Abstract: Apparatus for electrically connecting a plurality of closely positioned contacts of a display device with a plurality of spaced contacts of an electronic control circuit includes a plurality of flexible printed circuit boards each having a narrow mid-section, outer areas having a width greater than the width of the mid-section and conductor lines extending from the mid-section for connection with a portion of the display device contacts to the outer areas with the spacing between the conductor lines increasing for connection with a portion of the electronic control circuit contact.

Abstract: The present disclosure describes a multi-layered integrated circuit package especially suited for high density circuit applications, such as those involving LSI or ULSI. The package is characterized by short uninterrupted electrical circuit paths between the integrated circuit chip and an interconnection medium. The use of metallized vias or feed-throughs commonly employed in multi-layered packages have been eliminated. Also, heat dissipation is enhanced by the short thermal path between the chip and the outer package surface. Finally, the signal lead configuration permits the area occupied by the package on the interconnection medium to be significantly less than that of present-day packages having approximately the same number of input/output pins or terminals.

Abstract: A dielectric heating oven having a set of parallel spaced electrodes alternately grounded and every ungrounded electrode fed by electromagnetic energy from a common source in an ISM band preferably from 13.56 megacycles to 40.68 megacycles. Food is placed on top of the electrodes and the depth of penetration of the electric fields into the food is a function of the phase relationship of the energized electrodes. When all energized electrodes are feed in the same phase, maximum field coupling is to the grounded electrodes between them resulting in high intensity searing electric fields close to the surface of the food. Deeper penetration cooking is accomplished by feeding adjacent energized electrodes 180.degree. out of phase so that maximum field coupling is between them rather to the grounded electrode between them. Still further penetration cooking results from feeding all adjacent energized electrodes 90.degree. out of phase so that maximum field coupling is to alternate energized electrodes.

Abstract: An improved composite substrate comprises a patterned surface conductive layer of a refractory metal and a patterned compensation electrically conductive layer. The patterned compensation layer entirely overlies and extends beyond the shrunken patterned conductive layer. Additionally, thick film elements such as resistors are fabricated and contact selected areas of the patterned compensation conductive layer.

Abstract: An integrated circuit board for mounting very high density chips of small size on its top surface including conductor planes for carrying very large values of .DELTA.I (transient current) is constructed with a plurality of essentially flat parallel power planes serving as conductive leads to the chip connectors (pins or solder balls). The land areas on the top surface of the board are connected to conductors below by integrated coaxial conductor extensions from the planes having a high degree of capacitive coupling to adjacent conductor planes.

Abstract: The present invention provides an apertured circuit board having self-locking terminals which partially cover at least some of the apertures. The terminals, which are integral extensions of the circuit pathways, each include a pair of inwardly disposed generally L-shaped fingers. The terminals are adhesively anchored to the circuit board at the terminal peripheries and are covered in part by a dielectric overlay. The latter also provides environmental protection and electrical insulation to the circuit conductive pathways. The circuit board and integral sockets may be formed by photoimaging and chemical milling techniques.

Abstract: A module containing an integrated circuit, such as a read-only memory (ROM), includes an essentially box-shaped plastic housing having an internal chamber in which the integrated circuit is located. Positioned within the chamber is a printed circuit board on which the integrated circuit is mounted. Also mounted on the printed circuit board and adjacent to an elongated narrow slot located in one side of the housing are a plurality of electrical spring contacts electrically connected to the integrated circuit by means of electrical conductors on the printed circuit board. Upon insertion of the module into an electronic apparatus, edge connectors of a printed circuit board of the electronic apparatus extend through the narrow slot and engage the electrical spring contacts, thereby electrically connecting the integrated circuit to the apparatus.

Abstract: In welding or working operations using an electric arc a nitrogen compound is introduced into the working or welding area for the purpose of decomposing ozone in said area. The nitrogen compound is preferably purely nitric oxide, but may also be nitrous oxide (N.sub.2 O) or ammonia (NH.sub.3).

Abstract: Pipes are submerged - arc seam welded with a welding wire having a relatively high nickel content (about 6%), and low carbon content (<0.08%) to obtain a seam having a ductility and toughness which is still adequate for very low temperatures.

