Patents Examined by Robert A. Dawson
  • Patent number: 6720078
    Abstract: The present invention aims at provision of an organic composite galvanized steel sheet having its characteristics such as corrosion resistance and workability improved. Thus, the present invention provides an organic composite galvanized steel sheet that is formed by sequentially depositing on a surface of a steel sheet a galvanization layer, a zinc phosphate layer containing Mg, and an organic layer, and is characterized in that a value of Mg/P (weight ratio) in the zinc phosphate layer is 0.15 or larger and an amount of Mg contained in the zinc phosphate layer is 20 mg/m2 or more. Preferably, the zinc phosphate layer contains one or two or more of Ni, Mn, Co, Fe, Cu, Al, and Ca. In one preferred embodiment, the organic layer is formed as a composite layer containing an organic resin and one or two kinds or more of powder or colloid selected from SiO2, Al2O3, MgO, Fe2O3, Fe3O4, ZrO2, TiO2, and SnO2.
    Type: Grant
    Filed: September 23, 2002
    Date of Patent: April 13, 2004
    Assignee: Nippon Steel Corporation
    Inventors: Kiyokazu Isizuka, Hidetoshi Shindou, Teruaki Yamada, Kimitaka Hayashi, Ikuo Kikuchi
  • Patent number: 6720080
    Abstract: A composition and method for selectively increasing the resin flow and gel time of an epoxy resin that fills the capillary region between filaments in fiberglass yarns making up a woven fabric. The composition and method are used in the lamination of fiberglass reinforced composites such as copper clad laminates for circuit boards and reduces the occurrence of voids in the capillary region.
    Type: Grant
    Filed: June 4, 2001
    Date of Patent: April 13, 2004
    Assignee: JPS Glass and Industrial Fabrics
    Inventors: Shobha Murari, Richard G. Adams, H. Landis Carter
  • Patent number: 6720077
    Abstract: The present invention relates to a resin composition containing an epoxy resin, an amine-type curing agent, an organophosphorus compound having a structure represented by formula 1 and an organic solvent, wherein the epoxy resin and the organophosphorus compound has been compounded at a temperature of 50° C. or lower. The resin composition has enough flame retardancy without containing any halogen-containing flame retarder, has good heat resistance and good chemical resistance, and causes no problems with respect to reaction stability or curability caused by consumption of an epoxy resin through a reaction occurring during compounding of the resin composition.
    Type: Grant
    Filed: February 13, 2002
    Date of Patent: April 13, 2004
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Yasuyuki Hirai, Hironori Suzuki, Yoshiyuki Takeda, Kenichi Oohori, Shinichi Kamoshida, Minoru Kakitani, Norihiro Abe
  • Patent number: 6716530
    Abstract: The present invention provides a resin applied-copper foil, which is free of halogen elements, having high flame retardancy, excellent water resistance, heat resistance, and good peeling strength between a base material and copper foil. To provide the a resin compound used for fabricating an interlayer dielectric of a printed wiring board, the resin compound comprises an epoxy-based resin which includes: an epoxy resin curing agent having 5 to 25% by weight of nitrogen; and maleimide compounds having thermosetting properties, and the resin compound further has composition which is free of halogen elements.
    Type: Grant
    Filed: November 30, 2001
    Date of Patent: April 6, 2004
    Assignee: Mitsui Mining & Smelting Co., Ltd.
    Inventors: Tetsuro Sato, Tsutomu Asai
  • Patent number: 6716373
    Abstract: There is disclosed an optically active polysilane represented by the following general formula: wherein R1 and R2 are a combination of (R)-3,7-dimethyloctyl group and (S)-3-methylpentyl group, R3 is an alkyl group having 3 to 20 carbon atoms and formed of a branched structure which is branched at any one of the first to fourth carbon atoms positioned away from the backbone chain, R4 is a straight-chain alkyl ether group having 2 to 22 carbon atoms, or a straight-chain alkyl group having 2 to 22 carbon atoms, x is a number ranging from 0.01 to 0.99, and n is a number ranging from 10 to 100,000.
