head configured to pick fed components from the picking location, a vision system configured to detect features of components picked by the dispensing head. The vision system includes an image capture device pointed in a direction. The pick and place machine further includes an illumination device that includes a plurality of light sources each configured to produce light having a controlled thickness and at a controlled angle relative to the direction. The controlled angle is configured to be non-normal with respect to the direction at which the image capture device is pointed.
    Type: Grant
    Filed: September 27, 2018
    Date of Patent: August 9, 2022
    Assignee: UNIVERSAL INSTRUMENTS CORPORATION
    Inventor: George D. Eck
  • Patent number: 11404944
    Abstract: Disclosed is a method for manufacturing an MSO coil, comprising: a pressing step of forming a bent surface on a part of a unit coil layer, which has a ring shape such that both ends thereof face each other, thereby endowing both ends of the unit coil layer with a height difference; a fixing step of connecting and fixing a plurality of unit coil layers to each other, each unit coil layer having the bent surface formed thereon, such that the first end of both ends of a unit coil layer having the bent surface formed thereon contacts the second end of both ends of another unit coil layer having the bent surface formed thereon; and a bonding step of bonding connection parts defined by contact of the first and second ends of each of the plurality of unit coil layers that are connected and fixed to each other.
    Type: Grant
    Filed: December 1, 2017
    Date of Patent: August 2, 2022
    Assignee: KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY
    Inventors: Eui Chun Lee, Soon O Kwon, Ho Young Lee, Su Woong Lee, Kang Won Lee
  • Patent number: 11390005
    Abstract: A method for manufacturing a Z-directed component for insertion into a mounting hole in a printed circuit board according to one example embodiment includes simultaneously extruding a plurality of materials according to the structure of the Z-directed component to form an extruded object and forming the Z-directed component from the extruded object. In one embodiment, the extruded object is divided into individual Z-directed components. In one embodiment, the timing of extrusion between predetermined sections of one of the materials is varied in order to stagger the sections in the extruded object.
    Type: Grant
    Filed: November 13, 2018
    Date of Patent: July 19, 2022
    Assignee: Lexmark International, Inc.
    Inventors: Keith Bryan Hardin, Zachary Charles Nathan Kratzer, Qing Zhang
  • Patent number: 11388851
    Abstract: A component mounter includes a mounting tool to receive the electronic component in a component supply position and release the electronic component at a predetermined position on the board; an accommodation section accommodating mounting tools of multiple types; a head configured to detachably mount thereon a single mounting tool selected from the mounting tools of the multiple types in the accommodation section; a moving mechanism to move the head between the component supply position and the predetermined position on the board; an abnormality detecting section to detect an abnormality in relation to the mounting tool; and a selection section to select the mounting tool to be mounted on the head, and select a mounting tool of a second type, which differs from the mounting tool of a first type which is being mounted on the head, when the abnormality is detected by the abnormality detecting section.
    Type: Grant
    Filed: March 9, 2018
    Date of Patent: July 12, 2022
    Assignee: FUJI CORPORATION
    Inventor: Hiroyuki Ao
  • Patent number: 11374372
    Abstract: A device (1) for crimping connection elements (2). The device (1) comprises a machine frame (5), at least one punch, a drive assembly, at least one anvil (17), and a working chamber (31). The punch (3) is preferably arranged in a movable manner in relation to the machine frame (5). The punch (3) contains at least one working surface (4) for deforming a connection element (2). The drive assembly for moving the punch (3) is connected to the punch. The anvil (17) is connected to the machine frame (5) and has a receiving surface (8) for the connection element (2). The working chamber is located between the punch and the anvil and is opened and closed by a relative movement between the punch and the anvil. The device has at least one sonotrode, by which the receiving surface (8) of the anvil (17) is supplied with ultrasound.
    Type: Grant
    Filed: June 12, 2017
    Date of Patent: June 28, 2022
    Assignee: TELSONIC HOLDING AG
    Inventors: Axel Schneider, Thomas Hünig
  • Patent number: 11373803
    Abstract: A method of forming a magnetic core on a substrate having a stacked inductor coil includes etching a plurality of polymer layers to form at least one feature through the plurality of polymer layers, wherein the at least one feature is disposed within a central region of a stacked inductor coil formed on the substrate; and depositing a magnetic material within the at least one feature.
    Type: Grant
    Filed: August 7, 2018
    Date of Patent: June 28, 2022
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Peng Suo, Yu Gu, Guan Huei See, Arvind Sundarrajan
  • Patent number: 11367560
    Abstract: An inductor is laid out on a multi-layer structure, the inductor having a multi-turn coil including a plurality of metal traces laid out on at least two metal layers and a plurality of vias configured to provide inter-layer connection, wherein the multi-turn coil includes a first half configured to conduct a current flow between a first end and a center tap and a second half configured to conduct a current flow between a second end and the center tap; and an additional metal laid out on a metal layer below a lowest metal layer of the multi-turn coil, wherein the additional metal is laid out beneath the first half if the second half has a greater parasitic capacitance, or alternatively beneath the second half if the first half has a greater parasitic capacitance.
    Type: Grant
    Filed: March 30, 2021
    Date of Patent: June 21, 2022
    Assignee: REALTEK SEMICONDUCTOR CORP.
    Inventor: Chia-Liang (Leon) Lin
  • Patent number: 11368075
    Abstract: Provided is a stator coil winding machine including: a stator transfer unit adapted to transfer a linear type stator having a plurality of stator cores in directions of X and Y axes; a winding guide unit adapted to guide the transferred stator to coil winding; a winding unit adapted to wind a coil on the stator; a tension adjusting unit adapted to adjust tension on the coil being wound on the stator; and a controller adapted to control operations of the stator transfer unit, the winding guide unit, and the winding unit to allow the coil to be wound on the stator by means of three-phase Y connection on the basis of a previously set winding sequence.
    Type: Grant
    Filed: April 14, 2020
    Date of Patent: June 21, 2022
    Assignee: RAINBOW ROBOTICS
    Inventors: Jung Ho Lee, Jung Woo Heo, Jeong Soo Lim, Chan Ho Park, Tae June Kim