Patents Examined by Rhadames J Alonzo Miller
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Patent number: 9335352Abstract: In a digital branch circuit monitor, compensation for the phase error is accomplished by selecting a voltage sampled at a time temporally offset from the sampling time of the current by an interval quantifying the phase shift of the secondary current relative to the primary current that is characteristic of a current transformer.Type: GrantFiled: March 4, 2010Date of Patent: May 10, 2016Assignee: Veris Industries, LLCInventors: Benjamin J. McCrea, Matthew Rupert, Michael Bitsch
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Patent number: 9324471Abstract: An aluminum alloy wire rod has a composition consisting of 0.1-1.0 mass % Mg; 0.1-1.0 mass % Si; 0.01-1.40 mass % Fe; 0.000-0.100 mass % Ti; 0.000-0.030 mass % B; 0.00-1.00 mass % Cu; 0.00-0.50 mass % Ag; 0.00-0.50 mass % Au; 0.00-1.00 mass % Mn; 0.00-1.00 mass % Cr; 0.00-0.50 mass % Zr; 0.00-0.50 mass % Hf; 0.00-0.50 mass % V; 0.00-0.50 mass % Sc; 0.00-0.50 mass % Co; 0.00-0.50 mass % Ni; and the balance being Al and incidental impurities, wherein at least one or none of Ti, B, Cu, Ag, Au, Mn, Cr, Zr, Hf, V, Sc, Co and Ni is contained in the composition. A dispersion density of an Mg2Si compound having a particle size of 0.5 ?m to 5.0 ?m is less than or equal to 3.0×10?3 particles/?m2. Each of Si and Mg at a grain boundary between crystal grains of a parent phase has a concentration of less than or equal to 2.00 mass %.Type: GrantFiled: April 8, 2015Date of Patent: April 26, 2016Assignees: FURUKAWA ELECTRIC CO., LTD., FURUKAWA AUTOMOTIVE SYSTEMS INC.Inventors: Shigeki Sekiya, Sho Yoshida, Kyota Susai, Kengo Mitose
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Patent number: 9282634Abstract: Provided is a printed wiring board including a first heat dissipation pattern placed in one surface layer on which a semiconductor package is to be mounted, a second heat dissipation pattern placed in the other surface layer, and an inner layer conductor pattern placed in an inner layer, in which through holes are formed in the printed wiring board; the first heat dissipation pattern has a joint portion which is placed in an opposed region opposed to a heat sink of the semiconductor package and which is joined to the heat sink with solder; at least one of the through holes is placed in the opposed region; and the second heat dissipation pattern is formed in a pattern in which an end portion of a conductor film in the one of the through holes on the other surface layer side is separated.Type: GrantFiled: July 29, 2013Date of Patent: March 8, 2016Assignee: CANON KABUSHIKI KAISHAInventor: Masaharu Ohira
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Patent number: 9239653Abstract: A touch panel includes a substrate, a touch-sensing circuit, and fan-out traces. The substrate has a touch-sensing region and an adjoined peripheral region. The touch-sensing circuit is disposed on the touch-sensing region. The fan-out traces are disposed on the peripheral region and electrically connected to the touch-sensing circuit. Each fan-out trace includes a first conductive line, a first dielectric layer and a second conductive line. The first conductive line is disposed on the peripheral region. The first dielectric layer is disposed on the peripheral region to cover the first conductive line, and has at least one contact window located above the first conductive line. The second conductive line is disposed on the first dielectric layer, wherein the first and the second conductive line of the same fan-out trace have the same pattern and are electrically connected through the contact window.Type: GrantFiled: August 6, 2012Date of Patent: January 19, 2016Assignee: Au Optronics CorporationInventors: Wen-Chi Chuang, Chia-Chun Yeh, Yu-Ching Huang
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Patent number: 9231392Abstract: An electrical assembly having a support, a mounting member and an electrical device attached to the mounting member and the support. The mounting member is a one piece integrally formed unit having an interior cavity for receiving electrical wires from the power source and supplying the electrical wires to the electrical device. The mounting member has a coupling at a first end of the mounting member with internal threads having an annular recess receiving a seal member for forming a weatherproof seal with the support while allowing limited rotational adjustment of the mounting member with the support and maintaining the weatherproof seal. The mounting member has a second end with a coupling having external threads complementing the internal threads of the first coupling to enable a plurality of the mounting members to be coupled together and forming a weatherproof connection between the adjacent mounting members.Type: GrantFiled: January 2, 2014Date of Patent: January 5, 2016Assignee: Hubbell IncorporatedInventors: Sean F. Rogers, Howard P. Clayton
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Patent number: 9214252Abstract: [Technical Problem] The invention is to provide a method for manufacture of an ultrafine conductor having sufficient electrical conductivity, and enhanced strength and stretch properties while suppressing manufacture cost, the same ultrafine conductor, as well as a material suited for the same ultrafine conductor. [Solution to Problem] To solve the above problem, there is provided a material for an ultrafine conductor, which includes a matrix formed of copper, chromium particles contained in the matrix, and tin contained in the matrix. The tin is present as a solid solution in the matrix.Type: GrantFiled: June 27, 2014Date of Patent: December 15, 2015Assignee: YAZAKI CORPORATIONInventor: Tsuyoshi Watanabe
