Patents Examined by Paul D Kim
  • Patent number: 10734797
    Abstract: A pre-expanded cover assembly unit for covering an electrical connection between first and second cables includes a cover assembly in a folded state including an elastomeric outer sleeve defining a cable passage to receive the electrical connection. The outer sleeve includes an intermediate section and first and second outer sections. The first outer section is folded at a first annular fold and is on the intermediate section and/or the second outer section. The cover assembly includes a first retention layer between the intermediate section and the first outer section. The cover assembly includes a first friction reducing layer between the first retention layer and the first outer section. The cover assembly unit includes a removable holdout mounted within the outer sleeve. The cover assembly is movable from a folded state to an unfolded state by sliding the first outer section in a first axial direction away from the intermediate section.
    Type: Grant
    Filed: November 21, 2017
    Date of Patent: August 4, 2020
    Assignee: TE CONNECTIVITY CORPORATION
    Inventors: Ganpathy Iyer, Edward O'Sullivan, Mahmoud Seraj, John A. Newman
  • Patent number: 10721962
    Abstract: An assembler system for manufacturing vapor-generating articles may include a rotatable assembly drum including an outer face and a flute in the outer face. The flute is structured and arranged to hold a first section and a second section of the vapor-generating article. The system also includes a first mechanism that translates the first section relative to the second section while the first section and the second section are in the flute. The system additionally includes a second mechanism that rotates the first section relative to the second section while the first section and the second section are in the flute. The translating and the rotating connect the first section to the second section to form the vapor-generating article.
    Type: Grant
    Filed: May 14, 2018
    Date of Patent: July 28, 2020
    Assignee: Altria Client Services LLC
    Inventors: Jeffrey A. Swepston, Travis M. Garthaffner, Christopher R. Newcomb, Martin T. Garthaffner
  • Patent number: 10717141
    Abstract: Some embodiments of the present invention are generally directed to testing connections of a memory device to a circuit board or other device. In one embodiment, a memory device that is configured to facilitate continuity testing between the device and a printed circuit board or other device is disclosed. The memory device includes a substrate and two connection pads that are electrically coupled to one another via a test path. A system and method for testing the connections between a memory device and a circuit board or other device are also disclosed, as are additional techniques for detecting excess temperature and enabling special functionalities using multi-stage connection pads.
    Type: Grant
    Filed: October 27, 2017
    Date of Patent: July 21, 2020
    Assignee: Micron Technology, Inc.
    Inventor: Thomas Kinsley
  • Patent number: 10714911
    Abstract: A submersible electrical enclosure is for a switchgear assembly. The switchgear assembly includes a number of electrical switching apparatus. The submersible electrical enclosure includes: a plurality of sides defining an interior, the interior receiving each of the electrical switching apparatus, each side including: a conductive polymeric layer facing away from the interior, and an insulative polymeric layer molded to the conductive polymeric layer. The insulative polymeric layer faces the interior and substantially overlays the conductive polymeric layer.
    Type: Grant
    Filed: November 16, 2017
    Date of Patent: July 14, 2020
    Assignee: EATON INTELLIGENT POWER LIMITED
    Inventors: Mark Faulkner, Michael Davis Pearce, Travis Spoone
  • Patent number: 10716250
    Abstract: A component mounting apparatus is provided with a controller that controls a mounting head. The mounting head is provided with a nozzle holder, a nozzle that is elastically supported to be movable up and down with respect to the nozzle holder, a flange that is provided at a position that is offset from the central axis of the nozzle, and a second engaging section that is able to move the nozzle downward by engaging with the flange and pressing down the flange against the elastic force of a nozzle spring. The controller measures in advance the deviation amount of the tip position of the nozzle between before and after the second engaging section moves the nozzle downward and controls the mounting head so as to suck the component and mount the component on the board taking the deviation amount into account.