Abstract: An improved printed circuit board for use in electrical and electronic appliances includes an electronic part for a jumper having crossover wiring and disposed on an electrically insulative substrate or base plate for the printed circuit board provided with a cross pattern of conductors in which sets of separated or cut-off conductive layers are arranged to confront each other on X-Y cross coordinates for connecting the cross pattern portions on the substrate to each other by the jumper electronic part.

Abstract: An electrical capacitor comprising a capacitor element impregnated with a mixture of di-iso-propyl naphthalene and mono-iso-propyl naphthalene, the amount of which latter being 10% to 60% by weight, and preferably 20% to 40% by weight.

Abstract: Shielded flat cable having low cross talk, low propagation delay and high propagation velocity including flat multiconductor cable core with convoluted surfaces, flat spacer strips trapping air in the cable surface convolutions and conductive sheathing held away from the cable core by the spacers.

Abstract: Described herein are self-regulating conductive articles comprised of an extruded length of polymeric material containing not more than about 15% by weight conductive carbon black, the resistivity of the extrudate following prolonged exposure to temperatures in excess of the crystalline melting point or range of the polymeric matrix in which the black content satisfies the equation:2L+5 log.sub.10 R.ltoreq.45.Wherein L is percent by weight black and R is resistivity of the extrudate expressed in ohm-cm. The articles exhibit room temperature resistivity in the range from about 5 to 100,000 ohm-cm and may be employed, e.g., in heat tracing and thermostating applications.

Abstract: A process for implanting a precise quantity of radioactive metal on a metal substrate such as a cutting tool or other metal part subject to wear at the area or areas where the part is expected to wear during its operation. The presence of the radioactive spot can be sensed to determine the extent of wear during use. The radioactive metal is deposited from a wire formed of a core of the radioactive metal surrounded by a sheath of metal having a high thermal and electrical conductivity relative to the core. In operation, the wire contacts the metal surface under pressure and electric current is passed through the wire in order to (1) form a pit on the tool surface, (2) weld the radioactive metal in the pit and (3) evaporate a small portion of the conductive sheath adjacent the pit. A second current then is passed through the wire to break it near the bottom of the pit, leaving a small quantity of radioactive material welded to the bottom of the pit.

Abstract: A cable (20) specially suited for use in building plenums because of its low flame spread and smoke evolution includes a multiconductor core (22) which is enclosed in a sheath comprising an inorganic, cellular core wrap (31), a corrugated metallic barrier (40) and dual layers (51) and (52) of a polyimide tape which are wrapped helically about the barrier in a manner that avoids a compression of the core wrap. The sheath is effective to resist heat transfer inwardly toward the core by conduction while the metallic barrier reflects radiant heat. Advantageously, the sheath containerizes the core without unduly compressing it and thereby allows the intumescence of conductor insulation during a fire to form char which is effective to suppress the evolution of smoke and the propagation of flame.

Abstract: Electrical conductors having suitable combinations of coatings and coverings are disclosed which have the ability to inhibit low molecular weight hydrocarbon well fluids when under pressure and withstand high proportions of gassy hydrocarbons under pressure without undergoing rupture failure.

Abstract: Infrared detector arrays have focal plan processing in modular form mounted on stacked boards, where the processing integrated circuits are recessed in adjacent boards.

Abstract: A flux-cored welding electrode is disclosed having a generally tubular sheath and a core defined within the sheath, wherein the core includes a slag forming system comprising from about 5 to 9 percent titanium dioxide, less than about 2 percent calcium fluoride and from about 0.003 to 0.080 percent boron, based on the total electrode weight.

Abstract: This invention relates to devices for measuring temperature; more particularly it relates to temperature sensing devices operating at high temperature. It is an object of this invention to overcome deterioration of temperature sensitive elements and accordingly the element of the invention comprises a substrate made from an electrically non-conducting material and carrying an electrically conducting path comprising a vitreous phase which is resistant to chemical reduction and loaded with electrically conducting particles.

Abstract: A multilayer printed circuit board is disclosed having appropriate ground and voltage planes. The multilayer printed circuit board includes a mounting plane, a plurality of dielectric sheets stacked upon the mounting plane, a plurality of conductive sheets positioned between adjacent dielectric sheets, and a plurality of rectangular shaped apertures passing through the multilayer printed circuit board. Each rectangular shaped aperture of the multilayer printed circuit board has a plurality of voltage connector terminals. Electrical connection from one of the conductive sheets to the appropriate voltage connector terminal is provided by a conductive disc which passes through a hole located within the multilayer printed circuit board.