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Patent number: 9209610Abstract: A retrofit electrical outlet comprises an electrical box comprising one or more moveable braces coupled to linear brace actuators, whereby pulling on the linear brace actuator causes the brace to move toward the front end of the box to impinge a wall surface material between the brace and a front flange of the box. Releases may be included to allow for adjustment of the braces. The braces may move linearly or pivotally toward the wall surface material. The linear brace actuator may be stored within the wall for future use.Type: GrantFiled: August 9, 2012Date of Patent: December 8, 2015Assignee: Hubbell IncorporatedInventors: Iven Dieterle, Richard L. Cleghorn, Jeffrey P. Baldwin, Lincoln Jolley
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Patent number: 9185824Abstract: A cable management system for a network cabinet has first and second server equipment rails, first and second air dams, and a front cable support. The server equipment rails are mounted to a base frame of the network cabinet such that the server equipment rails extend from the base frame towards a front of the network cabinet. The air dams are mounted to the base frame of the network cabinet such that the air dams extend from the base frame towards opposing sides of the network cabinet. The front cable support has a generally U-shaped tray that is connected to the first and second server equipment rails such that the tray extends across a front of the network cabinet, transverse to the server equipment rails.Type: GrantFiled: April 25, 2012Date of Patent: November 10, 2015Assignee: Panduit Corp.Inventors: Ronald A. Nordin, Alva B. Eaton
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Patent number: 9171659Abstract: A radial water barrier is provided for a dynamic high-voltage submarine cable. The water barrier includes a corrugated metal tube having an inner diameter in a range of 50-90 mm and a corrugation pitch in a range of 6-10 mm. The metal tube has a wall thickness in a range of 0.7-1 mm and a corrugation depth of more than 6 mm.Type: GrantFiled: September 14, 2012Date of Patent: October 27, 2015Assignee: ABB Research LtdInventors: Andreas Tyrberg, Erik Eriksson, Johan Ekh
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Patent number: 9172118Abstract: Methods and systems for estimating remaining life of an automotive propulsion battery are provided. A total usable capacity of the battery is calculated based on cycling the battery. A first component of degradation is calculated based on driving throughput of the battery. A second component of degradation is calculated based on aging of the battery. The total degradation is calculated based on the sum of the first component and the second component of degradation.Type: GrantFiled: June 17, 2009Date of Patent: October 27, 2015Assignee: GM GLOBAL TECHNOLOGY OPERATIONS, LLC.Inventors: Richard A. Marsh, Carol L. Johnson, Andrew H. Leutheuser, Shyh-Yeu Jao
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Patent number: 9132494Abstract: A wiring board and a method for manufacturing the wiring board reinforced by means of a resin is provided. Embodiments of the wiring board allow for reliable attachment of a connection member, like a socket, to a terminal member. For example, a base of terminal pins is put on pin grid array (PGA) terminal pads, and a bonding material paste including solder and an electric insulation material made of a resin is placed on each of the PGA terminal pads. The bonding material paste is then heated to fuse the solder and soften the electric insulation material. Subsequently, the bonding material paste is cooled to solidify the solder and bond each of the bases to a corresponding PGA terminal pad and form an electric insulation surface layer on an exposed surface of each of solder junctions to which the respective bases are bonded.Type: GrantFiled: January 19, 2012Date of Patent: September 15, 2015Assignee: NGK SPARK PLUG CO., LTD.Inventors: Masahiro Inoue, Hajime Saiki, Atsuhiko Sugimoto
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Patent number: 9130360Abstract: To provide an electrical junction box equipped with a bracket having a new structure that can stably and strongly secure the electrical junction box to a vehicle body to exert sufficient strength against an external force applied by bolt-fastening of a terminal hardware in an external wiring. A separate bracket attaches an electrical junction box main body to a vehicle body side support member. The separate bracket is provided with latch portions. Fixing positions between the latch portions and the electrical junction box main body are set on both sides of bolt connecting sections along the vehicle body side support member.Type: GrantFiled: September 27, 2010Date of Patent: September 8, 2015Assignee: SUMITOMO WIRING SYSTEMS, LTD.Inventor: Takahiro Asao
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Patent number: 9113565Abstract: A printed circuit board (PCB), a method for processing PCB and an electronic apparatus. The method for processing PCB may comprise: forming a hole in the PCB, wherein the PCB includes a metal matrix and at least two substrate layers, at least one of the at least two substrate layers has a geoelectric layer thereon; and the metal matrix is fixed in a slot provided in the substrate, the formed hole contacts both the geoelectric layer and the metal matrix; and providing conductive substances in the hole, with the conductive substances in the hole being in contact with the inner geoelectric layer and the metal matrix, so that the geoelectric layer and the metal matrix are in conduction with each other.Type: GrantFiled: June 19, 2012Date of Patent: August 18, 2015Assignee: Shennan Circuits Co., LtdInventors: Chuanzhi Li, Hua Miao, Zhanhao Xie, Jun Peng