    Type: Grant
    Filed: August 20, 2015
    Date of Patent: July 14, 2020
    Assignee: FUJI CORPORATION
    Inventors: Takeshi Fujishiro, Koji Kawaguchi, Mitsuru Sanji, Kohei Sugihara
  • Patent number: 10710282
    Abstract: A method of manufacturing a membrane for an electro-acoustic transducer through spray coating of a liquid elastomer solution is provided. The method includes spraying the liquid elastomer solution, which may comprise a silicone, onto a mold having the desired membrane geometry, allowing the solution to cure and remove the membrane from the mold. The mold can be configured to hold other components of an electro-acoustic transducer that will be attached to the membrane after the curing step. Also provided is a membrane for an electro-acoustic transducer comprised of an elastomer and made using spray coating of a liquid elastomer solution.
    Type: Grant
    Filed: September 30, 2016
    Date of Patent: July 14, 2020
    Assignee: SSI New Material (Zhenjiang) Co., Ltd.
    Inventors: Gustav Otto, Peter Thurner, Christian Lembacher
  • Patent number: 10716221
    Abstract: Provided is a method for manufacturing an electronic device. The method includes providing a panel to a stage, providing a circuit board, aligning the circuit board so that first pads of the circuit board face a first pad area of the panel and second pads of the circuit board face a second pad area of the panel, and compressing a first portion of the circuit board on which the first pads are arranged to the first pad area of the panel. The aligning of the circuit board occurs via by external contact on one surface of the first portion of the circuit board and one surface of the second portion of the circuit board.
    Type: Grant
    Filed: March 3, 2017
    Date of Patent: July 14, 2020
    Assignee: Samsung Display Co., Ltd.
    Inventors: Jun-hee Lee, Sang-hoon Back, Daeho Yang, Seungjoo Lee, Myung-gil Choi, Taeyoung Park
  • Patent number: 10705135
    Abstract: A method for assembling a connectorized electrical equipment comprises a connectivity list required for the connectorized electrical equipment, comprising an origin connector and its identifier; a destination electrical equipment subpart and its identifier thereof; and a list of connections between the origin connector and the destination electrical equipment subpart. By querying a database comprising a library of connectors, a construction plan is generated for the connectorized electrical equipment. The construction plan includes diagrams for assembly, images to assist the assembler, a list of material for managing inventory and instructions. An ATE can be connected to the connectorized electrical equipment to be assembled. Based on the construction plan, instructions are provided for a connection between the origin connector and the destination electrical equipment subpart. Connections can be made manually or using the ATE.
    Type: Grant
    Filed: August 18, 2017
    Date of Patent: July 7, 2020
    Assignee: ZIOTA TECHNOLOGY INC.
    Inventor: Alain Lussier
  • Patent number: 10706991
    Abstract: There is provided a technique for producing a superconducting wire material in which the yield in a process of joining superconducting wire materials is improved over the related art. A method for producing a superconducting wire material lengthened by joining end portions of superconducting wire materials each having an oxide superconducting film, the end portions serving as joining surfaces, includes a step of disposing a micro-crystal of an oxide superconducting material on each of the joining surfaces of the oxide superconducting films, a pasting step of overlapping and pasting together the joining surfaces on which the micro-crystal is disposed, and a heat joining step of heating the overlapped joining surfaces to grow the micro-crystal, thereby forming, as a joining layer, a superconducting layer of the oxide superconducting material to join the joining surfaces to each other.
    Type: Grant
    Filed: February 3, 2016
    Date of Patent: July 7, 2020
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Kotaro Ohki, Tatsuoki Nagaishi
  • Patent number: 10699733
    Abstract: A write head including a bearing surface and a write pole having a front surface that forms a portion of the bearing surface. The front surface has a leading edge, a trailing edge and side edges connecting the leading and trailing edges. The write head also includes side shields proximate to the side edges of the write pole, and a trailing shield over the write pole and the side shields. A trailing shield-write pole gap is present between the trailing edge and the trailing shield, and a trailing shield-side shield gap is present between the trailing shield and the side shields. The trailing shield-shield shield gap is substantially less than the trailing shield-write pole gap.