    Type: Grant
    Filed: November 20, 2002
    Date of Patent: April 6, 2004
    Assignee: Nara Institute of Science and Technology
    Inventors: Michiya Fujiki, Masashi Kunitake, Akihiro Ohira
  • Patent number: 6716529
    Abstract: An adhesive sheet for a semiconductor connecting substrate consisting of a laminate having an adhesive layer on a substrate, wherein said adhesive layer contains a thermoplastic resin (A) and an epoxy resin (B) and said epoxy resin (B) contains at least one epoxy resin (B) selected from (I) dicyclopentadiene skeleton-containing epoxy resins, (II) terpene skeleton-containing epoxy resins, and (III) biphenyl skeleton-containing epoxy resins, as an essential component; an adhesive-backed tape for TAB consisting of a laminate having an adhesive layer and a protective film layer on a flexible organic insulating film. The adhesive sheet for a semiconductor connecting substrate, the adhesive-backed tape for TAB and the adhesive-backed tape for wire bonding connection of the present invention are excellent in adhesive strength, insulatability, dimensional accuracy, etc.
    Type: Grant
    Filed: August 29, 2001
    Date of Patent: April 6, 2004
    Assignee: Toray Industries, Inc.
    Inventors: Yasushi Sawamura, Shoji Kigoshi, Taku Hatano, Yukitsuna Konishi, Yoshio Ando
  • Patent number: 6716904
    Abstract: A heat-radiating electromagnetic wave absorber molded in a predetermined form from a mixed composition comprising Fe—Si alloy powder as soft magnetic powder and a thermally conductive filler in an organic matrix. This heat-radiating electromagnetic wave absorber has better thermal conductivity, as well as excellent electromagnetic wave absorbing property in high frequency band.
    Type: Grant
    Filed: June 13, 2002
    Date of Patent: April 6, 2004
    Assignee: Polymatech Co., Ltd.
    Inventor: Kouya Takahashi
  • Patent number: 6716535
    Abstract: The invention relates to the field of machine elements for designing a composite of two parts, one of which is a rare-earth permanent magnet and the other of which is a metallic support.
    Type: Grant
    Filed: October 17, 2002
    Date of Patent: April 6, 2004
    Assignee: Siemens Aktiengesellschaft
    Inventors: Winfried Plundrich, Ernst Wipfelder, Peter Hein, Ralf Wilcke
  • Patent number: 6715874
    Abstract: The invention relates to novel crosslinkable copolymers of formula wherein the variables are as defined in the claims. The copolymers of the invention are especially useful for the manufacture of biomedical moldings, for example ophthalmic moldings such as in particular contact lenses.
    Type: Grant
    Filed: July 28, 2000
    Date of Patent: April 6, 2004
    Assignee: Novartis AG
    Inventors: Jens Höpken, Dieter Lohmann
  • Patent number: 6713581
    Abstract: Disclosed is a polymer material of low relative permittivity obtained through copolymerization of a monomer composition that contains, as monomers, a fumaric diester and an epoxy group-having (meth)acrylate. The polymer material bonds or adheres well to metal conductor layers, and, after crosslinked, it is patternable. In addition, it has good electric properties of low relative permittivity, low dielectric loss tangent and good electric insulation, and has good heat resistance.
    Type: Grant
    Filed: January 24, 2002
    Date of Patent: March 30, 2004
    Assignees: TDK Corporation, Dai-Ichi Kogyo Seiyaku Co., Ltd.
    Inventors: Shigeru Asami, Toshiaki Yamada, Teruaki Sugahara, Hiroshi Hotta
  • Patent number: 6712989
    Abstract: A composite magnetic body is obtained without the use of halogen-based or halogen-containing materials, such as, halogen-based binding agent of halogen-based resins or elastomers, and bromine-based fire retardents. The composite magnetic body (1) comprises a soft magnetic powder (2) and a silicone rubber (3). The silicone rubber (3) should preferably be a solid silicone rubber. An electromagnet interference suppressing body is obtained using this composite magnetic body.