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Patent number: 9112343Abstract: A shielded power feeder system may include at least one unshielded power feeder conductor having first and second ends, a neutral conductor positioned adjacent the power feeder conductor, the power feeder conductor and neutral conductor forming a bundle, and the neutral conductor having a grounded conductive shield.Type: GrantFiled: September 4, 2012Date of Patent: August 18, 2015Assignee: The Boeing CompanyInventors: Jeffrey J. White, Corneliu Michaels, John Kemp Erdelyan, Ourania Koukousoula, Yousif Bitti, Michael C. Dosch
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Patent number: 9104383Abstract: A programmable logic controller (PLC) assembly includes a bottom housing with a base, a first plurality of elongate alignment features extending from the bottom housing transverse to the base, and a first connection feature. The PLC assembly includes a central processing unit with a circuit board and at least two receptacles therethrough configured to engage and slide along at least two of the first plurality of alignment features. The at least two of the first plurality of alignment features are positioned asymmetrically with respect to the base. The PLC assembly includes an upper housing with a second connection feature configured to slidably couple with the first connection feature and a second plurality of elongate alignment features configured to slidably engage at least two of the first plurality of alignment features, which are positioned asymmetrically with respect to the base.Type: GrantFiled: October 14, 2014Date of Patent: August 11, 2015Assignee: Rockwell Automation Technologies, Inc.Inventors: Karen Chin, Chee Lim Wong
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Patent number: 9095084Abstract: A stacked multilayer structure, including a first circuit layer having bumps, a plastic film stacked on the first circuit layer to fill up the space among the bumps so as to form a co-plane, and a second circuit layer formed on the co-plane and connected to the first circuit layer. The plastic film includes a glass fiber layer which is embedded and not exposed.Type: GrantFiled: March 29, 2013Date of Patent: July 28, 2015Assignee: KINSUS INTERCONNECT TECHNOLOGY CORP.Inventors: Ting-Hao Lin, Yu-Te Lu, De-Hao Lu
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Patent number: 9042111Abstract: A system for securing an access opening of a cable raceway using a single padlock includes a cover having a securing wall and opposed first and second sidewalls, which form a channel for accommodating at least a portion of the cable raceway with the securing wall covering the access opening. First and second insert bars engage the first and second sidewalls and a lock bar engages the first and second insert bars and may be locked in an engaged position to prevent the first and second insert bars from being disengaged with the cover and to secure the cover about the cable raceway preventing access to the access opening.Type: GrantFiled: March 14, 2012Date of Patent: May 26, 2015Assignee: The Wiremold CompanyInventors: Sean Urquhart, John Marrotte
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Patent number: 9035193Abstract: A connecting member such as a terminal base is used in connection with a printed circuit board unit in which circuit elements such as a power module are mounted on a printed circuit board. The connecting member connects the circuit element of an electrical circuit including the printed circuit board, to an electrical wire. The connecting member includes a terminal connecting section to be directly connected to terminal pins of the circuit element; a wire connecting section to be connected to the electrical wire; and attachment sections for attaching the connecting member to the printed circuit board.Type: GrantFiled: April 23, 2009Date of Patent: May 19, 2015Assignee: DAIKIN INDUSTRIES, LTD.Inventors: Sumio Kagimura, Hiroshi Doumae, Hirotaka Doi, Shuuji Genda
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Patent number: 9024210Abstract: The present invention relates to a feedthru (210, 210?) provided with a ceramic based coating (260) and a method of providing a feedthru (210, 210?) with a ceramic based coating (260). The feedthru (210, 210?) includes at least one conductive pin (220) that extends through a header (217) and includes an exposed first end (221) and an exposed second end (222) spaced by an insulated portion (224). The at least one conductive pin (220) connects a first conductive element (121) connected with a first electrical device (300, 300a, 300b, 104, 105, 105?) and a second conductive element (121?) connected with another electrical device (20, 301), whereby the exposed first end (221) connects to the first conductive element (121) and the exposed second end (221) connects to the second conductive element (121?).Type: GrantFiled: March 25, 2009Date of Patent: May 5, 2015Assignee: Micro Motion, Inc.Inventors: Matthew T. Crisfield, Michele Moore, Robert B. Garnett
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Patent number: 8993892Abstract: A wiring board includes: a substrate; first connection electrode portions which are disposed on a surface of the substrate and which are to be connected to individual-electrode connection terminals of an actuator via first bumps; first wires having electrical continuity with the first connection electrode portions; a second connecting electrode portion which is disposed on the surface of the substrate and which is to be connected to the a common-electrode connection terminal of the actuator via a second bump; and a second wire having electrical continuity with the second connection electrode portion. The second connecting electrode portion is located in an edge portion of the substrate. The second wire has a conducive-material absent portion that is located between an edge of the substrate and the second connecting electrode portion.Type: GrantFiled: January 19, 2012Date of Patent: March 31, 2015Assignee: Brother Kogyo Kabushiki KaishaInventor: Toru Yamashita