    Type: Grant
    Filed: October 30, 2018
    Date of Patent: June 30, 2020
    Assignee: SEAGATE TECHNOLOGY LLC
    Inventors: Kirill A. Rivkin, Wei Tian, XiaoHong Zhang, Yi Liu
  • Patent number: 10693269
    Abstract: A splice assembly for engaging a conductor includes a brush configured to engage the conductor. The brush includes a housing having a first portion and a second portion. The housing defines a housing axis extending between the first portion and the second portion. The first portion defines a cavity having an open end. The second portion defines a bore. A diameter of the cavity is larger than a diameter of the bore. The cavity and the bore are configured to receive the conductor therethrough. The brush further includes a brush member secured within the cavity and positioned proximate the open end.
    Type: Grant
    Filed: June 27, 2017
    Date of Patent: June 23, 2020
    Assignee: Hubbell Incorporated
    Inventors: Seydou Diop, Adrian Beau Candelaria
  • Patent number: 10693354
    Abstract: A method of manufacturing an impeller rotor assembly including: manufacturing a cylindrical magnet in which hollow space is formed; manufacturing a magnet yoke which is assembled on the inner circumferential surface of the magnet in cylindrical form where hollow space is provided, and in which an outer diameter is 0.02 to 0.3 mm smaller than the inner diameter of the magnet; assembling the magnet and magnet yoke; and mold forming in which the assembly of the magnet and magnet yoke is integrated into the mold.
    Type: Grant
    Filed: March 8, 2016
    Date of Patent: June 23, 2020
    Inventor: Sunsik Kim
  • Patent number: 10693337
    Abstract: An annular conductor retaining device has a retention guide portion formed by blades arranged in a cylindrical shape with gaps therebetween. An annular conductor is inserted into two of the gaps across a plurality of the blades. The next annular conductor is inserted into the gaps to partially overlap the previously arranged annular conductor. This step is repeated so that the annular conductors are arranged in a spiral shape in the retention guide portion. The retention guide portion and the inner circumferential part of the core are fitted to each other, and the gaps and the slots of the core are made to coincide with each other. A pusher is inserted into the inner circumferential part of the retention guide portion so that the annular conductors are caught on the pusher, to move them in the axial direction into the slots of the core, and thus become the coils.
    Type: Grant
    Filed: August 24, 2016
    Date of Patent: June 23, 2020
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Hironori Tsuiki, Akira Hashimoto
  • Patent number: 10692641
    Abstract: A transmission line impedance transformer including at least two different dielectric media having different dielectric properties, each of the dielectric media being configured to taper in thickness along the length of the impedance transformer in an inverse relationship with respect to each other so as to form a combined dielectric medium having an effective dielectric property that is graded along the transmission path. The two or more dielectric media may be disposed between two conductors to provide an impedance transformer in which a characteristic impedance of the transmission line varies along its length in response to the gradation of the effective dielectric property of the combined dielectric medium.
    Type: Grant
    Filed: April 13, 2018
    Date of Patent: June 23, 2020
    Assignee: Raytheon Company
    Inventors: Daniel B. Schlieter, Patrick J. Kocurek, Christopher A. Loehrlein, Brandon W. Pillans
  • Patent number: 10694648
    Abstract: A system places a pin into at least one hole on an article. The system generally includes a moveable base on which the article is located, a press head for holding and inserting the pin into the hole, a first vision system to capture a first image of a designated hole on the article, and a second vision system to capture second and third images of the held pin relative to the press head respectively from two vantage points. A computing unit is configured to assign a relative coordinate consisting of a X-value and a Y-value being correspondingly indicative to an actual location of the hole, compute relative deviations presented between the held pin and the designated hole, and move the base to adjust the article in a manner correcting or compensating for the computed deviation prior to inserting the held pin into the hole.
