Abstract: The present invention provides a coating type reinforcement composition of sheet metal which can be applied under warming for ensuring satisfactory levels of tensile rigidity and resistance to dent of a thin sheet metal mainly due to weight reduction of an automobile body, or for collision safety, and which improve a bending strength and a rigidity of the sheet metal without causing a distortion to the sheet metal. The coating type reinforcement composition of sheet metal according to the present invention comprises a liquid epoxy resin, a latent curing agent and an inorganic filler having an aspect ratio (L/D) of 5 or higher, an amount of the inorganic filler contained being 20 to 50% by weight and the composition being a viscous preparation with a high viscosity.

Abstract: Low-cure powder coating compositions are disclosed. The compositions comprise a polyepoxide and a material having the structure wherein R1 is an organic radical having 6 to 25 carbon atoms; R2 is an organic radical having 1 to 20 carbon atoms; R3 and R4 are independently alkyl or phenyl groups having 1 to 8 carbon atoms; Z is oxygen or nitrogen, and when Z is oxygen R5 is absent and when Z is nitrogen R5 is hydrogen or is and n is 1 to 4. The material can optionally be reacted with an acidic hydrogen-containing compound. The compositions are curable without the use of crosslinking agents or accelerators. Methods for coating a substrate using these compositions, and substrates coated thereby, are also disclosed, as are additional catalysts useful for the same purpose.

Abstract: A polymer composition containing a specific silyl group-containing polymer, in which the maximum size of particles contained therein is 2 &mgr;m or less, and the number of particles having a size of 0.2 &mgr;m to 2 &mgr;m is 1,000 particles/ml or less. The composition may further contain a specific compound or at least one component selected from an organosilane represented by (R1)nSi(X)4-n, a hydrolyzate of the organosilane and a condensate of the organosilane. The composition is excellent in storage stability, high in hardness and excellent in mechanical strength such as wear resistance, so that a coating film having good taking-up properties even when no lubricant is contained, extremely smooth and having no difference in film thickness can be formed.

Abstract: The present invention provides a process for producing an epoxy resin composition for semiconductor encapsulation which, when used in encapsulation of a semiconductor chip, can minimize voids appearing in the semiconductor device obtained.

Abstract: A silicone rubber composition comprising (A) an organopolysiloxane having at least two aliphatic unsaturated groups, (B) finely divided silica, (C) a metal powder or an electrically conductive metal-plated powder, (D) an adhesive aid, and (E) a curing agent cures into silicone rubber having a low volumetric resistivity and a stable high conductivity, exhibiting improved adhesion to resin and metal substrates, and thus suitable as electrically conductive parts and electrical contacts in electrical equipment.

Abstract: A laminate is made by adhering at least one metal layer selected from the group consisting of copper and a copper alloy to a resin layer. A coating film of an azole-copper complex compound formed by a contact with an aqueous solution containing an azole compound in an range from 0.1 mass % to 15 mass % and an organic acid in a range from 1 mass % to 80 mass % is formed on the metal layer surface, and the metal layer adheres to the resin layer via the coating film of the azole-copper complex compound. Thereby, the present invention provides a laminate with improved adhesion between a surface of copper or a copper alloy and resin in a multilayered printed circuit board, and also a method of manufacturing the laminate.

Abstract: The present invention provides a polymeric material and a process for making the polymeric material. The polymeric material has adhesive and noise abatement properties over a broad temperature range. Further, the material is chip and corrosion resistant and provides metal panel reinforcement.

Abstract: A liquid epoxy resin composition includes (A) a liquid epoxy resin, (B) a curing agent, (C) a curing accelerator, (D) an inorganic filler, and (E) a silicone-modified resin resulting from addition reaction of an alkenyl-containing epoxy or phenolic resin with an organopolysiloxane, the liquid epoxy resin composition curing into a product having a Tg of 30-120° C. and a specific dynamic viscoelasticity behavior. The composition is adherent to silicon chips, the cured product is highly resistant to heat and thermal shocks, and the composition is useful as sealant for flip chip type semiconductor devices.

Abstract: A release layer on a substrate, substrates comprising said release layer, coating formulations which provide the release layer and methods for preparing the release layer to render surfaces non-adherent. The release layer comprises copolymers of an electron donor molecule and a maleamic-functional silicone having at least one maleamic acid group. The cure of the coating formulation is not inhibited by oxygen or basic materials.

Abstract: A flame-retardant epoxy resin composition includes an epoxy resin, a curing agent, and a metal hydroxide, wherein the curing agent as a phenolic resin (C) containing, in the molecular chain, structural units derived from a phenol (A) and structural units derived from an aromatic compound (B) other than the phenol (A), or the epoxy resin is a novolac epoxy resin CD) obtained by subjecting the phenolic hydroxyl groups of the phenolic resin (C) to etherification with glycidyl. The composition has a high degree of flame retardancy.