    Type: Grant
    Filed: June 13, 2001
    Date of Patent: March 30, 2004
    Assignee: Tokin Corporation
    Inventors: Yoshio Awakura, Shigeyoshi Yoshida, Mikio Nishimura
  • Patent number: 6713599
    Abstract: A method of forming a polyol includes the steps of reacting an initiator with an alkylene oxide, and optionally carbon dioxide, in the presence of a double metal cyanide catalyst and a sterically hindered chain transfer agent capable of protonating the growing polyol polymer. The presence of the chain transfer agent reduces the polydispersity of the resultant polyol.
    Type: Grant
    Filed: March 31, 2003
    Date of Patent: March 30, 2004
    Assignee: BASF Corporation
    Inventors: Werner Hinz, Jacob Wildeson, Edward Michael Dexheimer, Raymond Neff
  • Patent number: 6713143
    Abstract: A thermosetting low-dielectric resin composition which has a low dielectric constant and a low dielectric tangent for use in a printed circuit board and which has excellent adhesion to a metal and scatters almost no resin when used for forming a prepreg by punching or cutting, the composition comprising a component (a): siloxane-modified polyimide, component (b): a compound containing 2 methylallyl groups and having the following formula (1) or a compound containing 3 allyl groups or 3 methylallyl groups and having the following formula (1A), and component (c): a compound containing at least 2 maleimide groups. wherein R is a hydrogen atom or methyl group.
    Type: Grant
    Filed: December 31, 2001
    Date of Patent: March 30, 2004
    Assignee: Tomegawa Paper Co., Ltd.
    Inventors: Takeshi Hashimoto, Masaharu Kobayashi, Takeshi Sato, Daisuke Orino
  • Patent number: 6713205
    Abstract: A sealing material for sealing the edges on at least one side of a solid polymer fuel cell separator is provided. This sealing material includes (A) an organopolysiloxane with at least two alkenyl groups bonded to silicon atoms within each molecule, (B) an organohydrogenpolysiloxane with at least two hydrogen atoms bonded to silicon atoms within each molecule, (C) a fumed silica with a specific surface area of 50 to 250 m2/g which has undergone surface treatment with at least two different surface treatment agents, and (D) an addition reaction catalyst. This sealing material displays excellent moldability, heat resistance and elasticity, has a compression set within air and within an acidic aqueous solution which can be suppressed to a low value, and produces an excellent seal, particularly in an acidic aqueous solution.
    Type: Grant
    Filed: April 16, 2002
    Date of Patent: March 30, 2004
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Noriyuki Meguriya, Yujiro Taira
  • Patent number: 6713186
    Abstract: An alcoholic fluoroalkyl-functional group containing organosiloxane based composition prepared is prepared by the controlled hydrolysis of at least one fluoroalkyl-functional group containing organosilane of formula I: R1—Y—(CH2)2SiHx(R2)y(OR)3−x−y  (I), in which R1 is a mono, oligo- or perfluorinated alkyl group having 1-9 C atoms or a mono-, oligo- or perfluorinated aryl group, Y is a CH2, O or S group, R2 and R are each independently a linear, branched or cyclic alkyl group having 1-8 C atoms or an aryl group and x=0, 1 or 2 and y=0, 1 or 2, where (x+y)≦2, at a temperature in the range of 0-120° C. over a period of 0.5-24 hours and with thorough mixing in an w alcoholic medium which contains water and a weak mono- or polybasic acid or a weak base or a weak mono- or polybasic acid and a weak base or an acid or basic salt, the water employed and the alkoxysilane employed being in a molar ratio of 2-500:1.