    Type: Grant
    Filed: September 21, 2017
    Date of Patent: June 23, 2020
    Assignees: KORVIS LLC, KORVIS AUTOMATION (SHANGHAI) CO. LTD.
    Inventors: Mark Trevisiol, Barry Johnson, Yi Qiang Yang
  • Patent number: 10684220
    Abstract: A process of in-situ detection of hollow fiber formation includes immersing a plurality of individual glass fibers in an index-matching material. The index-matching material has a first refractive index that substantially matches a second refractive index of the glass fibers. The process also includes exposing the individual glass fibers to a light source during immersion in the index-matching material. The process further includes utilizing one or more optical components to collect optical data for the individual glass fibers during immersion in the index-matching material. The process also includes determining, based on the optical data, that a particular glass fiber of the plurality of individual glass fibers includes a hollow fiber.
    Type: Grant
    Filed: September 15, 2017
    Date of Patent: June 16, 2020
    Assignee: International Business Machines Corporation
    Inventors: Eric J. Campbell, Bruce J. Chamberlin, Sarah K. Czaplewski, Scott B. King, Joseph Kuczynski
  • Patent number: 10687425
    Abstract: An electro-optical module assembly is provided that includes a flexible substrate having a first surface and a second surface opposite the first surface, wherein the flexible substrate contains an opening located therein that extends from the first surface to the second surface. An optical component is located on the second surface of the flexible substrate and is positioned to have a surface exposed by the opening. At least one electronic component is located on a first portion of the first surface of the flexible substrate, and at least one micro-energy source is located on a second portion of the first surface of the flexible substrate.
    Type: Grant
    Filed: November 22, 2017
    Date of Patent: June 16, 2020
    Assignee: International Business Machines Corporation
    Inventors: Paul S. Andry, Qianwen Chen, Bing Dang, John U. Knickerbocker, Minhua Lu, Robert J. Polastre, Bucknell C. Webb
  • Patent number: 10679777
    Abstract: A cable (1) assembly device for producing cabling including: a support surface (2) on which the cable assembly is carried out (1), cable (1) fastening and guide elements (3), said fastening and guide elements (3) comprising a vacuum element for joining it to said support surface (2), a feeder (4) of the cable to be assembled, a computation means that includes a cabling diagram in its memory and the location of the fastening and guide elements (3) on the support surface (2), a storage module (5) for cable (1) fastening and guide elements (3), positioning means (6) of the fastening and guide elements (3) on the support surface (2).
    Type: Grant
    Filed: July 21, 2017
    Date of Patent: June 9, 2020
    Assignee: AIRBUS DEFENCE AND SPACE S.A.
    Inventors: Juan Torres Moreno, Alberto Perez Barthelemy, Josef Ignacio Hötz Ordoño, Tamara Ramos Santana, Jose Carlos Diaz Cruz
  • Patent number: 10679784
    Abstract: A high current transformer winding made from a flat conductor having opposing ends that are shaped (e.g. a lateral protrusion), such that when a middle portion of the conductor is wound around a transformer core, one or both opposing ends protrude to allow operative connection to a power source.
    Type: Grant
    Filed: July 31, 2017
    Date of Patent: June 9, 2020
    Assignee: VANNER, INC.
    Inventors: Alexander Isurin, Alexander Cook
  • Patent number: 10679962
    Abstract: A jig for holding a wire bonding capillary includes a first arm and an opening in the first arm, wherein a wire bonding capillary is receivable within the opening. A second arm is pivotally attached to the first arm. The second arm has a surface facing the first arm, wherein the surface is contactable with a capillary mount of a wire bonding machine.
    Type: Grant
    Filed: February 9, 2016
    Date of Patent: June 9, 2020
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Mohd Azri Hashim, Mohd Muzamir Kamalluddin