Abstract: Pressure sensitive adhesives and methods wherein the pressure sensitive adhesives include a silicone tackifying resin having no greater than about 1.5 wt-% Si—OH functional groups and a polydiorganosiloxane polyurea copolymer.

Abstract: A process for alignment of rod-like liquid crystal molecules comprises the steps of: forming an orientation layer for vertical alignment on a support; and forming a liquid crystal layer containing rod-like liquid crystal molecules on the orientation layer to align the rod-like liquid crystal molecules at an average inclined angle of 50 to 90°. The liquid crystal layer further contains a compound represented by the formula (I): (Hb—L1—Cy1—L2—)nCy2  (I) wherein Hb is an aliphatic group having 6 to 40 carbon atoms or an siloxanoxy group substituted with an aliphatic group having 6 to 40 carbon atoms, each of L1 and L2 is a single bond or a divalent linking group, Cy1 is a divalent aromatic group or a divalent heterocyclic group, n is 2, 3 or 4, and Cy2 is an n-valent aromatic group or an n-valent heterocyclic group.

Abstract: An electrostatic adsorption device has a dielectric layer, electrodes, a cooling member and an insulating adhesive. The dielectric layer is made of a ceramic dielectric material and has an adsorption face and a back face. The electrodes are provided on the back face of the dielectric layer and gaps are defined between the portions of the electrodes. The insulating adhesive is provided between the back face of the dielectric layer and the cooling member. The insulating adhesive covers the electrodes and the back face and is provided in the gaps.

Abstract: Storage stable, UV curable, NIR transparent, polycondensates and methods for the production thereof by condensation of one or more silanediols of formula (I) and/or derived precondensates thereof with one or more silanes of formula (II) and/or derived precondensates thereof At least one of the aromatic groups Ar1 or Ar2 bears a cross-linkable functional group. The polycondensates are curable by crosslinking.

Abstract: A hydrido-silicone is incompletely reacted with (preferably) a long chain olefin under hydrosilylation conditions to produce a partially substituted hydrido-silicone that is further reacted under hydrosilylation conditions with a vinyl containing MQ resin to partially consume the remaining hydride species which is then reacted under hydrosilylation conditions to consume the remaining hydride species with a long chain diolefin to produce a composition that is useful as an anti-mist agent in the coating of flexible supports.

Abstract: The invention features a polyamine epoxide adduct, prepared by admixing a source of epoxy group with a polyamine, and allowing the epoxy groups to react with the terminal amino groups of the polyamine so as to form the polyamine epoxy adduct. The polyamine epoxide adduct of the invention can be used as a component for preparing a polyurea polymer, thereby providing the resulting polyurea polymer with improved adhesiveness and greater chemical resistance to acidic conditions. Polyurea polymer coatings prepared from polyamine epoxide adducts demonstrate better chemical resistance and adhesion when applied to substrates than do conventionally prepared polyurea formulations.

Abstract: A curable composition comprising (A) an organopolysiloxane having functional groups capable of condensation reaction at both molecular terminals thereof and (B-1) a hydrophobic silica and a hydrophilic silica. A curable composition comprising (A) an organopolysiloxane having functional groups capable of condensation reaction at both molecular terminals thereof and (B-2) a hydrophobic silica, wherein the hydrophobic silica (B-2) is thermally treated together with the organopolysiloxane (A).

Abstract: Protective overlays comprising an at least partially cured overlay thermosettable resin and a substituted polysiloxane. Method for forming a protective overlay on a substrate to protect the substrate comprising (a) providing a substrate having at least one surface, (b) applying to at least part of the surface an overlay thermosettable resin, (c) applying to at least part of the surface a substituted polysiloxane, wherein at least a portion of the overlay thermosettable resin and at least a portion of the polysiloxane are applied to the same part of the surface and then (d) at least partially curing the overlay thermosettable resin. Decorative laminates comprising (a) a decorative inner layer having at least one decorative surface and (b) an overlay layer disposed on at least a portion of the decorative surface wherein the overlay layer comprises an at least partially cured overlay thermosettable resin and a substituted polysiloxane.

Abstract: An electrode-forming composition comprising a binder component containing a solvent-soluble polyimide silicone and an epoxy compound, and an electrically conductive material can be cured and bonded to a current collector at a relatively low temperature and has excellent adhesion and chemical resistance, facilitating the manufacture of lithium ion batteries and electrical double-layer capacitors of various shapes.

Abstract: Epoxy resin compositions comprising (A) an epoxy resin having an epoxy equivalent of at least 185 and possessing a structure in which two benzene rings can be directly conjugated, carbon atoms having an sp2 type atomic orbital accounting for at least 50% of all the carbon atoms, (B) a &bgr;-naphthol type phenolic resin curing agent, (C) a curing accelerator, and (D) an inorganic filler cure into products having satisfactory solder crack resistance on use of lead-free solder and improved flame retardance despite the absence of halogenated epoxy resins and antimony compounds and are thus suited for semiconductor encapsulation.