    Type: Grant
    Filed: October 11, 2000
    Date of Patent: March 30, 2004
    Assignee: Degussa AG
    Inventors: Peter Jenkner, Albert-Johannes Frings, Michael Horn, Eckhard Just, Jaroslaw Monkiewicz, Burkhard Standke
  • Patent number: 6709751
    Abstract: A layer comprising a stain resistant agent is formed on a treated surface of a ceramic product used with water so that a stain resistant treatment is applied to the treated surface. The stain resistant agent includes a silicon-containing functional group combining with the hydroxyl group present on the treated surface by dehydration or dehydrogenation. Consequently, a high stain resistant effect can be achieved from the ceramic product.
    Type: Grant
    Filed: September 26, 2001
    Date of Patent: March 23, 2004
    Assignee: Inax Corproation
    Inventors: Haruyuki Mizuno, Shigeo Imai, Masashi Miura, Kazuyoshi Iso, Hiroyuki Miyamoto, Takeshi Nishikawa, Shozo Yamamoto, Keisuke Yamamoto, Yoshiyuki Tsukada, Yasunobu Masu
  • Patent number: 6709753
    Abstract: A resin composition is provided comprising a silicone-modified epoxy or phenolic resin obtained by reacting an epoxy or phenolic resin having specific structural units with an organopolysiloxane. The modified epoxy or phenolic resin is such that after the modified epoxy or phenolic resin is cured alone or together with another epoxy resin and/or phenolic resin to form a cured product, the organopolysiloxane component does not form a phase separation structure in the cured product. The composition cures into a product having both the adherence, heat resistance and humidity resistance characteristic of epoxy or phenolic resins and the flexibility and impact resistance characteristic of silicone resins.
    Type: Grant
    Filed: February 22, 2002
    Date of Patent: March 23, 2004
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Tsuyoshi Honda, Toshio Shiobara, Tatsuya Kanamaru
  • Patent number: 6709756
    Abstract: An adhesive in the form of a liquid epoxy resin composition comprising (A) a liquid epoxy resin, (B) 20 to 90% by weight based on the entire composition of an inorganic filler having an average particle size from more than 1 &mgr;m to 20 &mgr;m and containing up to 1% by weight of a fraction of particles having a particle size of at least 45 &mgr;m and optionally, (C) a silicone-modified resin is suitable for bonding optical elements in optical devices.
    Type: Grant
    Filed: May 21, 2002
    Date of Patent: March 23, 2004
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Haruyoshi Kuwabara, Miyuki Wakao, Toshio Shiobara
  • Patent number: 6709754
    Abstract: Styrene resin films having been imparted antistatic properties to both film surfaces and good adhesion properties of the films to envelope paper, and a process for producing the same. In these styrene resin films, the surface tension of the front surface of the film base differs from the surface tension of the back surface owing to a hydrophilic treatment and modifiers having almost the same compositions are applied onto the respective surfaces each in an adequate weight.
    Type: Grant
    Filed: May 30, 2002
    Date of Patent: March 23, 2004
    Assignee: Asahi Kasei Kabushiki Kaisha
    Inventors: Kouichi Yasukata, Manabu Tanuma, Yoshiyuki Tazuke, Osamu Mizukami
  • Patent number: 6706812
    Abstract: Polyorganosiloxane mixtures are obtainable by reacting linear polysiloxanes containing Si—H-bonds with linear dihydroxypolysiloxanes and amino-functional silanes. The reaction is carried out in such a way that the resultant product mixture still contains Si—H— bonds and leads to crosslinked structures. The polysiloxane mixtures obtained are useful for hydrophobicizing fiber materials, especially nonwovens.
    Type: Grant
    Filed: October 17, 2002
    Date of Patent: March 16, 2004
    Assignee: Ciba Specialty Chemicals Corporation
    Inventors: Harald Chrobaczek, Ingo Görlitz, Erich Rössler, Mark Oelschläger